Abstract A technique for enclosing microelectronic circuit elements in hermetically sealed packages comprising a planar ceramic substrate with a box-like ceramic cover sealed thereto by a fused glass coating. The glass sealant is applied to the substrate in the form of a paste which thereafter is fired at high temperature and cooled to produce a smooth glass coating. With the cover in place on the substrate, the glass coating is remelted by heat developed by infra-red radiation developed by four line-focussed radiant heaters at the four sides of the package. The radiation of each heater is focussed at the interface line between the cover and the substrate. Because the radiant heat is concentrated along the interface line, unwanted heat transfer into the package is minimized, and the temperature is prevented from rising sufficiently to damage heat-sensitive elements. Upon removal of the radiant heat, the glass hardens in a condition of fusion and/or chemical bonding with the cover and substrate providing true hermetic sealing.
Inventors
👤 Delip R. Bokil
Bibliographic Details
Application Number—
JurisdictionUS
Data Sourcegoogle_patents
Last Synchronized2026-10-27 22:38
CPC Classifications
H; H10; H10P; H10P72/00; H10P72/04; H10P72/0441
Claims Analysis
Total Claims: 3
Claim 1
Independent Claim
151 words
The method of packaging temperature-sensitive microelectronic devices, including hybrid integrated circuits, supported on a rigid hermetic planar substrate, comprising the steps of: applying a meltable hermetic sealing material to a closed path defined by the interface between said substrate and a hermetic box-like cover surrounding the region for said microelectric devices; placing on said substrate said heremitic box-like cover having side walls aligned with and contacting said sealing material completely around said closed path; applying line-focused infra-red radiation onto the portions of both said substrate and said cover which are immediately adjacent the interface therebetween for a time sufficient to melt said sealing material to provide for interaction thereof with said substrate and said cover; sensing relative movement between said box-like cover and said substrate resulting from the melting of said sealing material; and removing said application of infra-red radiation in response to a sensed predetermined extent of said relative movement.
Claim 2
Independent Claim
151 words
The method of packaging temperature-sensitive microelectronic devices, including hybrid integrated circuits, supported on a rigid hermetic planar substrate, comprising the steps of: applying a meltable hermetic sealing material to a closed path defined by the interface between said substrate and a hermetic box-like cover surrounding the region for said microelectric devices; placing on said substrate said heremitic box-like cover having side walls aligned with and contacting said sealing material completely around said closed path; applying line-focused infra-red radiation onto the portions of both said substrate and said cover which are immediately adjacent the interface therebetween for a time sufficient to melt said sealing material to provide for interaction thereof with said substrate and said cover; sensing relative movement between said box-like cover and said substrate resulting from the melting of said sealing material; and removing said application of infra-red radiation in response to a sensed predetermined extent of said relative movement.
Claim 3
Dependent Claim
35 words
The method of claim 1 wherein said line-focused infra-red radiation is applied by simultaneously applying said radiation only to the portions of both said substrate and said cover which are immediately adjacent the interface therebetween.