Process for correcting warped surface of plastic encapsulated semiconductor device

Claim 1

A method of manufacturing a plastic seal semiconductor device, comprising the steps of: mounting a plurality of semiconductor elements in spaced relation on a single lead frame, connecting connection regions of a plurality of leads of said lead frame to a plurality of connecting portions of said semiconductor elements by thin metal wires, and forming plastic seal portions each surrounding each of said semiconductor elements, said thin metal wires, said connection regions of said leads and peripheral areas thereof; correcting warpage of upper and lower main surfaces of said plastic seal portions by clamping said plastic seal portions within said single lead frame between upper and lower heating plates of a heating device while applying heat to said plastic seal portions through said heating plates, transporting said single lead frame from said heating device to a cooling device comprising upper and lower cooling plates, and clamping said plastic seal portions between said upper and lower cooling plates; separating an intermediate product of a plurality of plastic seal semiconductor devices from said lead frame, said intermediate product being prepared by cutting the plurality of leads to separate the plurality of said semiconductor elements from one another; and shaping the plurality of said leads of said intermediate products separated from said lead frame, wherein said lead frame is transported between said heating device and said cooling device on a transporting plate through which heat is applied to lower surfaces of said semiconductor elements in said heating device and through which heat is extracted from said lower surface of said semiconductor elements in said cooling device.

Claim 2

A method of manufacturing a plastic seal semiconductor device, comprising the steps of: mounting a plurality of semiconductor elements in spaced relation on a single lead frame, connecting connection regions of a plurality of leads of said lead frame to a plurality of connecting portions of said semiconductor elements by thin metal wires, and forming plastic seal portions each surrounding each of said semiconductor elements, said thin metal wires, said connection regions of said leads and peripheral areas thereof; correcting warpage of upper and lower main surfaces of said plastic seal portions by clamping said plastic seal portions within said single lead frame between upper and lower heating plates of a heating device while applying heat to said plastic seal portions through said heating plates, transporting said single lead frame from said heating device to a cooling device comprising upper and lower cooling plates, and clamping said plastic seal portions between said upper and lower cooling plates; separating an intermediate product of a plurality of plastic seal semiconductor devices from said lead frame, said intermediate product being prepared by cutting the plurality of leads to separate the plurality of said semiconductor elements from one another; and shaping the plurality of said leads of said intermediate products separated from said lead frame, wherein said lead frame is transported between said heating device and said cooling device on a transporting plate through which heat is applied to lower surfaces of said semiconductor elements in said heating device and through which heat is extracted from said lower surface of said semiconductor elements in said cooling device.

Claim 10

A method of manufacturing a semiconductor device comprising the steps of: sealing each of a plurality of semiconductor elements mounted on a single lead frame with a resin and hardening said resin to form an intermediate device, said intermediate device thereby having a plurality of plastic seal portions each containing an associated one of said semiconductor elements therein, at least one of said plastic seal portions being warped to have a warped surface; placing said intermediate device on a transporting plate; moving said transporting plate having thereon said intermediate device into a heating device having a pair of heating plates; clamping and heating said plastic seal portions of said intermediate device in parallel to one another by said pair of heating plates with said transporting plate inserted between one of said pair of heating plates and each of said plastic seal portions; taking out said transporting plate having thereon said intermediate device from said heating device and then moving said transporting plate having thereon said intermediate device into a cooling device having a pair of cooling plates; and clamping and cooling said plastic seal portions of said intermediate device in parallel to one another by said pair of cooling plates with said transporting plate inserted between one of said cooling plates and each of said plastic seal portions; whereby said warped surface of said at least one of said plastic seal portions is corrected to a substantially flat surface.

Claim 11

A method of manufacturing a semiconductor device comprising the steps of: sealing each of a plurality of semiconductor elements mounted on a single lead frame with a resin and hardening said resin to form an intermediate device, said intermediate device thereby having a plurality of plastic seal portions each containing an associated one of said semiconductor elements therein, at least one of said plastic seal portions being warped to have a warped surface; placing said intermediate device on a transporting plate; moving said transporting plate having thereon said intermediate device into a heating device having a pair of heating plates; clamping and heating said plastic seal portions of said intermediate device in parallel to one another by said pair of heating plates with said transporting plate inserted between one of said pair of heating plates and each of said plastic seal portions; taking out said transporting plate having thereon said intermediate device from said heating device and then moving said transporting plate having thereon said intermediate device into a cooling device having a pair of cooling plates; and clamping and cooling said plastic seal portions of said intermediate device in parallel to one another by said pair of cooling plates with said transporting plate inserted between one of said cooling plates and each of said plastic seal portions; whereby said warped surface of said at least one of said plastic seal portions is corrected to a substantially flat surface.