Hybrid integrated circuit

Claim 2

A hybrid integrated circuit comprising: a metallic substrate: first and second metal plates; said first metal plate being mounted on said metallic substrate; said second metal plate shaped substantially as a step and having an upper step portion and a lower step portion; said lower step portion being mounted on said metallic substrate; said upper step portion of said second metal plate disposed above a portion of said first metal plate. said upper step portion having an opening above a part of said portion of said first metal plate; said upper step portion of said second metal plate having a control pattern thereon; said first metal plate having means for mounting a switching element; said switching element being arranged on said part of said portion of said first metal plate below said opening such that a plurality of connections between said switching element and said control pattern are of equal length, through said opening; means for encasing said metallic substrate, said plurality of switching elements, said first and said second metal plates, and said plurality of connections; said first and said second metal plates each including an end extending said first and said second metal plates beyond said means for encasing.

Claim 3

A hybrid integrated circuit comprising: a metallic substrate; first, second, and third metal plates; said first metal plate being mounted on said metallic substrate; said second metal plate shaped substantially as a step and having an upper step portion and a lower step portion; said lower step portion being mounted on said metallic substrate; said upper step portion of said second metal plate above said first metal plate and having an opening above said first metal plate; said upper step portion of said second metal plate having a first control pattern thereon; said first metal plate having means for mounting a first switching element; said first switching element being arranged on said first metal plate below said opening; said third metal plate above a part of said lower step portion of said second metal plate; said third metal plate having a second control pattern thereon; said lower step portion of said second metal plate having means for mounting a second switching element; said second switching element being arranged on said lower step portion such that a plurality of connections made between said second switching element and said second control patten of said third metal plate are of equal length; means for encasing said metallic substrate, said first and second switching elements, said first, said second and said third metal plates, and said connections; said first, second and third metal plates including first, second and third protrusions, respectively; and said first, second and third protrusions extending beyond said means for encasing.

Claim 4

A hybrid integrated circuit comprising: a metallic substrate; first, second, and third metal plates; said first metal plate being mounted on said metallic substrate; said second metal plate shaped substantially as a step and having an upper step portion and a lower step portion; said lower step portion being mounted on said metallic substrate; said upper step portion of said second metal plate above said first metal plate and having an opening above said first metal plate; said upper step portion of said second metal plate having a first control pattern thereon; said first metal plate having means for mounting a first switching element; said first switching element being arranged on said first metal plate below said opening; said third metal plate above a part of said lower step portion of said second metal plate; said third metal plate having a second control pattern thereon; said lower step portion of said second metal plate having means for mounting a second switching element; said second switching element being arranged on said lower step portion such that a plurality of connections made between said second switching element and said second control patten of said third metal plate are of equal length; means for encasing said metallic substrate, said first and second switching elements, said first, said second and said third metal plates, and said connections; said first, second and third metal plates including first, second and third protrusions, respectively; and said first, second and third protrusions extending beyond said means for encasing.

Claim 5

A hybrid integrated circuit according to claim 2, wherein: said first metal plate and said lower step portion of said second metal plate are in a same plane; and at least one of said first, second, and third protrusions are substantially perpendicular to said plane.

Claim 6

A hybrid integrated circuit comprising: a metallic substrate; first, second and third copper plates said first copper plate and at least a portion of said second copper plate being mounted on said metallic substrate and defining a plane; said third copper plate being disposed above said plane by a predetermined distance and overlaps said second copper plate; a source-side switching element disposed on said first copper plate; a sink-side switching element disposed on said portion of said second copper plate being mounted on said metallic substrate; means for connecting said source-side switching element, said sink-side switching element and said first, second and third copper plates in a predetermined pattern; means for encasing said metallic substrate, said source-side switching element, said sink-side switching element, said first, second and third copper plates, and said means for connecting; said first and said third copper plates including first and third protrusions, respectively, which extend beyond a periphery of said means for encasing; said second copper plate including a second protrusion substantially perpendicular to said plane and extending beyond a top surface of said means for encasing; and each of said first, second and third protrusions including means for connecting the respective protrusion to external circuits; said second copper plate having an overlapping surface which is not part of said portion of said second copper plate being mounted on said substrate; said overlapping surface being disposed above said first copper plate; said overlapping surface having an opening through which portions of said source-side switching element are exposed; a first control pattern disposed on said overlapping surface around said opening; said means for connecting including means for uniformly connecting said source-side switching element to said control pattern; a second control pattern disposed on said third copper plate; and said means for connecting including means for linking said sink-side switching element to said second control pattern.

Claim 7

A hybrid integrated circuit comprising: a metallic substrate; first, second and third copper plates said first copper plate and at least a portion of said second copper plate being mounted on said metallic substrate and defining a plane; said third copper plate being disposed above said plane by a predetermined distance and overlaps said second copper plate; a source-side switching element disposed on said first copper plate; a sink-side switching element disposed on said portion of said second copper plate being mounted on said metallic substrate; means for connecting said source-side switching element, said sink-side switching element and said first, second and third copper plates in a predetermined pattern; means for encasing said metallic substrate, said source-side switching element, said sink-side switching element, said first, second and third copper plates, and said means for connecting; said first and said third copper plates including first and third protrusions, respectively, which extend beyond a periphery of said means for encasing; said second copper plate including a second protrusion substantially perpendicular to said plane and extending beyond a top surface of said means for encasing; and each of said first, second and third protrusions including means for connecting the respective protrusion to external circuits; said second copper plate having an overlapping surface which is not part of said portion of said second copper plate being mounted on said substrate; said overlapping surface being disposed above said first copper plate; said overlapping surface having an opening through which portions of said source-side switching element are exposed; a first control pattern disposed on said overlapping surface around said opening; said means for connecting including means for uniformly connecting said source-side switching element to said control pattern; a second control pattern disposed on said third copper plate; and said means for connecting including means for linking said sink-side switching element to said second control pattern.

Claim 8

A hybrid integrated circuit according to claim 4, further comprising a capacitor connected between said first and second metal plates.