Light emitting chip parts

Abstract

Abstract PURPOSE:To mount a chip part with an LED on a printed substrate with good workability by previously mounting the LED on an insulating chip substrate. CONSTITUTION:The first and the second conductors 2, 2' are formed on the upper surface of an angular chip substrate or chipped substrate 1 consisting of insulating material. The first conductor 2 is provided with an extension 3 extended towards the second conductor 2' and a chip-shaped light emitting diode element 4 having a lower electrode and an upper electrode is mounted on the extension 3 by bonding connection. The rear of the chip part C composed by the above process is adhered to a printed substrate 7 by applying adhesive 9 to the rear of the chip part C. And next, the conductors 2, 2' on the chip part C and a conductor 8 on the printed substrate 7 are soldered or connected by conductive silver paste 10.

Inventors

• 👤 Tetsuhiro Kiyono
• 👤 Kouichi Kasuo
• 👤 Yoshizo Kubo

Bibliographic Details