US5508559A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Power circuit package
Assignee: Apple Inc
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Filing: 1994-04-25
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Granted: 1996-04-16
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Expires: 2014-04-25
Abstract
Abstract A method for forming a power circuit package (45) having a porous base structure (20) electrically isolated from a first porous die mount (21) and a second porous die mount (22) by a dielectric material (29). The porous base structure (20) is bonded to a second surface of the the dielectric material (29) whereas the first porous die mount (21), and the second porous die mount (22) are bonded to a first surface of the dielectric material (29). Simultaneous with the bonding step, the porous base structure (20), the first porous die mount (21), and the second porous die mount (22) are impregnated with a conductive material. Semiconductor die (32, 33, 34, and 35) are bonded to the impregnated die mounts. The semiconductor die (32, 33, 34, and 35) are then encapsulated by a molding compound.
Inventors
- 👤 Samuel J. Anderson
- 👤 Guillermo L. Romero
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-30 21:13
CPC Classifications
H; H10; H10W; H10W90/00; H10W40/00; H10W40/20; H10W40/25; H10W40/259; H03; H03B; H03B2200/00; H03B2200/003; H03B2200/0034; H03B2200/004; H03B2201/00; H03B2201/02; H03B2201/0208; H03B7/00; H03B7/02; H03B7/06; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913
Claims Analysis
Total Claims: 31
Claim 1
Independent Claim
66 words
A package structure, comprising: a porous base structure; a dielectric material on the porous base structure; at least one porous mount on the dielectric material; and an electrically conductive impregnation material filling pores within the porous base structure and the at least one porous mount, wherein the electrically conductive impregnation material bonds the base structure and the at least one porous mount to the dielectric material.
Claim 2
Dependent Claim
66 words
A package structure, comprising: a porous base structure; a dielectric material on the porous base structure; at least one porous mount on the dielectric material; and an electrically conductive impregnation material filling pores within the porous base structure and the at least one porous mount, wherein the electrically conductive impregnation material bonds the base structure and the at least one porous mount to the dielectric material.
Claim 3
Dependent Claim
21 words
A package structure as claimed in claim 1 wherein the impregnation material is aluminum and the dielectric material is aluminum nitride.
Claim 4
Dependent Claim
26 words
A package structure as claimed in claim 1 wherein the material of the porous base structure and the at least one porous mount is silicon carbide.
Claim 5
Dependent Claim
23 words
A package structure as claimed in claim 1 wherein the porous base structure includes at least one duct capable of supporting fluid flow.
Claim 6
Dependent Claim
23 words
A package structure as claimed in claim 1, including at least one integrated circuit die mounted to the at least one porous mount.
Claim 7
Dependent Claim
21 words
A package structure as claimed in claim 5, further including an encapsulating material covering the at least one integrated circuit die.
Claim 8
Dependent Claim
69 words
A package for a semiconductor die, comprising a non-metallic porous base structure separated from at least one non-metallic porous mount by an electrically insulating material, wherein the non-metallic porous base structure and the at least one non-metallic porous mount are impregnated with a conductive material, and wherein the conductive material bonds the non-metallic porous base structure and the at least one non-metallic porous mount to the electrically insulating material.
Claim 9
Dependent Claim
69 words
A package for a semiconductor die, comprising a non-metallic porous base structure separated from at least one non-metallic porous mount by an electrically insulating material, wherein the non-metallic porous base structure and the at least one non-metallic porous mount are impregnated with a conductive material, and wherein the conductive material bonds the non-metallic porous base structure and the at least one non-metallic porous mount to the electrically insulating material.
Claim 10
Dependent Claim
27 words
A package as claimed in claim 7, wherein a material of the non-metallic porous base structure and the at least one non-metallic porous mount is silicon carbide.
Claim 11
Dependent Claim
26 words
A package as claimed in claim 7, wherein the conductive material is selected from the group of aluminum, alloys of aluminum, copper, and alloys of copper.
Claim 12
Dependent Claim
14 words
A package as claimed in claim 7, wherein the package is a unitary structure.
Claim 13
Dependent Claim
32 words
A package as claimed in claim 7, further including a semiconductor die attached to a conductor, the conductor mounted to the at least one non-metallic porous mount impregnated with the conductive material.
