Heat-control process and apparatus for attachment/detachment of soldered components

Claim 2

A unitary vacuum/hot gas nozzle device for supporting an electrical component, having a meltable solder lead array on the undersurface thereof, in contact with or closely-spaced above a corresponding circuit array present on the surface of a printed circuit board, and for directing a continuous flow of hot gas from a gas source at a predetermined temperature and flow rate to circulate through said solder lead array and melt said solder leads uniformly and substantially simultaneously, said nozzle device comprising a housing having an upper wall section enclosing an internal hot gas chamber and a lower wall section enclosing a block member having a central component-supporting recess in the undersurface thereof, vacuum conduit means, through said housing and block member to said recess, to retain a said component within said recess, inlet means for receiving hot gas into said hot gas chamber, means for channeling the hot gas from said chamber to at least a portion of the outer periphery of said recess, a narrow hot gas orifice for directing said channeled hot gas horizontally in at least one direction through the meltable solder lead array on the undersurface of a component retained by said vacuum means within said recess, at least one hot gas outlet for venting the hot gas which has passed through said solder lead array, and a temperature sensing means associated with said outlet and with the gas source for actuating changes in the temperature or flow rate of the hot gas, to adjust the temperature or the flow rate of the hot gas through the meltable solder lead array and produce uniform and gradual melting thereof while the component is retained in said recess for the desired dwell time, with the solder lead array adjacent or bonded to a corresponding circuit array present on the surface of a printed circuit board.

Claim 3

A nozzle device according to claim 1 in which the temperature sensing means comprises a thermocouple electrically-connected with a computer means which is connected with a means for controlling the temperature and the flow rate of the hot gas from the gas source, to increase the temperature and reduce the flow rate of the hot gas through the nozzle device in response to a predetermined outlet gas temperature sensed by the thermocouple.

Claim 4

A nozzle device according to claim 2 in which said thermocouple is mounted on the lower wall section of the housing for support in the path of the hot gas exiting the hot gas outlet.

Claim 5

A nozzle device according to claim 3 in which the lower wall section of the housing, adjacent the hot gas outlet, comprises a deflector means for directing the path of hot gas exiting the gas outlet upwardly against said thermocouple.

Claim 6

A nozzle device according to claim 1 in which said housing has a top cone section having an inlet opening to said vacuum conduit means, and another inlet opening comprising said gas inlet means for receiving hot gas into said hot gas chamber.

Claim 7

A nozzle device according to claim 1 in which said vacuum conduit means terminates in a vacuum suction cup within said component-supporting recess, for vacuum engagement with said component.

Claim 8

A nozzle device according to claim 1 in which the lower wall section of the housing is of sufficient length to contact the upper surface of a printed circuit board, and the depth of the component-supporting recess is predetermined for each supported component so that the undersurface of the solder array thereof engages or is slightly spaced above the surface of the corresponding circuit array on the printed circuit board when said lower wall section is in contact with the surface of the printed circuit board.

Claim 9

A nozzle device according to claim 1 in which each said hot gas outlet comprises an opening in the lower wall section of the housing, spaced upwardly, away from a base of said wall section, for venting the hot gas upwardly away from the surface of a printed circuit board.

Claim 10

Process for controlling the uniform, substantially-simultaneous melting of the leads of a solder lead array present on the undersurface of an electrical component while said array is in contact with or spaced slightly above, or is bonded to a corresponding circuit array present on the surface of a printed circuit board, comprising supporting said component parallel to the printed circuit board surface with said solder lead array and said circuit array aligned in contact or slightly spaced, introducing a continuous flow of hot gas from a gas source through a narrow orifice gap and horizontally through said solder lead array in at least one direction, and exhausting said hot gas from said array through at least one hot gas outlet, sensing the temperature of said hot gas at said outlet, and adjusting the temperature or the flow rate of said hot gas from the gas source through said solder lead array at a predetermined temperature below the melting point of the solder, for the necessary dwell time to produce the desired uniform and simultaneous melting of said solder lead array and permit bonding to or separation from the circuit array on said printed circuit board while said component is supported parallel to the surface of the printed circuit board.

Claim 11

Process for controlling the uniform, substantially-simultaneous melting of the leads of a solder lead array present on the undersurface of an electrical component while said array is in contact with or spaced slightly above, or is bonded to a corresponding circuit array present on the surface of a printed circuit board, comprising supporting said component parallel to the printed circuit board surface with said solder lead array and said circuit array aligned in contact or slightly spaced, introducing a continuous flow of hot gas from a gas source through a narrow orifice gap and horizontally through said solder lead array in at least one direction, and exhausting said hot gas from said array through at least one hot gas outlet, sensing the temperature of said hot gas at said outlet, and adjusting the temperature or the flow rate of said hot gas from the gas source through said solder lead array at a predetermined temperature below the melting point of the solder, for the necessary dwell time to produce the desired uniform and simultaneous melting of said solder lead array and permit bonding to or separation from the circuit array on said printed circuit board while said component is supported parallel to the surface of the printed circuit board.

