US4716049A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Compressive pedestal for microminiature connections
Assignee: Raytheon Co
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Filing: 1986-06-30
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Granted: 1987-12-29
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Expires: 2006-06-30
Abstract
Abstract Apparatus is disclosed for providing microelectronic, intra-chip and chip-to-chip interconnections in an ultra-dense integrated circuit configuration. Compressive pedestals 20 are used to form spring-loaded electrical and mechanical interconnections to conductive terminals on a chip interface mesa and chip assembly 28 in order to form a large multi-chip array 23 on an interconnection substrate 24. Methods are also disclosed for fabricating the compressive pedestals 20.
Inventors
- 👤 Nils E. Patraw
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 19:32
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/40; H05K3/4092; H10; H10W; H10W70/00; H10W70/01; H10W70/05; H10W72/00; H05K3/30; H05K3/32; H05K3/325; H05K3/4007; H10W72/071; H10W72/072; H10W72/07231; H10W72/07236; H10W72/20; H10W72/251; H10W72/252; H10W72/50; H10W72/551; H10W72/552; H10W72/5524
Claims Analysis
Total Claims: 4
Claim 1
Independent Claim
146 words
A method for making a resilient microelectronic connective member including the steps of: providing a substrate for forming said resilient microelectronic connective member; covering said substrate with a substrate mask having an aperture; filling said aperture with a filling material which will form a positive meniscus at the top boundary of said substrate mask in order to form a rounded pillar on said substrate within said aperature; dissolving said substrate mask with a dissolving substance that will remove said substrate mask from said substrate but that will leave said pillar intact on said substrate; impressing a pedestal design mask over said pillar; depositing a layer of metal over said pedestal design mask in order to form a resilient microelectronic connective member; and dissolving said pillar with a dissolving substance that will remove said pillar but that will leave said resilient microelectronic connective member on said substrate.
Claim 2
Independent Claim
146 words
A method for making a resilient microelectronic connective member including the steps of: providing a substrate for forming said resilient microelectronic connective member; covering said substrate with a substrate mask having an aperture; filling said aperture with a filling material which will form a positive meniscus at the top boundary of said substrate mask in order to form a rounded pillar on said substrate within said aperature; dissolving said substrate mask with a dissolving substance that will remove said substrate mask from said substrate but that will leave said pillar intact on said substrate; impressing a pedestal design mask over said pillar; depositing a layer of metal over said pedestal design mask in order to form a resilient microelectronic connective member; and dissolving said pillar with a dissolving substance that will remove said pillar but that will leave said resilient microelectronic connective member on said substrate.
Claim 3
Independent Claim
147 words
A method for fabricating a compressive pedestal for microminiature connections including the steps of: providing a multi-layer, dielectric substrate for forming said compressive pedestal for microminiature connection; covering said substrate with a photoresist substrate mask having a cylindrical holes; depositing potassium chloride in said hole in order to form a pillar having a generally rounded top portion of said substrate within said cylindrical hole; dissolving said photoresist substrate mask with a dissolving substrate that will remove said photoresist substrate mask from said substrate but that will leave said pillar intact on said substrate; impressing a pedestal design mask over said pillar; depositing a layer of aluminum over said pedestal design mask in order to form a compressive pedestal for microminiature connection; and dissolving said pillar with a dissolving substance that will remove said pillar but that will leave said compressive pedestal for microminiature connection on said substrate.
Claim 4
Independent Claim
147 words
A method for fabricating a compressive pedestal for microminiature connections including the steps of: providing a multi-layer, dielectric substrate for forming said compressive pedestal for microminiature connection; covering said substrate with a photoresist substrate mask having a cylindrical holes; depositing potassium chloride in said hole in order to form a pillar having a generally rounded top portion of said substrate within said cylindrical hole; dissolving said photoresist substrate mask with a dissolving substrate that will remove said photoresist substrate mask from said substrate but that will leave said pillar intact on said substrate; impressing a pedestal design mask over said pillar; depositing a layer of aluminum over said pedestal design mask in order to form a compressive pedestal for microminiature connection; and dissolving said pillar with a dissolving substance that will remove said pillar but that will leave said compressive pedestal for microminiature connection on said substrate.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1990-12-28 | 1991-06-29 | 1991-12-29 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1994-12-28 | 1995-06-29 | 1995-12-29 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1998-12-28 | 1999-06-29 | 1999-12-29 | $7700.00 | Window Closed / Lapsed |