US5329695A
Expired / Lapsed
US
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Method of manufacturing a multilayer circuit board
Assignee: World Properties Inc
•
Filing: 1992-12-31
•
Granted: 1994-07-19
•
Expires: 2012-12-31
Abstract
Abstract Methods of fabricating multilayer circuits are presented. In accordance with the present invention, a plurality of circuit layers are stacked, one on top of the other. At least one of the circuit layers comprise a substrate composed of a polymeric material capable of undergoing bonding such as a fluoropolymeric based substrate having vias therethrough and a circuit comprised of a layer of suitable conductive material. A fusible conductive bonding material (e.g., solder) or a noble metal is applied wherever electrical connections are desired. At least one other of the circuit layers comprises a cofired multilayer ceramic circuit having vias and circuits comprised of a layer of suitable conductive material with a fusible conductive bonding material (e.g., solder) or a noble metal applied wherever electrical connections are desired. Once stacked the circuits are subjected to lamination under heat and pressure to adhere each polymeric substrate to an adjacent ceramic substrate and to diffuse the noble metal or fuse the solder layers together to form an integral multilayer circuit having solid conductive interconnects.
Inventors
- 👤 Richard T. Traskos
- 👤 John A. Olenick
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 01:49
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/46; H05K3/4611; H05K3/4614; H05K3/4617; H05K3/4626; H05K3/4629; H05K3/4632; H05K1/00; H05K1/02; H05K1/03; H05K1/0306; H05K2201/00; H05K2201/01; H05K2201/0104; H05K2201/0129; H05K2201/0137; H05K2201/015; H05K2201/09; H05K2201/09209; H05K2201/095; H05K2201/09563; H05K2203/00; H05K2203/06; H05K2203/061; H05K3/10; H05K3/20; H05K3/205; H05K3/30; H05K3/32; H05K3/328; H05K3/40; H05K3/42; H05K3/423; H05K3/4688; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49126; Y10T29/49155; Y10T29/49165
Claims Analysis
Total Claims: 53
Claim 1
Independent Claim
214 words
A method of making a multilayer circuit comprising the steps of: providing at least one first circuit board comprising a substrate of fusible dielectric material having opposing first and second surfaces, said first circuit board further comprising a first conductive circuit formed on said first surface, said first circuit including conductive material provided on at least one selected location thereof, said conductive material being exposed at said second surface; providing at least one second circuit board comprising a substrate of ceramic material and a second conductive circuit formed thereon; stacking said first and second circuit boards one on top of the other so that said conductive material exposed at said second surface of said first circuit board aligns with a selected location on said second circuit, said selected location on said second circuit or said conductive material exposed at said second surface of said first circuit board or both have a fusible conductive material disposed thereon; and laminating said stacked circuit boards under heat and pressure effective to adhere said fusible dielectric material to said ceramic material and to fuse said fusible conductive material so as to form a cohesive multilayer circuit having a solid conductive interconnect between said first and second circuits, said solid conductive interconnect being defined by said fusible conductive material.
Claim 2
Independent Claim
214 words
A method of making a multilayer circuit comprising the steps of: providing at least one first circuit board comprising a substrate of fusible dielectric material having opposing first and second surfaces, said first circuit board further comprising a first conductive circuit formed on said first surface, said first circuit including conductive material provided on at least one selected location thereof, said conductive material being exposed at said second surface; providing at least one second circuit board comprising a substrate of ceramic material and a second conductive circuit formed thereon; stacking said first and second circuit boards one on top of the other so that said conductive material exposed at said second surface of said first circuit board aligns with a selected location on said second circuit, said selected location on said second circuit or said conductive material exposed at said second surface of said first circuit board or both have a fusible conductive material disposed thereon; and laminating said stacked circuit boards under heat and pressure effective to adhere said fusible dielectric material to said ceramic material and to fuse said fusible conductive material so as to form a cohesive multilayer circuit having a solid conductive interconnect between said first and second circuits, said solid conductive interconnect being defined by said fusible conductive material.
Claim 3
Dependent Claim
92 words
The method of claim 1 wherein said first circuit board is formed by the steps of: forming said first conductive circuit; forming said fusible dielectric substrate having said opposed first and second surfaces, said first circuit being located on said first surface of said substrate; forming at least one access opening through said second surface of said substrate to expose said selected location on said first circuit; and filling said access opening with said conductive material wherein at least an upper portion of said filled access opening comprises said fusible conductive material.
