US5053855A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Plastic molded-type semiconductor device
Assignee: Mitsubishi Electric Corp
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Filing: 1990-09-05
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Granted: 1991-10-01
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Expires: 2010-09-05
Abstract
Abstract A semiconductor device comprises a die pad having first and second surfaces; a semiconductor chip having a plurality of electrodes and mounted on the first surface of the die pad; a radiator attached by caulking to the second surface of the die pad; a plurality of leads each of which has one end electrically connected to a corresponding electrode of the chip; and a resin package in which the die pad, the semiconductor chip, the radiator and the ends of the leads are molded. This semiconductor device exhibits excellent thermal radiator properties.
Inventors
- 👤 Kazunari Michii
- 👤 Tatsuya Hirai
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 19:18
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/411; H10W40/00; H10W40/70; H10W40/77; H10W40/778; H10W70/461; H10W72/00; H10W72/50; H10W72/541; H10W72/5449; H10W72/551; H10W72/552; H10W72/5522; H10W72/90; H10W72/931; H10W72/932; H10W74/00; H10W90/00; H10W90/701; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 14
Claim 1
Independent Claim
120 words
A semiconductor device comprising: a die pad having a chip mounting portion for mounting a semiconductor chip and a heat radiator mounting portion spaced from said chip mounting portion; a semiconductor chip mounted on the chip mounting portion of said die pad and having a plurality of electrodes; a heat radiator mounted on said heat radiator mounting portion of said die pad; and a resin encapsulating said semiconductor chip, said die pad, and at least part of said heat radiator, part of said resin being disposed between said chip mounting portion and said heat radiator mounting portion, wherein said heat radiator, said heat radiator mounting portion, part of said resin, and said semiconductor chip are successively disposed in a stack.
Claim 2
Dependent Claim
120 words
A semiconductor device comprising: a die pad having a chip mounting portion for mounting a semiconductor chip and a heat radiator mounting portion spaced from said chip mounting portion; a semiconductor chip mounted on the chip mounting portion of said die pad and having a plurality of electrodes; a heat radiator mounted on said heat radiator mounting portion of said die pad; and a resin encapsulating said semiconductor chip, said die pad, and at least part of said heat radiator, part of said resin being disposed between said chip mounting portion and said heat radiator mounting portion, wherein said heat radiator, said heat radiator mounting portion, part of said resin, and said semiconductor chip are successively disposed in a stack.
Claim 3
Dependent Claim
25 words
The semiconductor device according to claim 1 including a plurality of leads, each lead being electrically connected to a corresponding electrode on said semiconductor chip.
Claim 4
Dependent Claim
33 words
The semiconductor device according to claim 1 wherein said heat radiator mounting portion includes an opening and said radiator includes a projection disposed in the opening and engaging said heat radiator mounting portion.
Claim 5
Dependent Claim
34 words
The semiconductor device according to claim 3 wherein said projection includes a head disposed opposite said heat radiator and said head is at least partially deformed mounting said heat radiator to said die pad.
Claim 6
Dependent Claim
44 words
The semiconductor device according to claim 3 wherein said semiconductor chip has a first surface on which said plurality of electrodes are disposed and a second surface opposite said first surface mounted on said chip mounting portion of said die pad opposite said opening.
Claim 7
Dependent Claim
25 words
A semiconductor device according to claim 5 wherein said plurality of electrodes are disposed along a periphery of said first surface of said semiconductor chip.
Claim 8
Dependent Claim
13 words
The semiconductor device according to claim 1 wherein said die pad is unitary.
Claim 9
Dependent Claim
15 words
The semiconductor device according to claim 1, wherein said heat radiator is formed of copper.
Claim 10
Dependent Claim
98 words
A semiconductor device comprising: a unitary die pad having a chip mounting portion including opposed, generally parallel first and second surfaces, a plurality of leads, two concave portions extending away from said second surface, and a heat radiator mounting portion spaced from said second surface and joining said concave portions; a semiconductor chip mounted on the chip mounting portion of said die pad and having a plurality of electrodes; a plurality of wires electrically connecting said leads to respective electrodes of said semiconductor chip; and a heat radiator mounted on said radiator mounting portion of said die pad.
Claim 11
Dependent Claim
98 words
A semiconductor device comprising: a unitary die pad having a chip mounting portion including opposed, generally parallel first and second surfaces, a plurality of leads, two concave portions extending away from said second surface, and a heat radiator mounting portion spaced from said second surface and joining said concave portions; a semiconductor chip mounted on the chip mounting portion of said die pad and having a plurality of electrodes; a plurality of wires electrically connecting said leads to respective electrodes of said semiconductor chip; and a heat radiator mounted on said radiator mounting portion of said die pad.
Claim 12
Dependent Claim
23 words
The semiconductor device according to claim 9 including a resin package body encapsulating said semiconductor chip, said die pad, and said heat radiator.
Claim 13
Dependent Claim
34 words
The semiconductor device according to claim 9 wherein said heat radiator mounting portion includes an opening and said heat radiator includes a projection disposed in the opening and engaging said heat radiator mounting portion.
Claim 14
Dependent Claim
34 words
The semiconductor device according to claim 11 wherein said projection includes a head disposed opposite said heat radiator and said head is at least partially deformed mounting said heat radiator to said die pad.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1994-09-30 | 1995-04-01 | 1995-10-01 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1998-09-30 | 1999-04-01 | 1999-10-01 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2002-09-30 | 2003-04-01 | 2003-10-01 | $7700.00 | Window Closed / Lapsed |