US4957876A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Resin sealed semiconductor device and a method for making the same
Assignee: Denso Corp
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Filing: 1990-01-17
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Granted: 1990-09-18
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Expires: 2010-01-17
Abstract
Abstract This invention provides a resin sealed IC regulator, which comprises a first connecting terminal electrically connected to a generator, a second connecting terminal electrically connected to a device other than the generator, a monolithic IC which controls an operation of the generator, mounted on a conductive member, and connected to both the first connecting terminal and the second connecting terminal and a resin molded portion of an electric insulating resin sealing the monolithic IC and at least a portion of the first and second connecting terminals are connected to the monolithic IC. Whereby an IC regulator which can be effectively used with an electrical load can be obtained, and further, an IC regulator having a more reliable control performance and able to be produced at low production cost can be obtained.
Inventors
- 👤 Hiroshi Shibata
- 👤 Fuyuki Maehara
- 👤 Akira Shintai
- 👤 Hidetoshi Kato
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-31 09:50
CPC Classifications
H; H02; H02J; H02J7/00; H02J7/14; H02J7/16; H02J7/24; H10; H10W; H10W70/00; H10W70/40; H10W70/421; H10W90/00; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121
Claims Analysis
Total Claims: 17
Claim 1
Independent Claim
208 words
A method of producing a resin molded IC regulator comprising: forming a lead frame, in which at least a first connecting terminal electrically connected to an electrical load and a second connecting terminal electrically connected to a device other than said electrical load are connected to a frame portion thereof, out of a plate made of an electric conductive material, mounting a monolithic IC controlling an operation of said electrical load on a conductive member and electrically connecting said monolithic IC to said lead frame, completely sealing said monolithic IC mounted on said conductive member and partially sealing at least a portion of said first and second connecting terminals electrically connected to said monolithic IC, with a first resin having an electrical insulating characteristic to make a first molded portion, so that said first and second connecting terminals are rigidly fixed thereby, separating said frame portion from said lead frame and making a second molded portion by an externally covering molding operation to cover at least a portion of said first molded portion and surround said second connecting terminal in such a way that said second connecting terminal is disposed inside a cavity provided on said second molded portion, with a second resin having an electric insulating characteristic.
Claim 2
Independent Claim
208 words
A method of producing a resin molded IC regulator comprising: forming a lead frame, in which at least a first connecting terminal electrically connected to an electrical load and a second connecting terminal electrically connected to a device other than said electrical load are connected to a frame portion thereof, out of a plate made of an electric conductive material, mounting a monolithic IC controlling an operation of said electrical load on a conductive member and electrically connecting said monolithic IC to said lead frame, completely sealing said monolithic IC mounted on said conductive member and partially sealing at least a portion of said first and second connecting terminals electrically connected to said monolithic IC, with a first resin having an electrical insulating characteristic to make a first molded portion, so that said first and second connecting terminals are rigidly fixed thereby, separating said frame portion from said lead frame and making a second molded portion by an externally covering molding operation to cover at least a portion of said first molded portion and surround said second connecting terminal in such a way that said second connecting terminal is disposed inside a cavity provided on said second molded portion, with a second resin having an electric insulating characteristic.
Claim 3
Dependent Claim
48 words
A method of producing a resin molded IC regulator according to claim 1, wherein said step for making a second molded portion comprises a step of forming a connector portion integrally molded with said second molded portion having a cavity therein, the second connecting terminal being surrounded thereby.
Claim 4
Dependent Claim
63 words
A method of producing a resin molded IC regulator according to claim 1, wherein the step of sealing with said first resin is performed before the step of separating said frame portion from said lead frame, and the step of making said second molded portion with said second resin is performed after the step of separating said frame portion from said lead frame.
Claim 5
Dependent Claim
120 words
A method of producing a resin molded IC regulator according to claim 1, wherein the step of making said second molded portion with the second resin is a process for molding resin by an externally covering molding operation to cover at least a portion of said first molded portion with a portion surrounding said second connecting terminal therewithin, and for sealing at least a portion of said first connecting terminal and second connecting terminal and performed before the step of separating said frame portion from said lead frame, and the step of sealing said monolithic IC with said first resin to make said first molded portion is performed after the step of separating said frame portion from said lead frame.
Claim 6
Dependent Claim
27 words
A method of producing a resin molded IC regulator according to claim 3, wherein said first resin and said second resin are the same kind of resin.
