Patent US2595948A successfully refreshed from Google Patents.
US4457952A
Expired / Lapsed
US
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Process for producing printed circuit boards
Assignee: MECHATRONICS LLC
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Filing: 1983-04-15
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Granted: 1984-07-03
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Expires: 2003-04-15
Abstract
Abstract When an alkaline earth metal carbonate powder is mixed with an adhesive and is formed into an adhesive layer in a conventional covering method, a problem of the transfer of catalyst for electroless plating during a masking step or later electroless plating step is solved. Further, blisters under plated film caused by a fire retardant contained in an insulating substrate is also overcome by the use of alkaline earth metal powder.
Inventors
- 👤 Mineo Kawamoto
- 👤 Kanji Murakami
- 👤 Yutaka Itoh
- 👤 Youichi Matsuda
- 👤 Motoyo Wajima
- 👤 Hirosada Morishita
- 👤 Shoji Kawakubo
- 👤 Toyofusa Yoshimura
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-26 08:05
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/10; H05K3/18; H05K3/181; H05K3/182; H05K3/184; H05K3/38; H05K3/386; H05K3/387; H05K1/00; H05K1/02; H05K1/03; H05K1/0313; H05K1/0353; H05K1/0373; H05K2201/00; H05K2201/01; H05K2201/0104; H05K2201/012; H05K2201/02; H05K2201/0203; H05K2201/0206; H05K2201/0209; H05K2203/00; H05K2203/07; H05K2203/0756; H05K2203/0773; H05K2203/14; H05K2203/1407
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
121 words
A process for producing a printed circuit board comprising the steps of: (a) forming an at least partially cured adhesive layer of a homogeneous mixture of an alkaline earth metal carbonate powder in an amount sufficient to prevent transfer of a catalyst to be deposited thereon to masked portions formed after a catalyst deposition step, and a resin component containing predetermined amounts of a thermosetting resin and a synthetic rubber on one or both surfaces of an insulating substrate, (b) roughening the adhesive layer surface or surfaces, (c) depositing a catalyst for electroless plating to the roughened adhesive layer surface, (d) masking portions other than circuit forming portions with a resist ink film, and (e) forming conductive circuits by electroless plating.
Claim 2
Dependent Claim
121 words
A process for producing a printed circuit board comprising the steps of: (a) forming an at least partially cured adhesive layer of a homogeneous mixture of an alkaline earth metal carbonate powder in an amount sufficient to prevent transfer of a catalyst to be deposited thereon to masked portions formed after a catalyst deposition step, and a resin component containing predetermined amounts of a thermosetting resin and a synthetic rubber on one or both surfaces of an insulating substrate, (b) roughening the adhesive layer surface or surfaces, (c) depositing a catalyst for electroless plating to the roughened adhesive layer surface, (d) masking portions other than circuit forming portions with a resist ink film, and (e) forming conductive circuits by electroless plating.
Claim 3
Dependent Claim
23 words
A process according to claim 1, wherein the alkaline earth metal carbonate is calcium carbonate, magnesium carbonate, strontium carbonate, or a mixture thereof.
Claim 4
Dependent Claim
36 words
A process according to claim 1, wherein the amount of alkaline earth metal carbonate powder is 1 to 25 parts by weight based on 100 parts by weight of the resin component in the adhesive layer.
Claim 5
Dependent Claim
13 words
A process according to claim 1, wherein the substrate contains a fire retardant.
Claim 6
Dependent Claim
23 words
A process according to claim 4, wherein the fire retardant is a phosphorus series, a halogen series fire retardant or a mixture thereof.
Claim 7
Dependent Claim
18 words
A process according to claim 5, wherein the phosphorus series fire retardant is red phosphorus or a phosphate.
Claim 8
Dependent Claim
17 words
A process according to claim 5, wherein the halogen series fire retardant is a brominated epoxy resin.
Claim 9
Dependent Claim
42 words
A process according to claim 1, wherein the resin component is a mixture of 70 to 30 parts by weight of a synthetic rubber and 30 to 70 parts by weight of a thermosetting resin, the total being 100 parts by weight.
Claim 10
Dependent Claim
122 words
A process for producing a printed circuit board comprising the steps of: (a) forming an at least partially cured adhesive layer of a homogeneous mixture of an alkaline earth metal carbonate powder in an amount sufficient to prevent transfer of a catalyst to be deposited thereon to masked portions formed after a catalyst deposition step, a resin component containing predetermined amounts of a thermosetting resin and a synthetic rubber, and sulfur on one or both surfaces of an insulating substrate, (b) roughening the adhesive layer surface or surfaces, (c) depositing a catalyst for electroless plating to the roughened adhesive layer surface, (d) masking portions other than circuit forming portions with a resist ink film, and (e) forming conductive circuits by electroless plating.
Claim 11
Dependent Claim
122 words
A process for producing a printed circuit board comprising the steps of: (a) forming an at least partially cured adhesive layer of a homogeneous mixture of an alkaline earth metal carbonate powder in an amount sufficient to prevent transfer of a catalyst to be deposited thereon to masked portions formed after a catalyst deposition step, a resin component containing predetermined amounts of a thermosetting resin and a synthetic rubber, and sulfur on one or both surfaces of an insulating substrate, (b) roughening the adhesive layer surface or surfaces, (c) depositing a catalyst for electroless plating to the roughened adhesive layer surface, (d) masking portions other than circuit forming portions with a resist ink film, and (e) forming conductive circuits by electroless plating.
Claim 12
Dependent Claim
43 words
A process according to claim 9, wherein the amount of alkaline earth metal carbonate is 1 to 25 parts by weight and the amount of sulfur is 0.1 to 10 parts by weight, based on 100 parts by weight of the resin component.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1987-07-03 | 1988-01-02 | 1988-07-03 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1991-07-03 | 1992-01-02 | 1992-07-03 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1995-07-03 | 1996-01-02 | 1996-07-03 | $7700.00 | Window Closed / Lapsed |