Method for burying low resistance material in a contact hole

Claim 1

A method of providing a contact to a conductive region of a semiconductor device, the method comprising the steps of: a first step of forming an insulating film on a conductive region of a semiconductor device; a second step of forming a contact hole in said insulating film exposing said conductive region; a third step of forming a first polysilicon film on said insulating film and said contact hole, introducing impurities into said first polysilicon film, and forming a first conductive film Comprising a metal on said first polysilicon film, said third step being performed at least one time; a fourth step of forming a second polysilicon film on an upper surface of said first conductive film to bury said contact hole; a fifth step of heating to diffuse said impurities and to form a metal silicide film breaking down respective natural oxidation films between said first polysilicon film and said first conductive film and between said first conductive film and said second polysilicon film, said metal silicide film being formed between said first polysilicon film and said second polysilicon film by reaction of said first conductive film to said first polysilicon film and said second polysilicon film; and a sixth step of etching said first polysilicon film, said second polysilicon film, and said metal silicide film to provide a contact within said contact hole; and a seventh step of forming a second conductive film on said contact and said insulating film.

Claim 2

A method of providing a contact to a conductive region of a semiconductor device, the method comprising the steps of: a first step of forming an insulating film on a conductive region of a semiconductor device; a second step of forming a contact hole in said insulating film exposing said conductive region; a third step of forming a first polysilicon film on said insulating film and said contact hole, introducing impurities into said first polysilicon film, and forming a first conductive film Comprising a metal on said first polysilicon film, said third step being performed at least one time; a fourth step of forming a second polysilicon film on an upper surface of said first conductive film to bury said contact hole; a fifth step of heating to diffuse said impurities and to form a metal silicide film breaking down respective natural oxidation films between said first polysilicon film and said first conductive film and between said first conductive film and said second polysilicon film, said metal silicide film being formed between said first polysilicon film and said second polysilicon film by reaction of said first conductive film to said first polysilicon film and said second polysilicon film; and a sixth step of etching said first polysilicon film, said second polysilicon film, and said metal silicide film to provide a contact within said contact hole; and a seventh step of forming a second conductive film on said contact and said insulating film.

Claim 8

A method of providing a contact to a conductive region of a semiconductor device, the method comprising the steps of: a first step of forming an insulating film on a conductive region of a semiconductor device; a second step of forming a contact hole in said insulating film exposing said conductive region; a third step of forming a first polysilicon film on said insulating film and said contact hole, introducing impurities into said first polysilicon film, and forming a first conductive film comprising a metal on said first polysilicon film, said third step being performed at least one time; a fourth step of forming a second polysilicon film on an upper surface of said first conductive film to bury said contact hole; a fifth step of heating to diffuse said impurities and to form metal silicide films breaking down respective natural oxidation films between said first polysilicon film and said first conductive film and between said first conductive film and said second polysilicon film, said metal silicide films being formed between said first polysilicon film and said first conductive film and between said first conductive film and said second polysilicon film, respectively, by reaction of said first conductive film to said first polysilicon film and said second polysilicon film; a sixth step of etching said first polysilicon film, said second polysilicon film, and said metal silicide film to provide a contact within said contact hole; and a seventh step of forming a second conductive film on said contact and said insulating film.

Claim 9

A method of providing a contact to a conductive region of a semiconductor device, the method comprising the steps of: a first step of forming an insulating film on a conductive region of a semiconductor device; a second step of forming a contact hole in said insulating film exposing said conductive region; a third step of forming a first polysilicon film on said insulating film and said contact hole, introducing impurities into said first polysilicon film, and forming a first conductive film comprising a metal on said first polysilicon film, said third step being performed at least one time; a fourth step of forming a second polysilicon film on an upper surface of said first conductive film to bury said contact hole; a fifth step of heating to diffuse said impurities and to form metal silicide films breaking down respective natural oxidation films between said first polysilicon film and said first conductive film and between said first conductive film and said second polysilicon film, said metal silicide films being formed between said first polysilicon film and said first conductive film and between said first conductive film and said second polysilicon film, respectively, by reaction of said first conductive film to said first polysilicon film and said second polysilicon film; a sixth step of etching said first polysilicon film, said second polysilicon film, and said metal silicide film to provide a contact within said contact hole; and a seventh step of forming a second conductive film on said contact and said insulating film.

Claim 15

A method of providing contacts to conductive regions of a semiconductor device, the method comprising the steps of: a first step of forming an insulating film on a first conductive region and a second conductive region of a semiconductor device; a second step of forming a first contact hole in said insulating film exposing said first conductive region and forming a second contact hole in said insulating film exposing said second conductive region, a depth of said first contact hole being different than a depth of said second contact hole; a third step of forming a first polysilicon film on said insulating film, said first contact hole, and said second contact hole, introducing impurities into said first polysilicon film, and forming a conductive film comprising a metal on said first polysilicon film, said third step being performed at least one time; a fourth step of forming a second polysilicon film on an upper surface of said conductive film to bury said first contact hole and said second contact hole; a fifth step of heating to diffuse said impurities and to form a metal silicide film breaking down respective natural oxidation films between said first polysilicon film and said conductive film and between said conductive film and said second polysilicon film, said metal silicide film being formed between said first polysilicon film and said second polysilicon film by reaction of said conductive film to said first polysilicon film and said second polysilicon film; and a sixth step of etching said first polysilicon film, said second polysilicon film, said conductive film, and said metal silicide film to provide a contact within said first contact hole and to provide a contact within said second contact hole.

Claim 16

A method of providing contacts to conductive regions of a semiconductor device, the method comprising the steps of: a first step of forming an insulating film on a first conductive region and a second conductive region of a semiconductor device; a second step of forming a first contact hole in said insulating film exposing said first conductive region and forming a second contact hole in said insulating film exposing said second conductive region, a depth of said first contact hole being different than a depth of said second contact hole; a third step of forming a first polysilicon film on said insulating film, said first contact hole, and said second contact hole, introducing impurities into said first polysilicon film, and forming a conductive film comprising a metal on said first polysilicon film, said third step being performed at least one time; a fourth step of forming a second polysilicon film on an upper surface of said conductive film to bury said first contact hole and said second contact hole; a fifth step of heating to diffuse said impurities and to form a metal silicide film breaking down respective natural oxidation films between said first polysilicon film and said conductive film and between said conductive film and said second polysilicon film, said metal silicide film being formed between said first polysilicon film and said second polysilicon film by reaction of said conductive film to said first polysilicon film and said second polysilicon film; and a sixth step of etching said first polysilicon film, said second polysilicon film, said conductive film, and said metal silicide film to provide a contact within said first contact hole and to provide a contact within said second contact hole.