US5028473A
Expired / Lapsed
US
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Three dimensional microcircuit structure and process for fabricating the same from ceramic tape
Assignee: Raytheon Co
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Filing: 1989-10-02
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Granted: 1991-07-02
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Expires: 2009-10-02
Abstract
Abstract An electrical circuit pattern is formed on a glass-ceramic, thermally fusible tape. The tape is heated to a temperature at which it becomes temporarily plastic, and is then bent into a desired non-planar shape. Further application of heat causes the tape to be sintered in the non-planar shape. A multi-layer structure can be provided by laminating plural layers of Low-Temperature-Cofired-Ceramic (LTCC) tape with respective circuit patterns formed thereon together, and plastically bending the laminated structure into the non-planar shape during the heating step. A circuit structure including an edge connector can be formed by laminating a layer of glass-ceramic transfer tape having an electrical circuit pattern which includes conductor strips formed on an edge connector portion thereof onto a relatively rigid substrate, such that the edge connector portion is bent around an edge of the substrate to form a rigid edge connector. The edge connector portion of the transfer tape which is formed into a non-planar shape during the lamination step, is fused together with the remaining portion of the transfer tape onto the substrate during the heating step.
Inventors
- 👤 William A. Vitriol
- 👤 Gary W. Johnson
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 11:09
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/01; H10W70/05; H05; H05K; H05K3/00; H05K3/0011; H05K3/0014; H10W70/60; H10W70/611; H10W70/67; H10W70/68; H10W70/685; H05K1/00; H05K1/02; H05K1/03; H05K1/0306; H05K2203/00; H05K2203/11; H05K2203/1105; H05K2203/30; H05K2203/302; Y; Y10; Y10S; Y10S428/00; Y10S428/901; Y10T; Y10T428/00; Y10T428/24; Y10T428/24273; Y10T428/24322; Y10T428/24777; Y10T428/24802; Y10T428/24917; Y10T428/31504; Y10T428/31678
Claims Analysis
Total Claims: 38
Claim 1
Independent Claim
98 words
A process for fabricating an electrical circuit structure, comprising the steps of: (a) providing a substrate; (b) providing a flexible, thermally fusible sheet having an electrical circuit pattern formed on a surface thereof; (c) laminating a surface of the sheet opposite to the surface on which the pattern is formed onto the substrate; and (d) heating the substrate and sheet to a temperature which causes the sheet to fuse to the substrate; steps (c) and (d) in combination including causing the sheet to bend into a non-planar shape, and thermally fuse to the substrate in the non-planar shape.
Claim 2
Dependent Claim
98 words
A process for fabricating an electrical circuit structure, comprising the steps of: (a) providing a substrate; (b) providing a flexible, thermally fusible sheet having an electrical circuit pattern formed on a surface thereof; (c) laminating a surface of the sheet opposite to the surface on which the pattern is formed onto the substrate; and (d) heating the substrate and sheet to a temperature which causes the sheet to fuse to the substrate; steps (c) and (d) in combination including causing the sheet to bend into a non-planar shape, and thermally fuse to the substrate in the non-planar shape.
Claim 3
Dependent Claim
52 words
A process as in claim 1, further comprising the step, performed between steps (a) and (c), of: (e) forming an electrical circuit pattern on a surface of the substrate; steps (c) and (d) comprising laminating and fusing the sheet to the surface of the substrate on which the electrical pattern is formed.
Claim 4
Dependent Claim
51 words
A process as in claim 1, in which the substrate provided in step (a) is substantially rigid and has an edge, step (c) comprising bending an edge portion of the sheet over the edge of the substrate, and laminating the edge portion of the sheet to the edge of the substrate.
Claim 5
Dependent Claim
34 words
A process as in claim 3, in which step (b) comprises providing the electrical circuit pattern on the edge portion of the surface of the sheet in the form of an electrical edge connector.
Claim 6
Dependent Claim
42 words
A process as in claim 3, in which step (c) further comprises bending the edge portion of the sheet around the edge of the substrate, and laminating said bent around edge portion of the sheet to a back surface of the substrate.
Claim 7
Dependent Claim
75 words
A process as in claim 1, in which steps (a) and (c) comprise providing each of the substrate and sheet in the form of thermally fusible tape, the process further comprising the step, performed between steps (a) and (c), of: (e) forming an electrical circuit pattern on a surface of the substrate; steps (c) and (d) comprising laminating and fusing the sheet to the surface of the substrate on which the electrical pattern is formed.
Claim 8
Dependent Claim
52 words
A process as in claim 6, in which: step (c) includes laminating the substrate and sheet together to form a substantially planar shape; and step (d) includes causing a force to be applied to the laminated substrate and sheet which causes the substrate and sheet to plastically deform into the non-planar shape.
