US4767047A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Desoldering device
Assignee: The General Electric Company PLC
•
Filing: 1987-01-29
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Granted: 1988-08-30
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Expires: 2007-01-29
Abstract
Abstract A device for removing a component from a substrate to which it is secured by solder. The device has a moveable member which defines a space to which suction can be applied. The space has an opening which can be positioned against the component so as to hold the latter to the moveable member by suction. Provision is made for applying heat to the solder to soften it. The moveable member is arranged such that the suction causes it to pull the component so as to remove it from the substrate when the solder is molten.
Inventors
- 👤 Richard I. Todd
- 👤 Robert C. Claydon
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 13:02
CPC Classifications
B; B23; B23K; B23K1/00; B23K1/012; H; H05; H05K; H05K13/00; H05K13/04; H05K13/0486
Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
92 words
A device for removing a component from a substrate to which it is secured by solder including a moveable member defining a space to which suction can be applied, the space having an opening which can be positioned against the component so as to hold the latter to the moveable member by suction; and means for applying heat to the solder to soften it, the moveable member being arranged such that the suction causes it to pull the component so as to remove it from the substrate when the solder is molten.
Claim 2
Independent Claim
92 words
A device for removing a component from a substrate to which it is secured by solder including a moveable member defining a space to which suction can be applied, the space having an opening which can be positioned against the component so as to hold the latter to the moveable member by suction; and means for applying heat to the solder to soften it, the moveable member being arranged such that the suction causes it to pull the component so as to remove it from the substrate when the solder is molten.
Claim 3
Dependent Claim
33 words
A device according to claim 1 in which the means for applying heat includes an enclosure surrounding the moveable member and means for directing hot gas into the enclosure to soften the solder.
Claim 4
Dependent Claim
30 words
A device as claimed in claim 2 and wherein the enclosure includes a separable skirt portion which in operation encircles the component which is to be removed from the substrate.
Claim 5
Dependent Claim
25 words
A device as claimed in claim 3 and wherein the enclosure includes a flat platen adapted to co-operate with an upper rim of the skirt.
Claim 6
Dependent Claim
19 words
A device as claimed in claim 2 and wherein the enclosure is dimensioned so as to surround the component.
Claim 7
Dependent Claim
27 words
A device as claimed in claim 2 and wherein a baffle is mounted within said enclosure to prevent hot gas from being directed directly onto the component.
Claim 8
Dependent Claim
25 words
A device as claimed in claim 1 and wherein a visual indicator is provided to show when said component is lifted clear of said substrate.
Claim 9
Dependent Claim
29 words
A device as claimed in claim 1 and wherein the nozzle is arranged to automatically retract, and to thereby lift the component from the substrate as the solder melts.
References Cited (Backward Citations)
US3731867A
Cited
US4295596A
Cited
US4426571A
Cited
US4552300A
Cited
US4605152A
Cited
US4610388A
Cited
US4659004A
Cited
US4620659A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1991-08-30 | 1992-02-29 | 1992-08-30 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1995-08-30 | 1996-02-29 | 1996-08-30 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1999-08-30 | 2000-02-29 | 2000-08-30 | $7700.00 | Window Closed / Lapsed |