Vacuum die sensor apparatus and method for a semiconductor die bonding machine

Claim 2

In a semiconductor die-bonding apparatus wherein a die is picked up from a wafer of dice by a vacuum-energized probe, and transferred to a position adjacent a lead member to which the die is to be bonded and at which point it is intended that the die be deposited for bonding and the vacuum released, and indexing start means are provided for energizing an indexing motor to move the lead member containing the deposited and bonded dice to a subsequent position; means for preventing the indexing of said start means comprising means for sensing the presence of a dice on said probe; and photoelectric means responsive to the die presence condition on said probe for controlling the energization of said indexing start means.

Claim 3

The semiconductor die-bonding apparatus according to claim 1 wherein the means responsive to the die presence condition on said probe for controlling the energization of said indexing start means comprises relay means responsive to the condition of the photo-electric means for controlling the circuit of the indexing start means.

Claim 4

The semiconductor die-bonding apparatus according to claim 1 wherein the light of the photoelectric means is controlled by vacuum operated means.

Claim 5

The semiconductor die-bonding apparatus according to claim 3 wherein the vacuum operated means is a plunger movable in response to the presence of a vacuum.

Claim 6

The semiconductor die-bonding apparatus according to claim 4 wherein the plunger, when activated by the presence of a vacuum, blocks the passage of light and the indexing start means is prevented from becoming energized.

Claim 7

The semiconductor die-bonding apparatus according to claim 5 wherein the plunger, when inactivated by the lack of a vacuum, permits the passage of light and the indexing start means is enabled to become energized.

Claim 8

In a semiconductor die-bonding apparatus wherEin a die is picked up from a wafer of dice by a vacuum energized probe, and transferred to a position adjacent a lead member to which the die is to be bonded, and at which point it is intended that the die be deposited for bonding and the vacuum released, and indexing start means are provided for energizing an indexing motor to move a lead member containing the deposited and bonded dice to a subsequent position; means for preventing the indexing of said start means said start means comprising a vacuum line adapted to be connected to said probe at one end and to a vacuum source at the other end; valve means in said vacuum line for controlling the application of vacuum to and the removal of vacuum from said probe; said valve means comprising a vertically disposed clear tube and an opaque plunger freely movable in said tube; said plunger being adapted to move upwardly under the influence of applied vacuum and being adapted to move downwardly under the influence of gravity when said vacuum is released; means for applying vacuum to said vacuum line when said probe is about to pick up a die and if a die is picked up, said probe end is blocked whereupon said plunger moves to and remains in its downward position; photoelectric means including a light source on one side of said clear tube adjacent the upper end thereof and a light sensitive device on the other side of said clear tube adjacent the upper end thereof and being adapted to receive the light from said light source; means for sensing for the presence of a die at the end of said probe when said probe is in the stage of depositing a die on a lead member comprising a control circuit; switch means adapted be closed in response to the position of said probe for effecting energization of said control circuit; and said control circuit functioning when no die is at said probe and said plunger is at the top of said clear tube blocking the transmission of light to prevent energization of said index start means and functioning when a die is at said probe and said plunger is at the bottom of said clear tube permitting the transmission of light to effect energization of said index start means.

Claim 9

In a semiconductor die-bonding apparatus wherEin a die is picked up from a wafer of dice by a vacuum energized probe, and transferred to a position adjacent a lead member to which the die is to be bonded, and at which point it is intended that the die be deposited for bonding and the vacuum released, and indexing start means are provided for energizing an indexing motor to move a lead member containing the deposited and bonded dice to a subsequent position; means for preventing the indexing of said start means said start means comprising a vacuum line adapted to be connected to said probe at one end and to a vacuum source at the other end; valve means in said vacuum line for controlling the application of vacuum to and the removal of vacuum from said probe; said valve means comprising a vertically disposed clear tube and an opaque plunger freely movable in said tube; said plunger being adapted to move upwardly under the influence of applied vacuum and being adapted to move downwardly under the influence of gravity when said vacuum is released; means for applying vacuum to said vacuum line when said probe is about to pick up a die and if a die is picked up, said probe end is blocked whereupon said plunger moves to and remains in its downward position; photoelectric means including a light source on one side of said clear tube adjacent the upper end thereof and a light sensitive device on the other side of said clear tube adjacent the upper end thereof and being adapted to receive the light from said light source; means for sensing for the presence of a die at the end of said probe when said probe is in the stage of depositing a die on a lead member comprising a control circuit; switch means adapted be closed in response to the position of said probe for effecting energization of said control circuit; and said control circuit functioning when no die is at said probe and said plunger is at the top of said clear tube blocking the transmission of light to prevent energization of said index start means and functioning when a die is at said probe and said plunger is at the bottom of said clear tube permitting the transmission of light to effect energization of said index start means.

Claim 10

The semiconductor die-bonding apparatus according to claim 7 wherein said control circuit comprises a transistor whose state of conduction is determined by the light receiving condition of said light sensitive means.

Claim 11

The control circuit according to claim 8 wherein the conduction state of said transistor is controlled by the energization of the base of said transistor determined by the light receiving condition of said light sensitive means.