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US5503286A
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US
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Electroplated solder terminal
Assignee: GlobalFoundries Inc
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Filing: 1994-06-28
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Granted: 1996-04-02
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Expires: 2014-06-28
Abstract
Abstract A process for an improved solder terminal is disclosed. The improved solder terminal is made of a bottom metallic adhesion layer, a CrCu intermediate layer on top of the adhesion layer, a solder bonding layer above the CrCu layer and a solder top layer. The adhesion layer is either TiW or TiN. A process for fabricating an improved terminal metal consists of depositing an adhesive metallic layer, a layer of CrCu over the adhesive layer and a layer of solder bonding material, over which a solder layer is formed in selective regions and the underlying layers are etched using solder regions as a mask.
Inventors
- 👤 Henry A. Nye, III
- 👤 Jeffrey F. Roeder
- 👤 Ho-Ming Tong
- 👤 Paul A. Totta
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 23:55
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/90; H10W72/01; H10W72/019; H10W72/012; H10W72/01951; H10W72/01953; H10W72/20; H10W72/251; H10W72/252; H10W72/29; H10W72/931; H10W72/934; H10W72/941; H10W72/9415
Claims Analysis
Total Claims: 18
Claim 1
Independent Claim
162 words
A method of fabricating an improved solder terminal on a substrate containing at least an electrically conducting member and further having a plurality of electrical contact regions separated by an insulator, comprising: depositing an adhesive metallic layer overlying said insulator and in contact with said electrical contact regions, selected from a group consisting essentially of TiW and TiN; depositing a CrCu alloy layer over and in contact with said adhesive metallic layer; said adhesive metallic layer is characterized by being selectively etchable over said electrically conducting member and said CrCu alloy layer; depositing a solder bondable metallic layer over and in contact with said CrCu layer; forming solder selectively over said solder bondable layer in selected locations; etching said solder bondable layer and CrCu layer using said solder as a mask and stopping on said adhesion layer; and etching said metallic adhesion layer using a process selective to solder, CrCu alloy layer, solder bonding layer and electrically conducting member in the substrate.
Claim 2
Independent Claim
162 words
A method of fabricating an improved solder terminal on a substrate containing at least an electrically conducting member and further having a plurality of electrical contact regions separated by an insulator, comprising: depositing an adhesive metallic layer overlying said insulator and in contact with said electrical contact regions, selected from a group consisting essentially of TiW and TiN; depositing a CrCu alloy layer over and in contact with said adhesive metallic layer; said adhesive metallic layer is characterized by being selectively etchable over said electrically conducting member and said CrCu alloy layer; depositing a solder bondable metallic layer over and in contact with said CrCu layer; forming solder selectively over said solder bondable layer in selected locations; etching said solder bondable layer and CrCu layer using said solder as a mask and stopping on said adhesion layer; and etching said metallic adhesion layer using a process selective to solder, CrCu alloy layer, solder bonding layer and electrically conducting member in the substrate.
Claim 3
Dependent Claim
23 words
A method of claim 1, wherein said adhesive metallic layer is formed by a process selected from sputtering, chemical vapor deposition and plating.
Claim 4
Dependent Claim
22 words
A method of claim 1, wherein said CrCu alloy layer is deposited by sputtering from an alloy target containing Cr and Cu.
Claim 5
Dependent Claim
22 words
A method of claim 1, wherein said CrCu alloy layer is formed by co-sputtering from a Cr target and a Cu target.
Claim 6
Dependent Claim
21 words
A method of claim 1, wherein said CrCu alloy layer is formed by co-evaporating from a Cr and a Cu source.
Claim 7
Dependent Claim
19 words
A method of claim 1, wherein said solder formed by electro plating through an insulating masking layer having apertures.
Claim 8
Dependent Claim
20 words
A method of claim 1, wherein said CrCu alloy layer and solder bonding layer are etched by an electro-etch process.
Claim 9
Dependent Claim
19 words
A method of claim 1, wherein said adhesion layer is etched by process using wet chemicals or a plasma.
Claim 10
Independent Claim
178 words
A method of fabricating an improved solder terminal on a substrate containing at least an electrically conducting member and further having a plurality of electrical contact regions separated by an insulator, comprising: depositing an adhesive metallic layer overlying said insulator and in contact with said electrical contact regions, said adhesive layer made of two layers, a bottom Ti layer and a top layer selected from a group consisting essentially of W, TiW and TiN; depositing a CrCu alloy layer over and in contact with said adhesive metallic layer; said adhesive metallic layer is characterized by being selectively etchable over said electrically conducting member and said CrCu alloy layer; depositing a solder bondable metallic layer over and in contact with said CrCu layer; forming solder selectively over said solder bondable layer in selected locations; etching said solder bondable layer and CrCu layer using said solder as a mask and stopping on said adhesion layer; and etching said metallic adhesion layer using a process selective to solder, CrCu alloy layer, solder bonding layer and electrically conducting member in the substrate.
Claim 11
Independent Claim
178 words
A method of fabricating an improved solder terminal on a substrate containing at least an electrically conducting member and further having a plurality of electrical contact regions separated by an insulator, comprising: depositing an adhesive metallic layer overlying said insulator and in contact with said electrical contact regions, said adhesive layer made of two layers, a bottom Ti layer and a top layer selected from a group consisting essentially of W, TiW and TiN; depositing a CrCu alloy layer over and in contact with said adhesive metallic layer; said adhesive metallic layer is characterized by being selectively etchable over said electrically conducting member and said CrCu alloy layer; depositing a solder bondable metallic layer over and in contact with said CrCu layer; forming solder selectively over said solder bondable layer in selected locations; etching said solder bondable layer and CrCu layer using said solder as a mask and stopping on said adhesion layer; and etching said metallic adhesion layer using a process selective to solder, CrCu alloy layer, solder bonding layer and electrically conducting member in the substrate.
Claim 12
Dependent Claim
23 words
A method of claim 9, wherein said adhesive metallic layer is formed by a process selected from sputtering, chemical vapor deposition and plating.
Claim 13
Dependent Claim
22 words
A method of claim 9, wherein said CrCu alloy layer is deposited by sputtering from an alloy target containing Cr and Cu.
Claim 14
Dependent Claim
22 words
A method of claim 9, wherein said CrCu alloy layer is formed by co-sputtering from a Cr target and a Cu target.
Claim 15
Dependent Claim
21 words
A method of claim 9, wherein said CrCu alloy layer is formed by co-evaporating from a Cr and a Cu source.
Claim 16
Dependent Claim
19 words
A method of claim 9, wherein said solder formed by electro plating through an insulating masking layer having apertures.
Claim 17
Dependent Claim
20 words
A method of claim 9, wherein said CrCu alloy layer and solder bonding layer are etched by an electro-etch process.
Claim 18
Dependent Claim
19 words
A method of claim 9, wherein said adhesion layer is etched by process using wet chemicals or a plasma.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-04-02 | 1999-10-02 | 2000-04-02 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-04-02 | 2003-10-02 | 2004-04-02 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-04-02 | 2007-10-02 | 2008-04-02 | $7700.00 | Window Closed / Lapsed |