US5356698A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Adhesive agent for substrate of electroless plating, printed circuit board using same, and method of producing same
Assignee: Hitachi Ltd
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Filing: 1993-01-05
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Granted: 1994-10-18
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Expires: 2013-01-05
Abstract
Abstract Adhesive agent for substrate of electroless plating characterized in comprising epoxy resin, synthetic rubber, and phenolic resin as main components, a hardener of the epoxy resin, inorganic filler having hydroxyl group, and solvent. The adhesive agent is hardened at relatively low temperature (about 150° C.) in short period (within 30 minutes) without giving warp and distortion to the insulation substrate, and moreover its insulation resistance after hardening is high. The adhesive agent is preferable as an adhesive agent for a printed circuit board.
Inventors
- 👤 Mineo Kawamoto
- 👤 Haruo Akahoshi
- 👤 Akio Takahashi
- 👤 Akio Mukoh
- 👤 Kazuo Tanje
- 👤 Toyofusa Yoshimura
- 👤 Tokihito Suwa
- 👤 Iwao Kaminaga
- 👤 Toshiyuki Chida
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 15:22
CPC Classifications
C; C08; C08K; C08K3/00; C08K3/18; C08K3/20; C08K3/22; C09; C09J; C09J109/00; H; H01; H01B; H01B3/00; H01B3/18; H01B3/28; H01B3/30; H01B3/36; H01B3/40; H05; H05K; H05K3/00; H05K3/38; H05K3/386; H05K3/387; H05K2201/00; H05K2201/01; H05K2201/0104; H05K2201/0133; H05K2201/02; H05K2201/0203; H05K2201/0206; H05K2201/0209; H05K3/10; H05K3/18; H05K3/181; Y; Y10; Y10S; Y10S428/00; Y10S428/901; Y10T; Y10T428/00; Y10T428/24; Y10T428/24802; Y10T428/24917; Y10T428/25; Y10T428/254; Y10T428/28; Y10T428/2852
Claims Analysis
Total Claims: 36
Claim 1
Independent Claim
107 words
A substrate for printed circuit board, comprising an adhesive layer on a circuit forming plane, said adhesive layer being a cured resin produced by curing a composition comprising an epoxy resin, a synthetic rubber, and a phenol resin, the epoxy resin, the synthetic rubber and the phenol resin constituting three resin components of the composition, a vulcanizing agent, a photosensitive hardener which produces Lewis acid upon irradiation with ultraviolet rays, an inorganic filler powder having hydroxyl groups which release hydroxyl groups upon heating, and an organic solvent, wherein the composition has been cured by being irradiated with ultraviolet rays followed by heating until the composition is cured.
Claim 2
Dependent Claim
107 words
A substrate for printed circuit board, comprising an adhesive layer on a circuit forming plane, said adhesive layer being a cured resin produced by curing a composition comprising an epoxy resin, a synthetic rubber, and a phenol resin, the epoxy resin, the synthetic rubber and the phenol resin constituting three resin components of the composition, a vulcanizing agent, a photosensitive hardener which produces Lewis acid upon irradiation with ultraviolet rays, an inorganic filler powder having hydroxyl groups which release hydroxyl groups upon heating, and an organic solvent, wherein the composition has been cured by being irradiated with ultraviolet rays followed by heating until the composition is cured.
Claim 3
Dependent Claim
18 words
The substrate according to claim 1, wherein the composition further contains a vulcanization accelerator for the synthetic rubber.
Claim 4
Dependent Claim
25 words
The substrate according to claim 1, wherein the composition has curing characteristics represented by a curing temperature of 150° C. or lower within 30 minutes.
Claim 5
Dependent Claim
35 words
The substrate according to claim 1, wherein the inorganic filler powder releases hydroxyl groups at a temperature no higher than 150° C. so as to accelerate a reaction between the synthetic rubber and phenol resin.
Claim 6
Dependent Claim
15 words
The substrate according to claim 1, wherein the photosensitive hardener is an aromatic onium salt.
