Method and device for preventing warpage of semiconductor device

Abstract

Abstract PURPOSE:To obtain a semiconductor device of excellent quality with no warp, by pressing the upper and the lower surfaces of the package of a molded article, and cooling it with parallel planes, immediately after transfer molding. CONSTITUTION:Immediately after transfer molding, the upper and the lower surfaces of the package 7 of a molded article taken out from the metal mold of a molding machine is pressed and cooled with parallel planes. The title warp preventive device comprises a pair of pressing boards 20, 23 and pressing means 26, 27. The pressing boards 20, 23 have a sending means to send cooling medium, and passageways 20b, 23b through which the cooling medium sent from the sending means flows, and are provided with a pair of upper and lower planes 20a, 23a which face each other in parallel. The pressing means 26, 27 move at least one of the pressing boards 20, 23 up and down, and press a package 7 between the facing planes 20a, 23a. The above cooling medium is, for example, water at a temperature of 5-10 deg.C. The package hardens without warping during contraction process at the time of cooling, and thereby preventing the warp of package.

Inventors

• 👤 Seiichi Sugimoto

Bibliographic Details