Interconnect structure using a Al2 Cu for an integrated circuit chip

Claim 2

An interconnect structure for an integrated circuit chip for resisting electromigration as high current densities pass through interlayer contact regions of said interconnect structure comprising: a first patterned interconnect layer including a first metal selected from the group consisting of copper, copper alloys, aluminum and aluminum alloys formed over a first insulation layer and over first electrical contact regions passing through said first insulation layer, a second insulation layer formed over said first patterned interconnect layer and said first insulation layer, said second insulation layer having openings therein with second electrical contact, regions therein for making electrical contact with said first patterned interconnect layer, and a second patterned interconnect layer including a second metal selected from the group consisting of copper, copper alloys, aluminum and aluminum alloys formed over said second insulation layer and over said second electrical contact regions, said second electrical contact regions comprising substantially the compound Al 2 Cu in the theta phase, wherein said first patterned interconnect layer further includes a lower layer of TiAl 3 .

Claim 3

The interconnect structure for an integrated circuit chip for resisting electromigration as high current densities pass through interlayer contact regions of said interconnect structure comprising: a first patterned interconnect layer including a first metal selected from the group consisting of copper, copper .alloys, aluminum and aluminum alloys formed over a first insulation layer and over first electrical contact regions passing through said first insulation layer, a second,insulation layer formed over said first patterned interconnect layer and said first insulation layer, said second insulation layer having openings therein with second electrical contact regions therein for making electrical contact with said first patterned interconnect layer, and a second patterned interconnect layer including a second metal selected from the group consisting of copper, copper alloys, aluminum and aluminum alloys formed over said second insulation layer and over said second electrical contact regions, said second electrical contact regions comprising substantially the compound Al 2 Cu in the theta phase, wherein said first patterned interconnect layer further includes a top layer of TiAl 3 .

Claim 4

The interconnect structure for an integrated circuit chip for resisting electromigration as high current densities pass through interlayer contact regions of said interconnect structure comprising: a first patterned interconnect layer including a first metal selected from the group consisting of copper, copper .alloys, aluminum and aluminum alloys formed over a first insulation layer and over first electrical contact regions passing through said first insulation layer, a second,insulation layer formed over said first patterned interconnect layer and said first insulation layer, said second insulation layer having openings therein with second electrical contact regions therein for making electrical contact with said first patterned interconnect layer, and a second patterned interconnect layer including a second metal selected from the group consisting of copper, copper alloys, aluminum and aluminum alloys formed over said second insulation layer and over said second electrical contact regions, said second electrical contact regions comprising substantially the compound Al 2 Cu in the theta phase, wherein said first patterned interconnect layer further includes a top layer of TiAl 3 .

Claim 5

The interconnect structure for an integrated circuit chip for resisting electromigration as high current densities pass through interlayer contact regions of said interconnect structure comprising: a first patterned interconnect layer including a first metal selected from the group consisting of copper, copper alloys, aluminum and aluminum alloys formed over a first insulation layer and over first electrical contact regions passing through said first insulation layer, a second insulation layer formed over said first patterned interconnect layer and said first insulation layer, said second insulation layer having openings therein with second electrical contact regions therein for making electrical contact with said first patterned interconnect layer, and a second patterned interconnect layer including a second metal selected from the group consisting of copper, copper alloys, aluminum and aluminum alloys formed over said second insulation layer and over said second electrical contact regions, said second electrical contact regions comprising substantially the compound Al 2 Cu in the theta phase, wherein said second patterned interconnect layer further includes a bottom layer of TiAl 3 .

Claim 6

The interconnect structure for an integrated circuit chip for resisting electromigration as high current densities pass through interlayer contact regions of said interconnect structure comprising: a first patterned interconnect layer including a first metal selected from the group consisting of copper, copper alloys, aluminum and aluminum alloys formed over a first insulation layer and over first electrical contact regions passing through said first insulation layer, a second insulation layer formed over said first patterned interconnect layer and said first insulation layer, said second insulation layer having openings therein with second electrical contact regions therein for making electrical contact with said first patterned interconnect layer, and a second patterned interconnect layer including a second metal selected from the group consisting of copper, copper alloys, aluminum and aluminum alloys formed over said second insulation layer and over said second electrical contact regions, said second electrical contact regions comprising substantially the compound Al 2 Cu in the theta phase, wherein said second patterned interconnect layer further includes a bottom layer of TiAl 3 .