Patent US5443672A successfully refreshed from Google Patents.
US5443672A
Expired / Lapsed
US
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Process for coating circuit boards
Assignee: EIDP Inc
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Filing: 1994-10-04
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Granted: 1995-08-22
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Expires: 2014-10-04
Abstract
Abstract A process is disclosed for coating a circuit board with a photopolymerizable material which is applied by extension at temperatures of 100° to 180° C. followed by distributing the material under pressure by a roller.
Inventors
- 👤 Reiner Stoll
- 👤 Britta Schulmeyer
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-08 22:21
CPC Classifications
B; B32; B32B; B32B37/00; B32B37/14; B32B37/15; B32B37/153; B32B37/06; G; G03; G03F; G03F7/00; G03F7/16; H; H05; H05K; H05K3/00; H05K3/0091; H05K3/0094; B32B2305/00; B32B2305/77; B32B2307/00; B32B2307/20; B32B2307/202; B32B2309/00; B32B2309/02; B32B2311/00; B32B2311/12; B32B2457/00; B32B2457/08; H05K2201/00; H05K2201/09; H05K2201/09209; H05K2201/095; H05K2201/0959; H05K2203/00; H05K2203/01; H05K2203/0104; H05K2203/0126; H05K2203/0143; H05K2203/02; H05K2203/0278; H05K2203/07; H05K2203/0756; H05K2203/0759; H05K3/30; H05K3/32; H05K3/34; H05K3/3452; H05K3/40; H05K3/42; H05K3/425; H05K3/427
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
72 words
A process for a coating circuit board with a photopolymerizable material containing a thermoplastic, polymeric binder, an addition-polymerizable, ethylenically unsaturated compound, and an initiator activatable by radiation, comprising the steps of (a) applying by extrusion the photopolymerizable material at a temperature of 100° to 180° C. onto a surface of the circuit board and (b) distributing the photopolymerizable material under pressure over the surface of the board by at least one roller.
Claim 2
Dependent Claim
72 words
A process for a coating circuit board with a photopolymerizable material containing a thermoplastic, polymeric binder, an addition-polymerizable, ethylenically unsaturated compound, and an initiator activatable by radiation, comprising the steps of (a) applying by extrusion the photopolymerizable material at a temperature of 100° to 180° C. onto a surface of the circuit board and (b) distributing the photopolymerizable material under pressure over the surface of the board by at least one roller.
Claim 3
Dependent Claim
28 words
The process for coating a circuit board according to claim 1, characterized in that the circuit board has at least one of through-plated holes or a circuit pattern.
Claim 4
Dependent Claim
40 words
The process for coating a circuit board according to claim 2, wherein the circuit board has through plated holes and the pressure of the rollers and the viscosity are adjusted so that the photopolymerizable material is pressed through the holes.
Claim 5
Dependent Claim
39 words
The process for coating a circuit board according to claim 1, characterized in that the photopolymerizable material does not contain a solvent and has a viscosity of 10 to 1000 PaS at a temperature of 100° to 140° C.
Claim 6
Dependent Claim
30 words
The process for coating a circuit board according to claims 1, characterized in that the photopolymerizable material has a viscosity of 20 to 400 PaS at 100° to 140° C.
Claim 7
Dependent Claim
45 words
The process for coating a circuit board according to claims 1, characterized in that the photopolymerizable material and the circuit board are heated at 80° to 180° C., and the roller has a temperature 10° to 50° C. above the temperature of the circuit board.
Claim 8
Dependent Claim
30 words
The process for coating a circuit board according to claim 1, characterized in that the pressure of the roller on the circuit board is 0.2 to 5 kg/cm 2 .
Claim 9
Dependent Claim
30 words
The process for coating a circuit board according to claim 1, characterized in that the pressure of the roller on the circuit board is 0.5 to 2 kg/cm 2 .
Claim 10
Dependent Claim
23 words
The process for coating a circuit board according to claim 1, characterized in that the circuit board is coated simultaneously on both sides.
Claim 11
Dependent Claim
31 words
The process for coating a circuit board according to claim 1, characterized in that the photopolymerizable material is covered by a transparent, protective sheet after being coated on the circuit board.
Claim 12
Dependent Claim
27 words
The process for coating a circuit board according to claim 10, characterized in that the transparent, protective sheet is laminated on the surface of the photopolymerizable material.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1998-08-21 | 1999-02-20 | 1999-08-22 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2002-08-21 | 2003-02-20 | 2003-08-22 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2006-08-21 | 2007-02-20 | 2007-08-22 | $7700.00 | Window Closed / Lapsed |