Claim 4
Dependent Claim
21 words
The method of claim 2 wherein said conductive material at a lower portion of said access opening comprises non-fusible conductive material.
Claim 5
Dependent Claim
26 words
The method of claim 2 including the step of: forming said first circuit on a mandrel prior to forming said dielectric substrate on said circuit pattern.
Claim 6
Dependent Claim
21 words
The method of claim 4 including the step of: removing the mandrel subsequent to filling the access opening with conductive material.
Claim 7
Dependent Claim
35 words
The method of claim 2 wherein: said access opening is formed by at least one of the opening formation techniques selected from the group consisting of laser drilling, mechanical drilling, plasma etching and ion etching.
Claim 8
Dependent Claim
14 words
The method of claim 1 wherein: said fusible dielectric material comprises a fluoropolymeric material.
Claim 9
Dependent Claim
13 words
The method of claim 7 wherein: said fluoropolymeric material comprises a filled fluoropolymer.
Claim 10
Dependent Claim
14 words
The method of claim 7 wherein: said fluoropolymeric material comprises a polytetrafluoroethylene based material.
Claim 11
Dependent Claim
16 words
The method of claim 1 wherein: said fusible conductive material comprises a metal or metal alloy.
Claim 12
Dependent Claim
19 words
The method of claim 10 wherein: said fusible conductive material has a melting point of less than 900° F.
Claim 13
Dependent Claim
18 words
The method of claim 1 wherein said heat is in the temperature range of 620° to 800° F.
Claim 14
Dependent Claim
17 words
The method of claim 1 wherein: said second circuit board comprises a cofired multilayer ceramic circuit board.
Claim 15
Dependent Claim
40 words
The method of claim 1 wherein: said second circuit includes a layer of an adhesion promotor material on said selected location of said second circuit; and a layer of a conductive material on said layer of said adhesion promotor material.
Claim 16
Dependent Claim
26 words
The method of claim 14 wherein: said adhesion promotor material comprises chrome; and said conductive material on said layer of said adhesion promotor material comprises copper.
Claim 17
Independent Claim
143 words
A method of making a multilayer circuit comprising the steps of: providing first and second circuit boards, each comprising a substrate of ceramic material and a conductive circuit formed thereon; providing a sheet of fusible dielectric material; forming a plug of fusible conductive material in said sheet of fusible conductive material; stacking said first and second circuit boards with said sheet of fusible dielectric material sandwiched therebetween so that said plug of fusible conductive material aligns with a selected location on each of said circuits; and laminating said stacked circuit boards under heat and pressure effective to adhere said fusible dielectric material to said ceramic material and to fuse said fusible conductive material so as to form a cohesive multilayer circuit having a solid conductive interconnect between said first and second circuits, said solid conductive interconnect being defined by said fusible conductive material.
Claim 18
Independent Claim
143 words
A method of making a multilayer circuit comprising the steps of: providing first and second circuit boards, each comprising a substrate of ceramic material and a conductive circuit formed thereon; providing a sheet of fusible dielectric material; forming a plug of fusible conductive material in said sheet of fusible conductive material; stacking said first and second circuit boards with said sheet of fusible dielectric material sandwiched therebetween so that said plug of fusible conductive material aligns with a selected location on each of said circuits; and laminating said stacked circuit boards under heat and pressure effective to adhere said fusible dielectric material to said ceramic material and to fuse said fusible conductive material so as to form a cohesive multilayer circuit having a solid conductive interconnect between said first and second circuits, said solid conductive interconnect being defined by said fusible conductive material.
Claim 19
Dependent Claim
14 words
The method of claim 16 wherein: said fusible dielectric material comprises a fluoropolymeric material.
Claim 20
Dependent Claim
13 words
The method of claim 17 wherein: said fluoropolymeric material comprises a filled fluoropolymer.
Claim 21
Dependent Claim
14 words
The method of claim 17 wherein: said fluroropolymeric material comprise a polytetrafluoroethylene based material.
Claim 22
Dependent Claim
16 words
The method of claim 16 wherein: said fusible conductive material comprises a metal or metal alloy.
Claim 23
Dependent Claim
19 words
The method of claim 20 wherein: said fusible conductive material has a melting point of less than 900° F.
