Patent DE248166C successfully refreshed from Google Patents.
Patent US5502008A successfully refreshed from Google Patents.
US5502008A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method for forming metal plug and/or wiring metal layer
Assignee: Sony Corp
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Filing: 1994-11-21
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Granted: 1996-03-26
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Expires: 2014-11-21
Abstract
Abstract A method of forming a metal plug, including a step of flattening by polishing the surface of a contact plug which is formed by etching back a metal layer, for example, a deposited layer of Blk-W on a substrate. It also makes it possible to print a wiring metal layer by a lithographic process which has thus far been considered difficult to apply to Blk-W. In the method of the invention, a contact hole 3 is opened in an insulation film layer 2 on a substrate 1, and, after coating an adhesion layer 4, a metal layer 5 is deposited on the entire surface. Thereafter, the surface of the metal layer 5 is flattened by a polishing operation, and etched back to form a metal plug 7.
Inventors
- 👤 Hideaki Hayakawa
- 👤 Tetsuo Gocho
- 👤 Junichi Sato
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 23:23
CPC Classifications
H; H10; H10W; H10W20/00; H10W20/01; H10W20/031; H10W20/062; H10W20/056; Y; Y10; Y10S; Y10S148/00; Y10S148/02
Claims Analysis
Total Claims: 4
Claim 1
Independent Claim
109 words
A method of forming a metal plug in a contact hole provided in an insulation layer on a substrate, comprising the steps of: forming a non-flat metal layer in the contact hole to fill the contact hole and extend above the contact hole and laterally above a surface of the insulation layer, polishing a surface of the metal layer to planarize the metal layer surface; etching back the planarized metal layer to expose a surface of the insulation layer; and forming a coating film on the metal layer prior to the polishing step, wherein the polishing step is performed by polishing the coating film and the metal layer surface.
Claim 2
Independent Claim
109 words
A method of forming a metal plug in a contact hole provided in an insulation layer on a substrate, comprising the steps of: forming a non-flat metal layer in the contact hole to fill the contact hole and extend above the contact hole and laterally above a surface of the insulation layer, polishing a surface of the metal layer to planarize the metal layer surface; etching back the planarized metal layer to expose a surface of the insulation layer; and forming a coating film on the metal layer prior to the polishing step, wherein the polishing step is performed by polishing the coating film and the metal layer surface.
Claim 3
Independent Claim
113 words
A method of forming a wiring layer by filling a metal in a contact hole provided in an insulation layer on a substrate, comprising the steps of, forming a non-fiat metal layer in the contact hole to fill the contact hole and extend above the contact hole and laterally above a surface of the insulation layer, polishing a surface of the metal layer to planarize the metal layer surface; etching back the planarized metal layer to expose a surface of the insulation layer; and forming a coating film on the metal layer prior to the polishing step, wherein the polishing step is performed by polishing the coating film and the metal layer surface.
Claim 4
Independent Claim
113 words
A method of forming a wiring layer by filling a metal in a contact hole provided in an insulation layer on a substrate, comprising the steps of, forming a non-fiat metal layer in the contact hole to fill the contact hole and extend above the contact hole and laterally above a surface of the insulation layer, polishing a surface of the metal layer to planarize the metal layer surface; etching back the planarized metal layer to expose a surface of the insulation layer; and forming a coating film on the metal layer prior to the polishing step, wherein the polishing step is performed by polishing the coating film and the metal layer surface.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-03-26 | 1999-09-25 | 2000-03-26 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-03-26 | 2003-09-25 | 2004-03-26 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-03-26 | 2007-09-25 | 2008-03-26 | $7700.00 | Window Closed / Lapsed |