US5497032A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor device and lead frame therefore
Assignee: Kyushu Fujitsu Electronics Ltd
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Filing: 1994-03-16
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Granted: 1996-03-05
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Expires: 2014-03-16
Abstract
Abstract A semiconductor device having a package in which a semiconductor device is sealed includes a base, and a metallic film is formed on a surface of the base. The semiconductor chip is formed on the metallic film. A pad formed on the semiconductor chip is connected to the metallic film by a wire. A sealing layer is formed on the metallic film. Leads are formed on the glass layer. A connecting layer is formed on the metallic film and contains electrically conductive particles. The connecting layer is in contact with a lead for a power supply system and connecting the metallic film to the lead.
Inventors
- 👤 Kazuto Tsuji
- 👤 Yoshiyuki Yoneda
- 👤 Hideharu Sakoda
- 👤 Michio Sono
- 👤 Ichiro Yamaguchi
- 👤 Toshio Hamano
- 👤 Yoshihiro Kubota
- 👤 Michio Hayakawa
- 👤 Yoshihiko Ikemoto
- 👤 Yukio Saigo
- 👤 Naomi Miyaji
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-06 19:40
CPC Classifications
H; H10; H10W; H10W76/00; H10W76/10; H10W76/12; H10W76/15; H10W76/157; H10W40/00; H10W40/70; H10W40/77; H10W40/778; H10W70/00; H10W70/40; H10W70/421; H10W70/424; H10W70/456; H10W70/457; H10W72/00; H10W72/30; H10W72/50; H10W76/60; H10W70/60; H10W70/67; H10W70/68; H10W70/682; H10W70/685; H10W72/071; H10W72/073; H10W72/07331; H10W72/07336; H10W72/075; H10W72/07551; H10W72/07554; H10W72/321; H10W72/325; H10W72/351; H10W72/352; H10W72/541; H10W72/5449; H10W72/547; H10W72/5473; H10W72/551; H10W72/552; H10W72/5524; H10W72/851; H10W72/874; H10W72/884; H10W74/00; H10W74/10; H10W90/00; H10W90/701; H10W90/731; H10W90/736; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 48
Claim 1
Independent Claim
113 words
A semiconductor device having a package in which a semiconductor chip is sealed, said semiconductor device comprising: a base; a metallic film formed on a surface of the base, the semiconductor chip being formed on the metallic film, and a pad formed on the semiconductor chip being connected to the metallic film by a wire; a sealing layer formed on the metallic film; a plurality of leads formed on the sealing layer; and a connecting layer formed on the metallic film and containing electrically conductive particles, said connecting layer being in contact with a lead of said plurality of leads for a power supply system and connecting the metallic film to said lead.
Claim 2
Dependent Claim
113 words
A semiconductor device having a package in which a semiconductor chip is sealed, said semiconductor device comprising: a base; a metallic film formed on a surface of the base, the semiconductor chip being formed on the metallic film, and a pad formed on the semiconductor chip being connected to the metallic film by a wire; a sealing layer formed on the metallic film; a plurality of leads formed on the sealing layer; and a connecting layer formed on the metallic film and containing electrically conductive particles, said connecting layer being in contact with a lead of said plurality of leads for a power supply system and connecting the metallic film to said lead.
Claim 3
Dependent Claim
33 words
The semiconductor device as claimed in claim 1, wherein a top surface of the sealing layer is located at a level approximately identical to that of a top surface of the connecting layer.
Claim 4
Dependent Claim
48 words
The semiconductor device as claimed in claim 1, wherein: said lead for the power supply system has a bent end portion located at a level lower than a top of the sealing layer; and the connecting layer is in contact with the bent end portion of said lead.
Claim 5
Dependent Claim
25 words
The semiconductor device as claimed in claim 1, wherein said base has a projection above which the connecting layer is located via the metallic film.
Claim 6
Dependent Claim
44 words
The semiconductor device as claimed in claim 1, wherein: the lead for the power supply system has an end portion which is in contact with the connecting layer; and said end portion has a rough surface which facilitates adhesive connection with the connecting layer.
Claim 7
Dependent Claim
45 words
The semiconductor device as claimed in claim 1, wherein: the lead for the power supply system has an end portion which is in contact with the connecting layer; and said end portion has a plurality of dimples which facilitate adhesive connection with the connecting layer.
Claim 8
Dependent Claim
46 words
The semiconductor device as claimed in claim 1, wherein: the lead for the power supply system has an end portion which is in contact with the connecting layer; and said end portion has a plurality of through holes which facilitate adhesive connection with the connecting layer.
Claim 9
Dependent Claim
21 words
The semiconductor device as claimed in claim 1, wherein the connecting layer comprises a refractory-glass layer containing the electrically conductive particles.
Claim 10
Dependent Claim
15 words
The semiconductor device as claimed in claim 1, wherein the base comprises a ceramic material.
