Patent US5519176A successfully refreshed from Google Patents.
US5519176A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Substrate and ceramic package
Assignee: Sony Corp
•
Filing: 1994-04-05
•
Granted: 1996-05-21
•
Expires: 2014-04-05
Abstract
Abstract A substrate or a ceramic package for packaging semiconductor chips, which comprises an insulating layer having a signal line on one surface of said insulating layer and a power line or ground line corresponding to said signal line on the other surface of said insulating layer. A well-controlled constant high frequency characteristics, and particularly, characteristic impedance, can be obtained on the signal line without being influenced by the power line or ground line.
Inventors
- 👤 Thomas W. Goodman
- 👤 Hiroyuki Fujita
- 👤 Yoshikazu Murakami
- 👤 Arthur T. Murphy
- 👤 Daniel I. Amey
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 16:34
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/0213; H05K1/0237; H05K1/025; H05K1/0253; H10; H10W; H10W70/00; H10W70/60; H10W70/62; H10W70/65; H10W70/67; H10W70/68; H10W70/685; H05K1/0216; H05K1/0218; H05K1/0224; H05K1/0296; H05K1/0298; H05K1/03; H05K1/0306; H05K2201/00; H05K2201/09; H05K2201/09209; H05K2201/09218; H05K2201/09227; H05K2201/09654; H05K2201/09681; H05K3/00; H05K3/46; H05K3/4611; H05K3/4626; H05K3/4629; H10W70/682; H10W72/00; H10W72/071; H10W72/075; H10W72/07551; H10W72/07554; H10W72/50; H10W72/541; H10W72/547; H10W72/5473; H10W72/551; H10W72/552; H10W72/5522; H10W90/00; H10W90/701; H10W90/731; H10W90/737
Claims Analysis
Total Claims: 17
Claim 1
Independent Claim
60 words
A substrate comprising an insulating layer having a signal line on a first surface of said insulating layer and a conductive line on a second surface of said insulating layer, a position of the conductive line on the second surface of the insulating layer corresponding to a position of the signal line on the first surface of the insulating layer.
Claim 2
Dependent Claim
60 words
A substrate comprising an insulating layer having a signal line on a first surface of said insulating layer and a conductive line on a second surface of said insulating layer, a position of the conductive line on the second surface of the insulating layer corresponding to a position of the signal line on the first surface of the insulating layer.
Claim 3
Dependent Claim
40 words
The substrate of claim 1, wherein, a mesh-like conductor is connected to the conductive line and is formed on the second surface of the insulating layer in an area of the second surface which does not contain the conductive line.
Claim 4
Dependent Claim
27 words
The substrate of claim 1, wherein, a width of the conductive line is from one to two times as wide as a width of the signal line.
Claim 5
Dependent Claim
26 words
The substrate of claim 2, wherein, a width of conductive line is from one to two times as wide as a width of the signal line.
Claim 6
Dependent Claim
22 words
The substrate of claim 2, wherein, the insulating layer comprises a laminate comprised of a plurality of low temperature cofired ceramic sheets.
Claim 7
Dependent Claim
22 words
The substrate of claim 4, wherein, the insulating layer comprises a laminate comprised of a plurality of low temperature cofired ceramic sheets.
Claim 8
Dependent Claim
22 words
The substrate of claim 4, wherein, the insulating layer comprises a laminate comprised of a plurality of layers of a polymer material.
Claim 9
Dependent Claim
125 words
A substrate comprising an insulating layer having a signal line on a first surface of the insulating layer and a conductive line on a second surface of the insulating layer, a position of the conductive line on the second surface corresponding to a position of the signal line on the first surface of the insulating layer, the second surface of said insulating layer having a mesh-like conductor connected to the conductive line and located in an area of the second surface which does not contain the conductive line, the insulating layer comprising a laminate comprised of a plurality of low temperature cofired ceramic sheets, and the conductive line having a width from one to two times as wide as a width of the signal line.
Claim 10
Dependent Claim
125 words
A substrate comprising an insulating layer having a signal line on a first surface of the insulating layer and a conductive line on a second surface of the insulating layer, a position of the conductive line on the second surface corresponding to a position of the signal line on the first surface of the insulating layer, the second surface of said insulating layer having a mesh-like conductor connected to the conductive line and located in an area of the second surface which does not contain the conductive line, the insulating layer comprising a laminate comprised of a plurality of low temperature cofired ceramic sheets, and the conductive line having a width from one to two times as wide as a width of the signal line.
Claim 11
Dependent Claim
71 words
A ceramic package for packaging semiconductor chips comprised of: an insulating layer further comprised of low temperature cofired ceramic sheets, a signal line formed on a first surface of the insulating layer and a conductive line formed on a second surface of said insulating layer, a position of the conductive line on the second surface corresponding to a position of the signal line of the first surface of the insulating layer.
Claim 12
Dependent Claim
71 words
A ceramic package for packaging semiconductor chips comprised of: an insulating layer further comprised of low temperature cofired ceramic sheets, a signal line formed on a first surface of the insulating layer and a conductive line formed on a second surface of said insulating layer, a position of the conductive line on the second surface corresponding to a position of the signal line of the first surface of the insulating layer.
Claim 13
Dependent Claim
42 words
The ceramic package of claim 9, further comprising: a mesh-like conductor connected to the conductive line and formed on the second surface of the insulating layer and located in an area of the second surface which does not contain the conductive line.
Claim 14
Dependent Claim
28 words
The ceramic package of claim 9, wherein, a width of the conductive line is from one to two times as wide as a width of the signal line.
Claim 15
Dependent Claim
27 words
The ceramic package of claim 9, wherein, a width of the conductive line is more than two times as wide as a width of the signal line.
Claim 16
Dependent Claim
126 words
A ceramic package for packaging semiconductor chips comprised of: an insulating layer further comprised of low temperature cofired ceramic sheets, a signal line formed on a first surface of the insulating layer and a conductive line formed on a second surface of said insulating layer, a position of the conductive line on the second surface corresponding to a position of the signal line on the first surface of the insulating layer, the second surface of the insulating layer having a mesh-like conductor connected to the conductive line and located in an area of the second surface which does not contain the conductive line, and wherein the conductive line has a width of from one to two times as wide as a width of the signal line.
Claim 17
Dependent Claim
126 words
A ceramic package for packaging semiconductor chips comprised of: an insulating layer further comprised of low temperature cofired ceramic sheets, a signal line formed on a first surface of the insulating layer and a conductive line formed on a second surface of said insulating layer, a position of the conductive line on the second surface corresponding to a position of the signal line on the first surface of the insulating layer, the second surface of the insulating layer having a mesh-like conductor connected to the conductive line and located in an area of the second surface which does not contain the conductive line, and wherein the conductive line has a width of from one to two times as wide as a width of the signal line.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-05-21 | 1999-11-20 | 2000-05-21 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-05-21 | 2003-11-20 | 2004-05-21 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-05-21 | 2007-11-20 | 2008-05-21 | $7700.00 | Window Closed / Lapsed |