Claim 24
Dependent Claim
18 words
The method of claim 16 wherein said heat is in the temperature range of 620° to 800° F.
Claim 25
Dependent Claim
20 words
The method of claim 16 wherein: said first and second circuit boards each comprise a cofired multilayer ceramic circuit board.
Claim 26
Dependent Claim
47 words
The method of claim 16 wherein said first and second circuits each include: a layer of an adhesion promotor material on said selected location of each of said first and second circuits; and a layer of a conductive material on said layer of said adhesion promotor material.
Claim 27
Dependent Claim
26 words
The method of claim 24 wherein: said adhesion promotor material comprises chrome; and said conductive material on said layer of said adhesion promotor material comprises copper.
Claim 28
Independent Claim
218 words
A method of making a multilayer circuit comprising the steps of: providing at least one first circuit board comprising a substrate of fusible dielectric material having opposing first and second surfaces, said first circuit board further comprising a first conductive circuit formed on said first surface, said first circuit having conductive material provided on at least one selected location thereof, said conductive material being exposed at said second surface, said conductive material at said second surface having a layer of a noble metal disposed thereon; providing at least one second circuit board comprising a substrate of ceramic material and a second conductive circuit formed thereon, said second conductive circuit including a layer of noble metal material on at least one selected location thereof; stacking said first and second circuit boards one on top of the other so that said selected locations of noble metal on said first circuit board aligns with said selected locations of noble metal on said second circuit board; and laminating said stacked circuit boards under heat and pressure effective to adhere said fusible dielectric material to said ceramic material and to diffuse said noble metal so as to form a cohesive multilayer circuit having a solid conductive interconnect between said first and second circuits, said solid conductive interconnect being defined by said noble metal.
Claim 29
Independent Claim
218 words
A method of making a multilayer circuit comprising the steps of: providing at least one first circuit board comprising a substrate of fusible dielectric material having opposing first and second surfaces, said first circuit board further comprising a first conductive circuit formed on said first surface, said first circuit having conductive material provided on at least one selected location thereof, said conductive material being exposed at said second surface, said conductive material at said second surface having a layer of a noble metal disposed thereon; providing at least one second circuit board comprising a substrate of ceramic material and a second conductive circuit formed thereon, said second conductive circuit including a layer of noble metal material on at least one selected location thereof; stacking said first and second circuit boards one on top of the other so that said selected locations of noble metal on said first circuit board aligns with said selected locations of noble metal on said second circuit board; and laminating said stacked circuit boards under heat and pressure effective to adhere said fusible dielectric material to said ceramic material and to diffuse said noble metal so as to form a cohesive multilayer circuit having a solid conductive interconnect between said first and second circuits, said solid conductive interconnect being defined by said noble metal.
Claim 30
Dependent Claim
91 words
The method of claim 26 wherein said first circuit board is formed by the steps of: forming said first conductive circuit; forming said fusible dielectric substrate having said opposed first and second surfaces, said first circuit being located on said first surface of said substrate; forming at least one access opening through said second surface of said substrate to expose said selected location on said first circuit; and filling said access opening with said conductive material wherein at least an upper portion of said filled access opening comprises said noble metal.
Claim 31
Dependent Claim
20 words
The method of claim 27 wherein said conductive material at a portion of said access opening comprises non-fusible conductive material.
Claim 32
Dependent Claim
26 words
The method of claim 27 including the step of: forming said first circuit on a mandrel prior to forming said dielectric substrate on said circuit pattern.
Claim 33
Dependent Claim
21 words
The method of claim 29 including the step of: removing the mandrel subsequent to filling the access opening with conductive material.
Claim 34
Dependent Claim
42 words
The method of claim 27 wherein: said access opening is formed by at least one of the opening formation techniques selected from the group consisting of laser drilling, mechanical drilling, plasma etching, ion etching, punching, and using preformed posts to penetrate dielectric.
Claim 35
Dependent Claim
14 words
The method of claim 26 wherein: said fusible dielectric material comprises a fluoropolymeric material.
Claim 36
Dependent Claim
13 words
The method of claim 32 wherein: said fluoropolymeric material comprises a filled fluoropolymer.
Claim 37
Dependent Claim
14 words
The method of claim 32 wherein: said fluoropolymeric material comprises a polytetrafluoroethylene based material.
