Isolated package for multiple semiconductor power components

Claim 2

A circuit package for a plurality of isolated power switching semiconductor components each having a pair of main electrodes and a gate electrode for controlling conduction between the main electrodes, said package comprising: an electrically insulating thermally conductive substrate; a plurality of pairs of main terminals overlaid and bonded on said substrate; a plurality of gate terminals bonded on said substrate; each power switching semiconductor component being bonded to a respective ones of said main terminals for connection to the respective main electrode, the other main electrode being connected to the other main terminal by a jumper, and the gate electrode being connected to said gate terminal by an electrically conductive jumper strap extending therebetween, wherein: each of said main terminals and gate terminals includes a substrate portion extending along said substrate, and a lead frame portion integral with said substrate portion and bent to extend away from said substrate; each pair of main terminals and its respective gate terminal forms a set; said lead frame portions of said first main terminals of said pair extend generally from a first peripheral edge of said substrate; said lead frame portions of said second main terminals of said pair extend generally from a second peripheral edge of said substrate opposite said first edge; said lead frame portions of third terminals of said sets extend from said substrate between said first and second opposing edges; each said substrate portion of said second terminals of said sets has a first section at said second peripheral edge and a second section extending normal thereto and towards said first peripheral edge around and isolated from said substrate portion of said third terminal between said peripheral edges, said substrate portion of said second terminal having an extended configuration with an open central section in which said third terminal is bonded to said substrate and isolated from said second terminal; the end of the extended substrate portion of said second terminal is disposed between the substrate portions of said first and third terminals wherein said power switching semiconductor component is bonded to said end of said extended substrate portion of said second terminal, said electrically conductive jumper straps connecting said semiconductor component to said first and third terminals, wherein each of said main terminals is bent along a bending line parallel to said first and second peripheral edges.

Claim 3

A circuit package for a plurality of electrically isolated power switching semiconductor components each having a pair of main electrodes and a gate electrode for controlling conduction between the main electrodes, said package comprising: an electrically insulating thermally conductive substrate; a plurality of pairs of main terminals overlaid and bonded on said substrate; the first terminal of each pair having a bonding pad portion for attachment to said substrate and an integral lead frame portion bent away from said substrate; the second main terminal of each pair having a bonding pad portion for attachment to said substrate with an open central section exposing said substrate, and an integral lead frame portion bent away from said substrate; said lead frame portions of said first main terminals of said pairs extending generally from a first peripheral edge of said substrate; said lead frame portions of said second main terminals of said pairs extending generally from a second peripheral edge of said substrate opposite said first edge; a plurality of gate terminals each having a bonding pad portion attached to a respective said exposed section of said substrate in said central open section of said bonding pad portion of its respective said second main terminal, and including an integral lead frame portion extending from said substrate; a plurality of power switching semiconductor components each bonded to the end portion of the respective said second main terminal bonding pad portion between said first main terminal bonding pad portion and said gate terminal bonding pad portion for connection to the respective main electrode, the other respective main electrode being connected to said first terminal bonding pad portion by an electrically conductive jumper strap extending therebetween, and the respective gate electrode being connected to said gate terminal bonding pad portion by another electrically conductive jumper strap extending therebetween, wherein: laterally outward pairs of said main terminals have identical but mirror image configurations, and a central pair has a different configuration; said second main terminal bonding pad portion of the laterally outward pairs of said main terminals have an open loop C-shaped configuration, and the respective said gate terminal bonding pad portions are attached to said substrate in the middle of said C and isolated from said second main terminal bonding pad portions; said second main terminal bonding pad portion of a central pair of main terminals has a closed loop generally O-shaped configuration, and the respective gate terminal bonding pad portion is attached to said substrate within said O and isolated from said second main terminal bonding pad portion, wherein each of said main terminals is bent along a bending line parallel to said first and second peripheral edges.

Claim 4

A circuit package for a plurality of electrically isolated power switching semiconductor components each having a pair of main electrodes and a gate electrode for controlling conduction between the main electrodes, said package comprising: an electrically insulating thermally conductive substrate; a plurality of pairs of main terminals overlaid and bonded on said substrate; the first terminal of each pair having a bonding pad portion for attachment to said substrate and an integral lead frame portion bent away from said substrate; the second main terminal of each pair having a bonding pad portion for attachment to said substrate with an open central section exposing said substrate, and an integral lead frame portion bent away from said substrate; said lead frame portions of said first main terminals of said pairs extending generally from a first peripheral edge of said substrate; said lead frame portions of said second main terminals of said pairs extending generally from a second peripheral edge of said substrate opposite said first edge; a plurality of gate terminals each having a bonding pad portion attached to a respective said exposed section of said substrate in said central open section of said bonding pad portion of its respective said second main terminal, and including an integral lead frame portion extending from said substrate; a plurality of power switching semiconductor components each bonded to the end portion of the respective said second main terminal bonding pad portion between said first main terminal bonding pad portion and said gate terminal bonding pad portion for connection to the respective main electrode, the other respective main electrode being connected to said first terminal bonding pad portion by an electrically conductive jumper strap extending therebetween, and the respective gate electrode being connected to said gate terminal bonding pad portion by another electrically conductive jumper strap extending therebetween, wherein: laterally outward pairs of said main terminals have identical but mirror image configurations, and a central pair has a different configuration; said second main terminal bonding pad portion of the laterally outward pairs of said main terminals have an open loop C-shaped configuration, and the respective said gate terminal bonding pad portions are attached to said substrate in the middle of said C and isolated from said second main terminal bonding pad portions; said second main terminal bonding pad portion of a central pair of main terminals has a closed loop generally O-shaped configuration, and the respective gate terminal bonding pad portion is attached to said substrate within said O and isolated from said second main terminal bonding pad portion, wherein each of said main terminals is bent along a bending line parallel to said first and second peripheral edges.