Patent US5529959A successfully refreshed from Google Patents.
US5529959A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Charge-coupled device image sensor
Assignee: Sony Corp
•
Filing: 1995-02-22
•
Granted: 1996-06-25
•
Expires: 2015-02-22
Abstract
Abstract A charge-coupled device image sensor has a base of resin having a mount area on an upper surface with a charge-coupled device chip being connected to the mount area, leads mounted on the base and connected to the charge-coupled device chip through bonding wires, and a cover of resin joined to the upper surface of the base and having a downwardly open recess housing the charge-coupled device chip and the bonding wires. The leads include respective inner leads having respective joints connected to the bonding wires, the inner leads having portions, except the joints, embedded in the base, and respective outer leads extending from the inner leads.
Inventors
- 👤 Hideo Yamanaka
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 11:16
CPC Classifications
H; H10; H10F; H10F39/00; H10F39/80; H10F39/806; H10F39/10; H10F39/12; H10F39/804; H10F77/00; H10F77/50; H10W; H10W70/00; H10W70/40; H10W70/479; H10W70/60; H10W70/67; H10W70/68; H10W76/00; H10W76/10; H10W76/12; H10W76/15; H10W76/157; H10W95/00; H10F39/011; H10F39/805; H10W70/62; H10W70/65; H10W70/654; H10W70/655; H10W72/00; H10W72/50; H10W72/551; H10W72/552; H10W72/5524; H10W90/00; H10W90/701; H10W90/751; H10W90/756; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
111 words
A method of manufacturing a charge-coupled device image sensor having a thermoplastic resin base, a charge-coupled device chip mounted on an upper surface of said base, and a thermoplastic resin cover having a frame mounted on said base in covering relationship to said charge-coupled device chip, said method comprising the steps of: molding a thermoplastic resin base having a lead frame embedded therein and having inner leads exposed on an upper surface of the base; placing a charge-coupled device chip on said base; connecting said inner leads to said charge-coupled device chip with bonding wires; and joining a frame of a thermoplastic resin cover to a peripheral edge of said base.
Claim 2
Independent Claim
111 words
A method of manufacturing a charge-coupled device image sensor having a thermoplastic resin base, a charge-coupled device chip mounted on an upper surface of said base, and a thermoplastic resin cover having a frame mounted on said base in covering relationship to said charge-coupled device chip, said method comprising the steps of: molding a thermoplastic resin base having a lead frame embedded therein and having inner leads exposed on an upper surface of the base; placing a charge-coupled device chip on said base; connecting said inner leads to said charge-coupled device chip with bonding wires; and joining a frame of a thermoplastic resin cover to a peripheral edge of said base.
Claim 3
Dependent Claim
26 words
The method of claim 1, wherein said step of joining a frame of a thermoplastic resin cover comprises ultrasonically fusing the frame to said peripheral edge.
Claim 4
Dependent Claim
29 words
The method of claim 1, wherein said step of joining a frame of a thermoplastic resin cover comprises fusing the frame to said peripheral edge with a laser beam.
Claim 5
Dependent Claim
29 words
The method of claim 1, wherein said step of joining a frame of a thermoplastic resin cover comprises fusing the frame to said peripheral edge with an ultraviolet-curing adhesive.
Claim 6
Independent Claim
116 words
A method of manufacturing a charge-coupled device image sensor having a thermosetting resin base, a charge-coupled device chip mounted on an upper surface of said base, and a thermosetting resin cover having a frame mounted on said base in covering relationship to said charge-coupled device chip, said method comprising the steps of: molding a thermosetting resin base having a lead frame embedded therein and having inner leads exposed on an upper surface of the base; placing a charge-coupled device chip on said base; connecting said inner leads to said charge-coupled device chip with bonding wires; and joining a frame of a cover of thermosetting resin to a peripheral edge of said base with an ultraviolet-curing adhesive.
Claim 7
Independent Claim
116 words
A method of manufacturing a charge-coupled device image sensor having a thermosetting resin base, a charge-coupled device chip mounted on an upper surface of said base, and a thermosetting resin cover having a frame mounted on said base in covering relationship to said charge-coupled device chip, said method comprising the steps of: molding a thermosetting resin base having a lead frame embedded therein and having inner leads exposed on an upper surface of the base; placing a charge-coupled device chip on said base; connecting said inner leads to said charge-coupled device chip with bonding wires; and joining a frame of a cover of thermosetting resin to a peripheral edge of said base with an ultraviolet-curing adhesive.
Claim 8
Dependent Claim
26 words
The method of claim 5, wherein said step of joining a frame of a thermosetting resin cover comprises ultrasonically fusing the frame to said peripheral edge.
Claim 9
Dependent Claim
29 words
The method of claim 5, wherein said step of joining a frame of a thermosetting resin cover comprises fusing the frame to said peripheral edge with a laser beam.
Claim 10
Dependent Claim
29 words
The method of claim 5, wherein said step of joining a frame of a thermoplastic resin cover comprises fusing the frame to said peripheral edge with an ultraviolet-curing adhesive.
References Cited (Backward Citations)
US4400870A
Cited
US4685200A
Cited
US5070041A
Cited
US5073521A
Cited
US5250469A
Cited
US5173147A
Cited
US5343076A
Cited
US5194695A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-06-25 | 1999-12-25 | 2000-06-25 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-06-25 | 2003-12-25 | 2004-06-25 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-06-25 | 2007-12-25 | 2008-06-25 | $7700.00 | Window Closed / Lapsed |