Claim 9
Dependent Claim
67 words
A process as in claim 7, in which step (d) comprises releasably supporting a first portion of the laminated substrate and sheet, heating the substrate and sheet to said temperature which further causes the tape of the substrate and sheet to become plastic, and allowing an unsupported second portion of the laminated substrate and sheet to be plastically bent downwardly by gravity relative to the first portion.
Claim 10
Dependent Claim
33 words
A process as in claim 8, in which step (a) comprises providing each of the substrate and sheet in the form of co-fired, glass-ceramic tape, said temperature being less than substantially 1000° C.
Claim 11
Dependent Claim
107 words
A process for forming an electrical circuit structure having an edge connector, comprising the steps of: (a) providing a substantially rigid substrate having an edge; (b) providing a sheet of thermally fusible transfer tape having an electrical edge connector pattern formed on an edge portion of a surface thereof; (c) laminating a surface of the tape opposite to the surface on which the pattern is formed onto the substrate such that the edge portion of the tape is bent over and laminated to the edge of the substrate; and (d) heating the substrate and tape to a temperature which causes the tape to fuse to the substrate.
Claim 12
Dependent Claim
107 words
A process for forming an electrical circuit structure having an edge connector, comprising the steps of: (a) providing a substantially rigid substrate having an edge; (b) providing a sheet of thermally fusible transfer tape having an electrical edge connector pattern formed on an edge portion of a surface thereof; (c) laminating a surface of the tape opposite to the surface on which the pattern is formed onto the substrate such that the edge portion of the tape is bent over and laminated to the edge of the substrate; and (d) heating the substrate and tape to a temperature which causes the tape to fuse to the substrate.
Claim 13
Dependent Claim
42 words
A process as in claim 10, in which step (c) further comprises bending the edge portion of the tape around the edge of the substrate, and laminating said bent around edge portion of the tape to a back surface of the substrate.
Claim 14
Dependent Claim
87 words
A process for fabricating a ceramic tape electrical circuit structure, comprising the steps of: (a) providing a thermally fusible ceramic tape having an electrical circuit pattern formed on a surface thereof: (b) heating the tape to a temperature which causes the tape to become temporarily plastic, and causing the tape to be bent into a non-planar shape while plastic; and (c) further heating the tape to a temperature which causes the tape to sinter, and upon cooling, causing the tape to become sintered in the non-planar shape.
Claim 15
Dependent Claim
87 words
A process for fabricating a ceramic tape electrical circuit structure, comprising the steps of: (a) providing a thermally fusible ceramic tape having an electrical circuit pattern formed on a surface thereof: (b) heating the tape to a temperature which causes the tape to become temporarily plastic, and causing the tape to be bent into a non-planar shape while plastic; and (c) further heating the tape to a temperature which causes the tape to sinter, and upon cooling, causing the tape to become sintered in the non-planar shape.
Claim 16
Dependent Claim
40 words
A process as in claim 12, in which step (b) comprises releasably supporting a first portion of the tape, and allowing an unsupported second portion of the tape to be plastically bent downwardly by gravity relative to the first portion.
Claim 17
Dependent Claim
93 words
A process for fabricating a co-fired ceramic tape electrical circuit structure, comprising the steps of: (a) laminating together a plurality of layers of glass-ceramic tape having electrical circuit patterns formed thereon respectively to form an integral structure; (b) heating the structure to a temperature which causes the tape to become temporarily plastic, and causing the structure to be bent into a non-planar shape while the tape is plastic; and (c) further heating the structure to a temperature at which the tape sinters, and causing the tape to become sintered in the non-planar shape.
Claim 18
Dependent Claim
93 words
A process for fabricating a co-fired ceramic tape electrical circuit structure, comprising the steps of: (a) laminating together a plurality of layers of glass-ceramic tape having electrical circuit patterns formed thereon respectively to form an integral structure; (b) heating the structure to a temperature which causes the tape to become temporarily plastic, and causing the structure to be bent into a non-planar shape while the tape is plastic; and (c) further heating the structure to a temperature at which the tape sinters, and causing the tape to become sintered in the non-planar shape.
Claim 19
Dependent Claim
40 words
A process as in claim 14, in which step (b) comprises releasably supporting a first portion of the structure, and allowing an unsupported second portion of the structure to be plastically bent downwardly by gravity relative to the first portion.
Claim 20
Dependent Claim
39 words
A process as in claim 14, in which step (b) comprises releasably supporting an inner portion of the structure, and allowing unsupported outer portions of the structure to be plastically bent downwardly by gravity relative to the central portion.
