US5419946A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Adhesive for printed wiring board and production thereof
Assignee: Resonac Corp
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Filing: 1994-09-29
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Granted: 1995-05-30
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Expires: 2014-09-29
Abstract
Abstract An adhesive composition containing a special internal mold release agent obtained from tri-, di-, or mono-alkyl phosphoric ester, said alkyl moiety having 6 to 18 carbon atoms, and an amine in addition to major components of an epoxy resin, acrylonitrile-butadiene rubber, an alkylphenol resin, and an inorganic filler is suitable for producing printed wiring boards by an additive process excellent in adhesiveness to plated copper.
Inventors
- 👤 Shin Takanezawa
- 👤 Teturou Irino
- 👤 Yuuji Toshaka
- 👤 Takashi Kagaya
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 14:46
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/38; H05K3/386; H05K3/387; C; C09; C09J; C09J163/00; C09J7/00; C09J7/20; C09J7/22; C09J7/30; C09J7/35; C08; C08L; C08L2666/00; C08L2666/02; H05K2201/00; H05K2201/01; H05K2201/0104; H05K2201/0133; H05K2201/02; H05K2201/0203; H05K2201/0206; H05K2201/0209; H05K2203/00; H05K2203/12; H05K2203/122; H05K3/10; H05K3/18; H05K3/181; Y; Y10; Y10S; Y10S428/00; Y10S428/901; Y10T; Y10T428/00; Y10T428/24; Y10T428/24802; Y10T428/24893; Y10T428/28; Y10T428/2852
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
73 words
An adhesive composition for printed wiring board produced by an additive process comprising an epoxy resin, acrylonitrile-butadiene rubber, an alkylphenol resin, and an inorganic filler as major components, and 0.05 to 5.0% by weight of an internal mold release agent obtained from tri-, di-, or mono-alkyl phosphoric ester having one or more alkyl moieties with 6 to 18 carbon atoms, and an amine based on 100 parts by weight of the major components.
Claim 2
Dependent Claim
73 words
An adhesive composition for printed wiring board produced by an additive process comprising an epoxy resin, acrylonitrile-butadiene rubber, an alkylphenol resin, and an inorganic filler as major components, and 0.05 to 5.0% by weight of an internal mold release agent obtained from tri-, di-, or mono-alkyl phosphoric ester having one or more alkyl moieties with 6 to 18 carbon atoms, and an amine based on 100 parts by weight of the major components.
Claim 3
Dependent Claim
55 words
An adhesive composition according to claim 1, wherein the major components comprises 10 to 65% by weight of an epoxy resin, 10 to 60% by weight of an acrylonitrile-butadiene rubber, 2 to 30% by weight of an alkylphenol resin, and 10 to 50% by weight of an inorganic filler, a total being 100% by weight.
Claim 4
Dependent Claim
21 words
An adhesive sheet obtained by coating a solution of the adhesive composition of claim 1 on a releasable support and drying.
Claim 5
Dependent Claim
22 words
A laminate having adhesive layers thereon obtained by coating a solution of the adhesive composition of claim 1 on circuit formation areas.
Claim 6
Dependent Claim
51 words
A laminate having adhesive layers on circuit formation areas obtained by placing the adhesive sheet of claim 3 on both sides of a prepreg impregnated with a thermosetting resin and molding integrally at 140° to 200° C. under a pressure of 20 to 100 kg/cm 2 for 30 to 120 minutes.
Claim 7
Dependent Claim
31 words
A laminate having adhesive layers thereon obtained by coating a solution of the adhesive composition of claim 1 on circuit formation areas by an immersion method or a curtain coating method.
Claim 8
Dependent Claim
31 words
A process for producing a printed wiring board, which comprises drilling through-holes in the laminate of claim 4, forming a plating resist thereon, roughening the surface thereof, and conducting electroless plating.
Claim 9
Dependent Claim
31 words
A process for producing a printed wiring board, which comprises drilling through-holes in the laminate of claim 5, forming a plating resist thereon, roughening the surface thereof, and conducting electroless plating.
Claim 10
Dependent Claim
31 words
A process for producing a printed wiring board, which comprises drilling through-holes in the laminate of claim 6, forming a plating resist thereon, roughening the surface thereof, and conducting electroless plating.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1998-05-29 | 1998-11-28 | 1999-05-30 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2002-05-29 | 2002-11-28 | 2003-05-30 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2006-05-29 | 2006-11-28 | 2007-05-30 | $7700.00 | Window Closed / Lapsed |