Claim 7
Dependent Claim
26 words
A method of producing a resin molded IC regulator according to claim 3, wherein said first resin and said second resin are different kinds of resin.
Claim 8
Dependent Claim
37 words
A method of producing a resin molded IC regulator according to claim 3, wherein said first resin and said second resin are different in mechanical strength represented by one of Izod impact strength and a bending strength.
Claim 9
Dependent Claim
28 words
A method of producing a resin molded IC regulator according to claim 6, wherein said second resin has the higher mechanical strength than that of the first resin.
Claim 10
Dependent Claim
33 words
A method of producing a resin molded IC regulator according to claim 6, wherein said first resin is made of a thermosetting resin and said second resin is made of a thermoplastic resin.
Claim 11
Dependent Claim
47 words
A method of producing resin molded IC regulator according to claim 9, wherein said second resin is molded in such a way that said second resin covers at least a portion of said first molded portion of said first resin to be held by said second resin.
Claim 12
Independent Claim
157 words
A method of producing resin molded IC regulator comprising: forming a lead frame, in which at least a first connecting terminal electrically connected to an electric load and a second connecting terminal electrically connected to a device other than said electric load are connected to a frame portion thereof, out of a plate made of electric conductive material, mounting a monolithic IC controlling an operation of said electric load, on a conductive member and electrically connecting said monolithic IC to said lead frame, sealing over all said monolithic IC completely and at least a portion of said first and second connecting terminals partially, with electric insulating resin, so that, said first and second connecting terminals are rigidly fixed thereby and simultaneously making a molded portion having a connector portion provided with a cavity portion with which said second connecting terminal is surrounded and integrated with said sealing portion, and separating said frame portion from said lead frame.
Claim 13
Independent Claim
157 words
A method of producing resin molded IC regulator comprising: forming a lead frame, in which at least a first connecting terminal electrically connected to an electric load and a second connecting terminal electrically connected to a device other than said electric load are connected to a frame portion thereof, out of a plate made of electric conductive material, mounting a monolithic IC controlling an operation of said electric load, on a conductive member and electrically connecting said monolithic IC to said lead frame, sealing over all said monolithic IC completely and at least a portion of said first and second connecting terminals partially, with electric insulating resin, so that, said first and second connecting terminals are rigidly fixed thereby and simultaneously making a molded portion having a connector portion provided with a cavity portion with which said second connecting terminal is surrounded and integrated with said sealing portion, and separating said frame portion from said lead frame.
Claim 14
Dependent Claim
36 words
A method of producing a resin molded IC regulator according to claim 11, wherein a tip end of said second connecting terminal is disposed inside of a cavity provided in said molded portion surrounding said terminal.
Claim 15
Independent Claim
94 words
A method of producing a resin molded IC regulator according to claims 1 or 11, wherein said lead frame has a configuration such that said second connecting terminal is connected to said lead frame through a connecting portion connected between said frame and a portion of said second connecting terminal except a tip portion thereof and the sealing operation or the molding operation is carried out in such a way that said connecting portion remain outside of said sealed or molded portion, and the separating operation is carried out by separating said connecting portion.
Claim 16
Independent Claim
137 words
A method of producing a resin molded IC regulator according to claims 1 or 11, wherein said lead frame has a configuration such that two outermost of said second connecting terminals are connected to said lead frame through a connecting portion connected between said frame and a portion of the second connecting terminal except for a tip portion thereof, and other inner second connecting terminals are connected to one of the first connecting terminals through an intermediate connecting portion connected to a portion of said second connecting terminal except for a tip portion thereof, and the sealing operation or the molding operation is carried out in such a way that said connecting portion remains outside said sealed or molded portion and the separating operation is carried out by separating said connecting portion and said intermediate connecting portion.
Claim 17
Dependent Claim
77 words
A method of producing a resin molded IC regulator according to claim 14, wherein said sealing operation or molding operation is carried out in such a way that said connecting portion remains outside of said sealed or molded portion and said intermediate connecting portion is inside of an aperture provided on said sealed or molded portion, and the separating operation is carried out by separating said connecting portion and said intermediate connecting portion appearing inside said aperture.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1993-09-17 | 1994-03-19 | 1994-09-18 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1997-09-17 | 1998-03-19 | 1998-09-18 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2001-09-17 | 2002-03-19 | 2002-09-18 | $7700.00 | Window Closed / Lapsed |