Claim 11
Dependent Claim
106 words
A semiconductor device having a package in which a semiconductor chip is sealed, said semiconductor device comprising: a base; a metallic film formed on a surface of the base, said metallic film having a plurality of separated areas, the semiconductor chip being formed on one of the plurality of separated areas, said semiconductor chip including pads thereupon; a sealing layer formed on the metallic film; a plurality of leads formed on the sealing layer; and wires connecting the pads on the semiconductor chip to said plurality of leads and the plurality of separated areas and connecting the plurality of leads to the plurality of separated areas.
Claim 12
Dependent Claim
106 words
A semiconductor device having a package in which a semiconductor chip is sealed, said semiconductor device comprising: a base; a metallic film formed on a surface of the base, said metallic film having a plurality of separated areas, the semiconductor chip being formed on one of the plurality of separated areas, said semiconductor chip including pads thereupon; a sealing layer formed on the metallic film; a plurality of leads formed on the sealing layer; and wires connecting the pads on the semiconductor chip to said plurality of leads and the plurality of separated areas and connecting the plurality of leads to the plurality of separated areas.
Claim 13
Dependent Claim
29 words
The semiconductor device as claimed in claim 10, wherein the plurality of separated areas form a power supply system which comprises a power supply line and a ground line.
Claim 14
Dependent Claim
93 words
The semiconductor device as claimed in claim 10, wherein: one of the pads formed on the semiconductor chip and one of the leads or the separated areas are connected by a plurality of wires or a single wire of a diameter approximately equal to the sum of diameters of said plurality of wires; and one of the separated areas and one lead of the plurality of leads are connected by a plurality of wires or a single wire of a diameter approximately equal to the sum of diameters of said plurality of wires.
Claim 15
Dependent Claim
37 words
The semiconductor device as claimed in claim 10, wherein the plurality of leads comprise a metallic film formed on first portions which in contact with the sealing layer and second portions to which the wires are connected.
Claim 16
Dependent Claim
61 words
The semiconductor device as claimed in claim 10, further comprising a glass layer formed on the metallic film so that the glass layer is separated from the sealing layer and an opening is formed between the glass layer and the sealing layer, the wires connecting the plurality of leads and the separated areas of the metallic film extending through said opening.
Claim 17
Dependent Claim
31 words
The semiconductor device as claimed in claim 10, wherein: said plurality of leads comprise power-supply-system leads and signal-system leads; and the power-supply-system leads are wider and shorter than the signal-system leads.
Claim 18
Dependent Claim
39 words
The semiconductor device as claimed in claim 10, wherein a first one of the separated areas of the metallic film is formed so as to be surrounded by a second one of the separated areas of the metallic film.
Claim 19
Dependent Claim
38 words
The semiconductor device as claimed in claim 16, wherein said first one of the separated areas carries a first potential of a power supply system and said second one of the separated areas carries a second potential thereof.
Claim 20
Dependent Claim
45 words
The semiconductor device as claimed in claim 10, wherein the plurality of separated areas except for said one of the separated areas of the metallic film on which the semiconductor chip is mounted are located so as to surround said one of the separated areas.
Claim 21
Dependent Claim
55 words
The semiconductor device as claimed in claim 10, wherein: the wires comprise first wires for connecting the pads formed on the semiconductor device to signal-system leads, and second wires for connecting the separated areas of the metallic film to the pads on the semiconductor device; and the second wires are shorter than the first wires.
Claim 22
Dependent Claim
44 words
The semiconductor device as claimed in claim 10, wherein: the plurality of leads comprise signal-system leads and power-supply-system leads; the semiconductor device comprises a glass layer formed on the metallic film; and end portions of the signal-system leads are mounted on the glass layer.
Claim 23
Dependent Claim
18 words
The semiconductor device as claimed in claim 20, wherein said glass layer comprises a plurality of separated areas.
Claim 24
Dependent Claim
54 words
The semiconductor device as claimed in claim 10, wherein: the plurality of leads comprise signal-system leads and power-supply-system leads; the semiconductor device comprises a crystalline refractory-glass layer formed on the metallic film; end portions of the signal-system leads are mounted on the crystalline refractory-glass layer; and the sealing layer comprises an amorphous refractory-glass layer.
Claim 25
Dependent Claim
36 words
The semiconductor device as claimed in claim 10, wherein: the base comprises a recess portion; and the metallic film is formed on a bottom surface of the recess portion and a top portion of the base.
Claim 26
Dependent Claim
48 words
The semiconductor device as claimed in claim 10, wherein: the base comprises a recess portion having at least one step portion; and the metallic film is formed on a bottom surface of the recess portion, said at least one step portion and a top portion of the base.
Claim 27
Dependent Claim
17 words
The semiconductor device as claimed in claim 10, further comprising a cap connected to the sealing layer.
