US4902606A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Compressive pedestal for microminiature connections
Assignee: Raytheon Co
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Filing: 1988-08-01
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Granted: 1990-02-20
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Expires: 2008-08-01
Abstract
Abstract Apparatus is disclosed for providing microelectronic, intra-chip and chip-to-chip interconnections in an ultra-dense integrated circuit configuration. Compressive pedestals 20 are used to form spring-loaded electrical and mechanical interconnections to conductive terminals on a chip interface mesa and chip assembly 28 in order to form a large multi-chip array 23 on an interconnection substrate 24. Methods are also disclosed for fabricating the compressive pedestals 20.
Inventors
- 👤 Nils E. Patraw
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 19:14
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/40; H05K3/4092; H10; H10W; H10W70/00; H10W70/01; H10W70/05; H10W72/00; H05K3/30; H05K3/32; H05K3/325; H05K3/4007; H10W72/071; H10W72/0711; H10W72/07141; H10W72/07178; H10W72/072; H10W72/07231; H10W72/07236; H10W72/20; H10W72/251; H10W72/252; H10W72/50; H10W72/551; H10W72/552; H10W72/5524
Claims Analysis
Total Claims: 7
Claim 1
Independent Claim
161 words
A method of fabricating an upstanding electrical terminal coupled to a conductive pathway upon a surface of a substrate, comprising the steps of: applying a layer of photoresist to a surface of a substrate; processing the photoresist layer in order to create an opening within the photoresist layer such that a portion of a conductive pathway upon the underlying surface is exposed; filling the opening with a supersaturated solution comprised of KCl such that the filled opening has a positive meniscus; drying the supersaturated solution of KCl such that the shape of the positive meniscus is maintained; removing the photoresist layer; depositing an electrically conductive layer over the dried KCl such that the conductive layer has a convex upper surface region and a plurality of downwardly extending leg portions, each leg portion being conductively coupled through a wider foot portion to the pathway; and removing the dried KCl such that the deposited electrically conductive layer is left upstanding upon the substrate.
Claim 2
Independent Claim
161 words
A method of fabricating an upstanding electrical terminal coupled to a conductive pathway upon a surface of a substrate, comprising the steps of: applying a layer of photoresist to a surface of a substrate; processing the photoresist layer in order to create an opening within the photoresist layer such that a portion of a conductive pathway upon the underlying surface is exposed; filling the opening with a supersaturated solution comprised of KCl such that the filled opening has a positive meniscus; drying the supersaturated solution of KCl such that the shape of the positive meniscus is maintained; removing the photoresist layer; depositing an electrically conductive layer over the dried KCl such that the conductive layer has a convex upper surface region and a plurality of downwardly extending leg portions, each leg portion being conductively coupled through a wider foot portion to the pathway; and removing the dried KCl such that the deposited electrically conductive layer is left upstanding upon the substrate.
Claim 3
Dependent Claim
18 words
A method as defined in claim 1, wherein the step of drying is accomplished in a vacuum oven.
Claim 4
Dependent Claim
24 words
A method as defined in claim 1 wherein the step of removing the photoresist layer is accomplished by an ionized oxygen plasma ashing technique.
Claim 5
Dependent Claim
23 words
A method as defined in claim 1 wherein the step of removing the dried KCl is accomplished by dissolving the KCl with water.
Claim 6
Independent Claim
165 words
A method of fabricating an upstanding electrical terminal coupled to a conductive pathway upon a surface of a substrate, comprising the steps of: applying a coating comprised of a polyimide to a surface of a substrate; curing the polyimide coating; applying a first photoresist layer over the polyimide coating; processing the first photoresist layer and the polyimide coating to create an opening within the polyimide coating such that a portion of a conductive pathway upon the underlying surface is exposed; removing the first photoresist layer; filling the opening within the polyimide coating with photoresist such that the filled opening has a positive meniscus; removing the polyimide coating; depositing an electrically conductive layer over the photoresist such that the conductive layer has a convex upper surface region and a plurality of downwardly extending leg portions, each leg portion being conductively coupled through a wider foot portion to the pathway; and dissolving the photoresist such that the deposited electrically conductive layer is left upstanding upon the substrate.
Claim 7
Independent Claim
165 words
A method of fabricating an upstanding electrical terminal coupled to a conductive pathway upon a surface of a substrate, comprising the steps of: applying a coating comprised of a polyimide to a surface of a substrate; curing the polyimide coating; applying a first photoresist layer over the polyimide coating; processing the first photoresist layer and the polyimide coating to create an opening within the polyimide coating such that a portion of a conductive pathway upon the underlying surface is exposed; removing the first photoresist layer; filling the opening within the polyimide coating with photoresist such that the filled opening has a positive meniscus; removing the polyimide coating; depositing an electrically conductive layer over the photoresist such that the conductive layer has a convex upper surface region and a plurality of downwardly extending leg portions, each leg portion being conductively coupled through a wider foot portion to the pathway; and dissolving the photoresist such that the deposited electrically conductive layer is left upstanding upon the substrate.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1993-02-19 | 1993-08-21 | 1994-02-20 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1997-02-19 | 1997-08-21 | 1998-02-20 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2001-02-19 | 2001-08-21 | 2002-02-20 | $7700.00 | Window Closed / Lapsed |