Claim 38
Dependent Claim
11 words
The method of claim 26 wherein: said noble metal comprises gold.
Claim 39
Dependent Claim
90 words
The method of claim 26 wherein said first circuit comprises at, at least said selected location: a layer of copper; a layer of nickel deposited on said layer of copper; and said layer of noble metal deposited on said layer of nickel; and wherein said second circuit comprises at, at least said selected location a layer of chrome; a layer of copper deposited on said layer of chrome; a layer of nickel deposited on said layer of copper; and said layer of noble metal deposited on said layer of nickel.
Claim 40
Dependent Claim
33 words
The method of claim 26 wherein each of said first and second circuits comprise: a layer of a conductive material; and said layer of noble metal deposited on said layer of conductive material.
Claim 41
Dependent Claim
15 words
The method of claim 37 wherein said layer of conductive material comprises copper or aluminum.
Claim 42
Dependent Claim
16 words
The method of claim 26 wherein said first and second conductive circuits comprise a noble metal.
Claim 43
Independent Claim
156 words
A method of making a multilayer circuit comprising the steps of: providing first and second circuit boards, each comprising a substrate of ceramic material and a conductive circuit formed thereon, said conductive circuit including a layer of a noble metal material on at least one selected location thereof; providing a sheet of fusible dielectric material having at least one opening therethrough; stacking said first and second circuit boards with said sheet of fusible dielectric material sandwiched therebetween so that said noble metal on each of said first and second circuit boards align within said opening of said fusible dielectric material; and laminating said stacked circuit boards under heat and pressure effective to adhere said fusible dielectric material to said ceramic material and to diffuse said noble metal so as to form a cohesive multilayer circuit having a solid conductive interconnect between said first and second circuits, said solid conductive interconnect being defined by said noble metal.
Claim 44
Independent Claim
156 words
A method of making a multilayer circuit comprising the steps of: providing first and second circuit boards, each comprising a substrate of ceramic material and a conductive circuit formed thereon, said conductive circuit including a layer of a noble metal material on at least one selected location thereof; providing a sheet of fusible dielectric material having at least one opening therethrough; stacking said first and second circuit boards with said sheet of fusible dielectric material sandwiched therebetween so that said noble metal on each of said first and second circuit boards align within said opening of said fusible dielectric material; and laminating said stacked circuit boards under heat and pressure effective to adhere said fusible dielectric material to said ceramic material and to diffuse said noble metal so as to form a cohesive multilayer circuit having a solid conductive interconnect between said first and second circuits, said solid conductive interconnect being defined by said noble metal.
Claim 45
Dependent Claim
41 words
The method of claim 40 wherein: said opening is formed by at least one of the opening formation techniques selected from the group consisting of laser drilling, mechanical drilling, plasma etching, ion etching, punching, and using preformed posts to penetrate dielectric.
Claim 46
Dependent Claim
14 words
The method of claim 40 wherein: said fusible dielectric material comprises a fluoropolymeric material.
Claim 47
Dependent Claim
13 words
The method of claim 42 wherein: said fluoropolymeric material comprises a filled fluoropolymer.
Claim 48
Dependent Claim
14 words
The method of claim 42 wherein: said fluoropolymeric material comprises a polytetrafluoroethylene based material.
Claim 49
Dependent Claim
11 words
The method of claim 40 wherein: said noble metal comprises gold.
Claim 50
Dependent Claim
55 words
The method of claim 40 wherein said first and second circuits each comprise at, at least said selected location: a layer of chrome; a layer of copper deposited on said layer of chrome; a layer of nickel deposited on said layer of copper; and said layer of noble metal deposited on said layer of nickel.
Claim 51
Dependent Claim
33 words
The method of claim 40 wherein each of said first and second circuits comprise: a layer of a conductive material; and said layer of noble metal deposited on said layer of conductive material.
Claim 52
Dependent Claim
15 words
The method of claim 40 wherein said layer of conductive material comprises copper or aluminum.
Claim 53
Dependent Claim
16 words
The method of claim 40 wherein said first and second conductive circuits comprise a noble metal.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
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| 3.5 Years (Year 4) | 1997-07-18 | 1998-01-17 | 1998-07-19 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-07-18 | 2002-01-17 | 2002-07-19 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-07-18 | 2006-01-17 | 2006-07-19 | $7700.00 | Window Closed / Lapsed |