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US5474877A Expired / Lapsed US ⏱️ 0.0 years remaining

Method for developing a resist pattern

Assignee: NEC Corp
•
Filing: 1994-02-24
•
Granted: 1995-12-12
•
Expires: 2014-02-24
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Abstract

Abstract A photoresist pattern developed on a semiconductor substrate is rinsed by rinsing liquid. At this rinsing step, the rinsing liquid is heated to be decreased in surface tension, so that the collapse of the photoresist pattern is avoided.

Inventors

  • 👤 Katsumi Suzuki

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-08 18:36
CPC Classifications
G; G03; G03F; G03F7/00; G03F7/26; G03F7/30; G03F7/3021

Claims Analysis

Total Claims: 7
Claim 1
Independent Claim 108 words
A method for developing a photoresist pattern, comprising the steps of: coating a photoresist film on a semiconductor substrate; exposing said photoresist film on said semiconductor substrate to a predetermined pattern; supplying developer on said photoresist film on said semiconductor substrate to develop said photoresist pattern; heating rinsing liquid to its boiling point or within several degrees thereof; and thereafter supplying said heated rinsing liquid on said photoresist pattern developed on said semiconductor substrate to rinse said photoresist pattern, while separately heating a surface of said semiconductor substrate having said photoresist pattern thereon to a predetermined temperature of 50° to 100° C. during said rinsing liquid supplying step.
Claim 2
Independent Claim 108 words
A method for developing a photoresist pattern, comprising the steps of: coating a photoresist film on a semiconductor substrate; exposing said photoresist film on said semiconductor substrate to a predetermined pattern; supplying developer on said photoresist film on said semiconductor substrate to develop said photoresist pattern; heating rinsing liquid to its boiling point or within several degrees thereof; and thereafter supplying said heated rinsing liquid on said photoresist pattern developed on said semiconductor substrate to rinse said photoresist pattern, while separately heating a surface of said semiconductor substrate having said photoresist pattern thereon to a predetermined temperature of 50° to 100° C. during said rinsing liquid supplying step.
Claim 3
Dependent Claim 35 words
A method for developing a photoresist pattern, according to claim 1, wherein: said surface of said semiconductor substrate is heated to said predetermined temperature by heating a support on which said semiconductor substrate is supported.
Claim 4
Dependent Claim 35 words
A method for developing a photoresist pattern, according to claim 1, wherein: said rinsing liquid is at least one of water and alcohol; and said predetermined temperature is the boiling point of said rinsing liquid.
Claim 5
Dependent Claim 41 words
A method for developing a photoresist pattern, according to claim 1, wherein: said semiconductor substrate is fixed on a first semiconductor substrate holder at said developer supplying step, and on a second semiconductor substrate holder at said rinsing liquid supplying step.
Claim 6
Dependent Claim 30 words
A method for developing a photoresist pattern, according to claim 1, wherein: said surface of said semiconductor substrate is heated to be said predetermined temperature by an infrared ray lamp.
Claim 7
Dependent Claim 37 words
A method for developing a photoresist pattern, according to claim 1, wherein said heating of said surface is effected by supplying steam on said photoresist pattern developed on said semiconductor substrate during said rinsing liquid supplying step.

References Cited (Backward Citations)

JPS5258374A Cited
JPS58102942A Cited
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USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1998-12-11 1999-06-12 1999-12-12 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2002-12-11 2003-06-12 2003-12-12 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2006-12-11 2007-06-12 2007-12-12 $7700.00 Window Closed / Lapsed

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