Claim 14
Dependent Claim
139 words
A package as claimed in claim 7, wherein the at least one non-metallic porous mount impregnated with the conductive material comprises first, second, and third non-metallic porous mounts impregnated with the conductive material, the second non-metallic porous mount between and spaced apart from the first and third non-metallic porous mounts, and wherein the package further comprises: first and second semiconductor die attached to a first conductor, the first conductor in contact with the first non-metallic porous mount; third and fourth semiconductor die attached to a second conductor, the second conductor in contact the third non-metallic porous mount; a third conductor in contact with the second non-metallic porous mount; a first conductive clip for coupling the first semiconductor die to the third semiconductor die; and a second conductive clip for coupling the second semiconductor die to the fourth semiconductor die.
Claim 15
Dependent Claim
24 words
A package as claimed in claim 7, wherein a portion of the at least one non-metallic porous mount is covered by an encapsulating material.
Claim 16
Dependent Claim
118 words
A package for a semiconductor device, comprising: a non-metallic porous planar base structure having a major surface; a dielectric material having first and second major surfaces, a portion of the second major surface of the dielectric material in contact with a portion of the major surface of the non-metallic porous planar base structure; at least one non-metallic porous mount in contact with a portion of the first major surface of the dielectric material; and a conductive material, the conductive material filling the non-metallic porous planar base structure and the at least one non-metallic porous mount, wherein the conductive material bonds the non-metallic porous planar base structure and the at least one non-metallic porous mount to the dielectric material.
Claim 17
Dependent Claim
118 words
A package for a semiconductor device, comprising: a non-metallic porous planar base structure having a major surface; a dielectric material having first and second major surfaces, a portion of the second major surface of the dielectric material in contact with a portion of the major surface of the non-metallic porous planar base structure; at least one non-metallic porous mount in contact with a portion of the first major surface of the dielectric material; and a conductive material, the conductive material filling the non-metallic porous planar base structure and the at least one non-metallic porous mount, wherein the conductive material bonds the non-metallic porous planar base structure and the at least one non-metallic porous mount to the dielectric material.
Claim 18
Dependent Claim
32 words
A package for a semiconductor device as claimed in claim 14, wherein the conductive material is selected from the group of aluminum, an alloy of aluminum, copper, and an alloy of copper.
Claim 19
Dependent Claim
32 words
A package for a semiconductor device as claimed in claim 14, wherein a material of the non-metallic porous planar base structure and the at least one non-metallic porous mount is silicon carbide.
Claim 20
Dependent Claim
25 words
A package for a semiconductor device as claimed in claim 14, wherein the non-metallic porous planar structure includes at least one duct for fluid flow.
Claim 21
Dependent Claim
28 words
A package for a semiconductor device as claimed in claim 14, wherein a semiconductor die is coupled to the at least one non-metallic porous mount by a conductor.
Claim 22
Dependent Claim
18 words
A package for a semiconductor device as claimed in claim 14, wherein the package is a unitary structure.
Claim 23
Dependent Claim
34 words
A package for a semiconductor device as claimed in claim 14, further including an encapsulating material covering a portion of the at least one non-metallic porous mount and a portion of the dielectric material.
Claim 24
Dependent Claim
56 words
A package structure, comprising: a non-metallic porous base structure; a dielectric material on the non-metallic porous base structure; and one of a metal or a metal alloy, wherein the one of a metal or a metal alloy fills pores within the non-metallic porous base structure and bonds the non-metallic porous base structure to the dielectric material.
Claim 25
Dependent Claim
56 words
A package structure, comprising: a non-metallic porous base structure; a dielectric material on the non-metallic porous base structure; and one of a metal or a metal alloy, wherein the one of a metal or a metal alloy fills pores within the non-metallic porous base structure and bonds the non-metallic porous base structure to the dielectric material.
Claim 26
Dependent Claim
13 words
The package structure of claim 21, wherein the dielectric material is aluminum nitride.
Claim 27
Dependent Claim
13 words
The package structure of claim 21, wherein the dielectric material is aluminum oxide.
Claim 28
Dependent Claim
11 words
The package structure of claim 21, wherein the metal is aluminum.
Claim 29
Dependent Claim
15 words
The package structure of claim 21, wherein the metal alloy is an alloy of aluminum.
Claim 30
Dependent Claim
15 words
The package structure of claim 21, wherein the metal alloy is an alloy of copper.
Claim 31
Dependent Claim
15 words
The package structure of claim 21, wherein the nonmetallic porous base structure is silicon carbide.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-04-16 | 1999-10-16 | 2000-04-16 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-04-16 | 2003-10-16 | 2004-04-16 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-04-16 | 2007-10-16 | 2008-04-16 | $7700.00 | Window Closed / Lapsed |