Patent US5495665A successfully refreshed from Google Patents.
US5495665A
Expired / Lapsed
US
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Process for providing a landless via connection
Assignee: International Business Machines Corp
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Filing: 1994-11-04
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Granted: 1996-03-05
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Expires: 2014-11-04
Abstract
Abstract A process for connecting at least two electrically conductive patterns through a dielectric material by a landless electrical connection is provided. The process includes providing a composite containing a dielectric substrate having a conductive plane on at least one of its major surfaces and a temporary support layer covering the conductive plane. Blind vias are provided in the dielectric substrate and are plated with an electrically conductive material. The temporary support layer is removed thereby providing a landless electrical connection through the dielectric material and the conductive plane is available for providing external electrical conductive pattern.
Inventors
- 👤 Richard W. Carpenter
- 👤 Robert E. Ruane
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 20:27
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/40; H05K3/42; H05K3/421; H05K1/00; H05K1/02; H05K1/11; H05K1/111; H05K1/112; H05K1/113; H05K3/0097; H05K3/46; H05K3/4611; H05K3/4623; H05K2201/00; H05K2201/03; H05K2201/0332; H05K2201/0335; H05K2201/0355; H05K2201/0388; H05K2201/0394; H05K2201/09; H05K2201/09209; H05K2201/09372; H05K2201/09472; H05K2201/095; H05K2201/09509; H05K2201/09527; H05K2203/00; H05K2203/01; H05K2203/0147; H05K2203/0156; H05K2203/15; H05K2203/1536; H05K3/10; H05K3/20; H05K3/425; H05K3/427; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49126
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
116 words
A process for connecting at least two electrically conductive patterns through a dielectric material by a landless electrical connection which comprises: (a) providing a dielectric substrate having a conductive plane on one of the major surfaces thereof and a temporary support layer covering said conductive plane, where by said conductive plane is located between said dielectric substrate and said temporary support layers; (b) providing blind vias in said dielectric substrate; (c) plating vias in said dielectric substrate and on said dielectric substrate with an electrically conductive material; (d) removing said temporary support layer to thereby provide a landless electrical connection through said dielectric material whereby said conductive plane is available for providing external electrical conductive pattern.
Claim 2
Dependent Claim
116 words
A process for connecting at least two electrically conductive patterns through a dielectric material by a landless electrical connection which comprises: (a) providing a dielectric substrate having a conductive plane on one of the major surfaces thereof and a temporary support layer covering said conductive plane, where by said conductive plane is located between said dielectric substrate and said temporary support layers; (b) providing blind vias in said dielectric substrate; (c) plating vias in said dielectric substrate and on said dielectric substrate with an electrically conductive material; (d) removing said temporary support layer to thereby provide a landless electrical connection through said dielectric material whereby said conductive plane is available for providing external electrical conductive pattern.
Claim 3
Dependent Claim
13 words
The process of claim 1 wherein said dielectric substrate includes an epoxy composition.
Claim 4
Dependent Claim
26 words
The process of claim 1 which further includes providing release layer on said dielectric substrate and removing said release layer prior to the plating of vias.
Claim 5
Dependent Claim
50 words
The process of claim 1 which includes providing at least two dielectric substrates each having a conductive plane on a major surface thereof with conductive plane of one substrate facing the conductive plane of the other substrate, and a temporary support layer located between the conductive plane of opposing substrates.
Claim 6
Dependent Claim
18 words
The process of claim 1 wherein said temporary support comprises a polyimide from diphenyltetracarboxylic dianhydride and a diamine.
Claim 7
Dependent Claim
14 words
The process of claim 1 wherein said blind vias are provided by laser drilling.
Claim 8
Dependent Claim
17 words
The process of claim 1 wherein said vias are about 1 to about 10 mils in diameter.
Claim 9
Dependent Claim
11 words
The process of claim 1 wherein vias are plated with copper.
Claim 10
Dependent Claim
24 words
The process of claim 1 wherein an electrically conductive signal layer is provided on said dielectric substrate prior to removing said temporary support layer.
Claim 11
Dependent Claim
26 words
The process of claim 1 which further involves including the product from step (d) in a composite whereby said conductive plane provides external electrical conductive pattern.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-03-05 | 1999-09-04 | 2000-03-05 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-03-05 | 2003-09-04 | 2004-03-05 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-03-05 | 2007-09-04 | 2008-03-05 | $7700.00 | Window Closed / Lapsed |