Claim 12

Process according to claim 9 which comprises sensing the hot gas temperature at the hot gas outlet by means of a thermocouple electrically-connected to a control means which is connected with a means for heating the gas from said gas source, and with a means for controlling the flow rate of the gas from said gas source, to automatically increase the temperature and reduce the flow rate of the hot gas through the solder lead array in response to a predetermined temperature sensed at the hot gas outlet.

Claim 13

Process according to claim 9 which comprises supporting said electrical component by means of vacuum within a recess enclosure surrounded by peripheral walls.

Claim 14

Process according to claim 11 comprising engaging said peripheral walls with the surface of the printed surface board to retain the supported component uniformly spaced from the surface of the printed circuit board during melting of the solder lead array, thereby preventing crushing of the solder lead array.

Claim 15

Process according to claim 9 which comprises locating each said hot gas outlet upwardly away from the surface of the printed circuit board to direct the hot outlet gas away from adjacent electrical components present on the printed circuit board.

Claim 16

Process according to claim 9 which comprises locating an upwardly inclined deflector wall at the exit of each said hot gas outlet to deflect the path of the hot gas from said outlet upwardly, away from the surface of the printed circuit board.

Claim 17

A soldering/desoldering apparatus comprising a means for supplying a continuous flow of gas, flow rate-regulating means for said gas, heater means for said gas, means for controlling said flow rate-regulating and said heater means, and a unitary vacuum/hot gas nozzle device for supporting an electrical component, having a meltable solder lead array on the undersurface thereof, in contact with or closely-spaced above a corresponding circuit array present on the surface of a printed circuit board, and for directing a continuous flow of said gas from said supply means at a predetermined temperature and flow rate to circulate through said solder lead array and melt said solder leads uniformly and substantially simultaneously, said nozzle device comprising a housing having an upper wall section enclosing an internal hot gas chamber and a lower wall section enclosing a block member having a central component-supporting recess in the undersurface thereof, vacuum conduit means, through said housing and block member to said recess, to retain a said component within said recess, inlet means for receiving the hot gas into said hot gas chamber, means for channeling the hot gas from said chamber to at least a portion of the outer periphery of said recess, a narrow hot gas orifice for directing said channeled hot gas horizontally in at least one direction through the meltable solder lead array on the undersurface of a component retained by said vacuum means within said recess, at least one hot gas outlet for venting the hot gas which has passed through said solder lead array, and a temperature sensing means associated with said outlet and with said control means for automatically actuating said flow regulating means and said heater means, to adjust the temperature or the flow rate of hot gas through the meltable solder lead array at a predetermined sensed temperature below the melting temperature of the solder lead array, to produce uniform and gradual melting thereof while the component is retained in said recess for the desired dwell time, with the solder lead array adjacent to or bonded to a corresponding circuit array present on the surface of a printed circuit board.

Claim 18

A soldering/desoldering apparatus comprising a means for supplying a continuous flow of gas, flow rate-regulating means for said gas, heater means for said gas, means for controlling said flow rate-regulating and said heater means, and a unitary vacuum/hot gas nozzle device for supporting an electrical component, having a meltable solder lead array on the undersurface thereof, in contact with or closely-spaced above a corresponding circuit array present on the surface of a printed circuit board, and for directing a continuous flow of said gas from said supply means at a predetermined temperature and flow rate to circulate through said solder lead array and melt said solder leads uniformly and substantially simultaneously, said nozzle device comprising a housing having an upper wall section enclosing an internal hot gas chamber and a lower wall section enclosing a block member having a central component-supporting recess in the undersurface thereof, vacuum conduit means, through said housing and block member to said recess, to retain a said component within said recess, inlet means for receiving the hot gas into said hot gas chamber, means for channeling the hot gas from said chamber to at least a portion of the outer periphery of said recess, a narrow hot gas orifice for directing said channeled hot gas horizontally in at least one direction through the meltable solder lead array on the undersurface of a component retained by said vacuum means within said recess, at least one hot gas outlet for venting the hot gas which has passed through said solder lead array, and a temperature sensing means associated with said outlet and with said control means for automatically actuating said flow regulating means and said heater means, to adjust the temperature or the flow rate of hot gas through the meltable solder lead array at a predetermined sensed temperature below the melting temperature of the solder lead array, to produce uniform and gradual melting thereof while the component is retained in said recess for the desired dwell time, with the solder lead array adjacent to or bonded to a corresponding circuit array present on the surface of a printed circuit board.

Claim 19

Apparatus according to claim 15 in which said control means comprises a computer which is programmed for the automatic actuation of said flow regulating means and said heater means in response to a signal from said temperature-sensing means.

Claim 20

Apparatus according to claim 15 in which said temperature-sensing means comprises a thermocouple.

Claim 21

Apparatus according to claim 15 in which the lower wall section of the nozzle device comprises a hot gas deflector means at the hot gas outlet for deflecting the hot outlet gas upwardly, away from the printed circuit board and against said temperature-sensing means.