Claim 21
Dependent Claim
39 words
A process as in claim 14, in which step (b) comprises releasably supporting outer portions of the structure, and allowing an unsupported inner portion of the structure to be plastically bent downwardly by gravity relative to the outer portions.
Claim 22
Dependent Claim
47 words
An electrical circuit structure, comprising: a substrate; and a sintered ceramic sheet having a non-planar shape, and an electrical circuit pattern formed on a surface thereof; a surface of the sheet opposite to the surface on which the pattern is formed being thermally fused to the substrate.
Claim 23
Dependent Claim
47 words
An electrical circuit structure, comprising: a substrate; and a sintered ceramic sheet having a non-planar shape, and an electrical circuit pattern formed on a surface thereof; a surface of the sheet opposite to the surface on which the pattern is formed being thermally fused to the substrate.
Claim 24
Dependent Claim
26 words
A structure as in claim 18, in which a surface of the substrate to which the sheet is fused has an electrical circuit pattern formed thereon.
Claim 25
Dependent Claim
36 words
A structure as in claim 18, in which the substrate is substantially rigid and has an edge, the sheet having an edge portion which is bent over and thermally fused to the edge of the substrate.
Claim 26
Dependent Claim
28 words
A structure as in claim 20, in which the electrical circuit pattern formed on the sheet comprises an electrical edge connector pattern formed on the edge portion thereof.
Claim 27
Dependent Claim
30 words
A structure as in claim 20, in which the edge portion of the sheet is further bent around the edge of the substrate and fused to a back surface thereof.
Claim 28
Dependent Claim
25 words
A structure as in claim 18, in which the substrate and sheet each comprise thermally fusible tape, and are integrally sintered into the non-planar shape.
Claim 29
Dependent Claim
15 words
A structure as in claim 23, in which the thermally fusible tape is glass-ceramic tape.
Claim 30
Dependent Claim
33 words
An electrical circuit structure comprising a sintered ceramic sheet which is plastically formed from thermally fusible tape into a non-planar shape, and an electrical circuit pattern formed on a surface of the sheet.
Claim 31
Dependent Claim
33 words
An electrical circuit structure comprising a sintered ceramic sheet which is plastically formed from thermally fusible tape into a non-planar shape, and an electrical circuit pattern formed on a surface of the sheet.
Claim 32
Dependent Claim
15 words
A structure as in claim 25, in which the thermally fusible tape is glass-ceramic tape.
Claim 33
Dependent Claim
43 words
An electrical circuit structure comprising a plurality of sintered ceramic sheets formed from thermally fusible tape, each sheet having an electrical circuit pattern formed on a surface thereof, the sheets being laminated and thermally fused together, and integrally formed into a non-planar shape.
Claim 34
Dependent Claim
43 words
An electrical circuit structure comprising a plurality of sintered ceramic sheets formed from thermally fusible tape, each sheet having an electrical circuit pattern formed on a surface thereof, the sheets being laminated and thermally fused together, and integrally formed into a non-planar shape.
Claim 35
Dependent Claim
14 words
A structure as in claim 27, in which thermally fusible tape is glass-ceramic tape.
Claim 36
Dependent Claim
38 words
A structure as in claim 27, comprising an edge connector portion which includes a substantially right angle bend, the structure further including an electrical edge connector pattern formed on the outwardly facing surface of the edge connector portion.
Claim 37
Dependent Claim
90 words
A process for fabricating a co-fired ceramic tape electrical circuit structure, comprising the steps of: (a) laminating together a plurality of layers of glass-ceramic tape having electrical circuit patterns formed thereon respectively to form an integral structure; (b) heating the structure to a temperature which causes the tape to become temporarily plastic, and molding the structure into a non-planar shape while the tape is plastic; and (c) further heating the structure to a temperature at which the tape sinters, and causing the tape to become sintered in the non-planar shape.
Claim 38
Dependent Claim
90 words
A process for fabricating a co-fired ceramic tape electrical circuit structure, comprising the steps of: (a) laminating together a plurality of layers of glass-ceramic tape having electrical circuit patterns formed thereon respectively to form an integral structure; (b) heating the structure to a temperature which causes the tape to become temporarily plastic, and molding the structure into a non-planar shape while the tape is plastic; and (c) further heating the structure to a temperature at which the tape sinters, and causing the tape to become sintered in the non-planar shape.
References Cited (Backward Citations)
US4645552A
Cited
US4786342A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1994-07-01 | 1994-12-31 | 1995-07-02 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1998-07-01 | 1998-12-31 | 1999-07-02 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2002-07-01 | 2002-12-31 | 2003-07-02 | $7700.00 | Window Closed / Lapsed |