Claim 28
Dependent Claim
36 words
The semiconductor device as claimed in claim 25, wherein the plurality of leads comprise bent portions so that the base faces a printed circuit board when the semiconductor device is mounted on the printed circuit board.
Claim 29
Dependent Claim
36 words
The semiconductor device as claimed in claim 25, wherein the plurality of leads comprise bent portions so that the cap faces a printed circuit board when the semiconductor device is mounted on the printed circuit board.
Claim 30
Dependent Claim
15 words
The semiconductor device as claimed in claim 10, wherein the base comprises a ceramic material.
Claim 31
Dependent Claim
32 words
The semiconductor device as claimed in claim 27, further comprising a heat radiating member mounted on a surface of the base opposite to a surface on which the metallic member is formed.
Claim 32
Dependent Claim
122 words
A semiconductor device having a package in which a semiconductor chip is sealed, said semiconductor device comprising: a stage having a plurality of separated areas, the semiconductor chip being formed on one of the plurality of separated areas, the separated areas being used for a power supply system including ground, and being supported by resin of the package, a back surface of the stage opposite to a surface thereof on which the semiconductor chip is mounted being exposed from the package, the stage comprising an electrically conductive material; a plurality of leads extending from the package, said leads being separate from said separated areas; and wires connecting pads formed on the semiconductor chip to the plurality of leads and the separated areas.
Claim 33
Dependent Claim
122 words
A semiconductor device having a package in which a semiconductor chip is sealed, said semiconductor device comprising: a stage having a plurality of separated areas, the semiconductor chip being formed on one of the plurality of separated areas, the separated areas being used for a power supply system including ground, and being supported by resin of the package, a back surface of the stage opposite to a surface thereof on which the semiconductor chip is mounted being exposed from the package, the stage comprising an electrically conductive material; a plurality of leads extending from the package, said leads being separate from said separated areas; and wires connecting pads formed on the semiconductor chip to the plurality of leads and the separated areas.
Claim 34
Dependent Claim
15 words
The semiconductor device as claimed in claim 30, wherein the separated areas are concentrically arranged.
Claim 35
Dependent Claim
24 words
The semiconductor device as claimed in claim 30, wherein the stage and the plurality of leads are parts of an integrally formed lead frame.
Claim 36
Dependent Claim
37 words
The semiconductor device as claimed in claim 30, wherein at least one of the separated areas other than said one of the separated areas on which the semiconductor chip is mounted comprises a plurality of divided areas.
Claim 37
Dependent Claim
22 words
The semiconductor device as claimed in claim 30, wherein the plurality of leads comprise leads having end portions which overlap the stage.
Claim 38
Dependent Claim
26 words
The semiconductor device as claimed in claim 34, further comprising an insulating adhesive tape formed on the stage and support the end portions of said leads.
Claim 39
Dependent Claim
30 words
The semiconductor device as claimed in claim 30, wherein the plurality of leads comprise leads having end portions which overlap the stage and is directly in contact with the stage.
Claim 40
Dependent Claim
23 words
The semiconductor device as claimed in claim 30, further comprising wires connecting the plurality of leads to the separated areas of the stage.
Claim 41
Dependent Claim
28 words
The semiconductor device as claimed in claim 30, wherein said one of the separated areas on which the semiconductor chip is mounted comprises a plurality of separated parts.
Claim 42
Dependent Claim
46 words
The semiconductor device as claimed in claim 30, further comprising electrodes formed on back surfaces of each of the plurality of leads, the electrodes being electrically connected to patterns formed on a printed circuit board when the semiconductor device is mounted on the printed circuit board.
Claim 43
Dependent Claim
14 words
The semiconductor device as claimed in claim 39, wherein the electrodes comprise solder bumps.
Claim 44
Dependent Claim
40 words
The semiconductor device as claimed in claim 30, wherein the plurality of leads comprise bent portions so that the back surface of the stage faces a printed circuit board when the semiconductor device is mounted on the printed circuit board.
Claim 45
Dependent Claim
37 words
The semiconductor device as claimed in claim 30, wherein the plurality of leads comprise bent portion so that the back surface of the stage faces upward when the semiconductor device is mounted on a printed circuit board.
Claim 46
Dependent Claim
22 words
The semiconductor device as claimed in claim 42, further comprising a heat radiating member mounted on the back surface of the stage.
Claim 47
Dependent Claim
15 words
The semiconductor device as claimed in claim 30, wherein said package comprises a plastic package.
Claim 48
Dependent Claim
21 words
The semiconductor device as claimed in claim 30, wherein the plurality of leads comprise outer lead portions coated with protection films.
References Cited (Backward Citations)
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JPS62276863A
Cited
US4884124A
Cited
JPH01251748A
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US5021865A
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US5053855A
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-03-05 | 1999-09-04 | 2000-03-05 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-03-05 | 2003-09-04 | 2004-03-05 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-03-05 | 2007-09-04 | 2008-03-05 | $7700.00 | Window Closed / Lapsed |