Claim 7
Dependent Claim
51 words
The substrate according to claim 1, wherein amounts of the epoxy resin, synthetic rubber and phenol resin are respectively (15-40), (40-60) and (20-40) in parts by weight, and an amount of the inorganic filler powder is at least 3 parts by weight based on 100 parts of the three resin components.
Claim 8
Dependent Claim
28 words
The substrate according to claim 1, wherein an amount of the hardener is 0.2 to 5 parts by weight based on 100 parts of the three resin components.
Claim 9
Dependent Claim
23 words
The substrate according to claim 1, wherein an amount of the solvent is 0.001 to 0.5% by weight per weight of the composition.
Claim 10
Dependent Claim
100 words
A substrate for printed circuit board, comprising an adhesive layer formed on a circuit forming plane by curing a composition which comprises an epoxy resin, a synthetic rubber, and a phenol resin, the epoxy resin, synthetic rubber and phenol resin constituting three resin components of the composition forming the adhesive layer, a photosensitive hardener which produces Lewis acid upon irradiation with ultraviolet rays, an inorganic filler powder having hydroxyl groups which releases hydroxyl groups upon heating, and an organic solvent, wherein the composition is irradiated with ultraviolet rays followed by heating, and a surface of the adhesive layer is roughened.
Claim 11
Dependent Claim
100 words
A substrate for printed circuit board, comprising an adhesive layer formed on a circuit forming plane by curing a composition which comprises an epoxy resin, a synthetic rubber, and a phenol resin, the epoxy resin, synthetic rubber and phenol resin constituting three resin components of the composition forming the adhesive layer, a photosensitive hardener which produces Lewis acid upon irradiation with ultraviolet rays, an inorganic filler powder having hydroxyl groups which releases hydroxyl groups upon heating, and an organic solvent, wherein the composition is irradiated with ultraviolet rays followed by heating, and a surface of the adhesive layer is roughened.
Claim 12
Dependent Claim
18 words
The substrate according to claim 9, wherein the composition further contains a vulcanization accelerator for the synthetic rubber.
Claim 13
Dependent Claim
25 words
The substrate according to claim 9, wherein the composition has curing characteristics represented by a curing temperature of 150° C. or lower within 30 minutes.
Claim 14
Dependent Claim
35 words
The substrate according to claim 9, wherein the inorganic filler powder releases hydroxyl groups at a temperature no higher than 150° C. so as to accelerate a reaction between the synthetic rubber and phenol resin.
Claim 15
Dependent Claim
15 words
The substrate according to claim 9, wherein the photosensitive hardener is an aromatic onium salt.
Claim 16
Dependent Claim
51 words
The substrate according to claim 9, wherein amounts of the epoxy resin, synthetic rubber and phenol resin are respectively (15-40), 40-60) and (20-40) in parts by weight, and an amount of the inorganic filler powder is at least 3 parts by weight based on 100 parts of the three resin components.
Claim 17
Dependent Claim
28 words
The substrate according to claim 9, wherein an amount of the hardener is 0.2 to 5 parts by weight based on 100 parts of the three resin components.
Claim 18
Dependent Claim
114 words
A printed circuit board comprising: a substrate of an electrically insulating material; an adhesive layer of a cured resin which is formed by curing a composition which comprises an epoxy resin, a synthetic rubber, and a phenol resin, the epoxy resin, synthetic rubber and phenol resin constituting three resin components of said composition, a photosensitive hardener which produces Lewis acid upon irradiation with ultraviolet rays, and an inorganic filler powder having hydroxyl groups which releases hydroxyl groups upon heating, wherein the composition is cured by irradiation with ultraviolet rays followed by heating, and the surface of the adhesive layer furthest from the substrate is roughened; and metallic circuit patterns formed on the adhesive layer.
Claim 19
Dependent Claim
114 words
A printed circuit board comprising: a substrate of an electrically insulating material; an adhesive layer of a cured resin which is formed by curing a composition which comprises an epoxy resin, a synthetic rubber, and a phenol resin, the epoxy resin, synthetic rubber and phenol resin constituting three resin components of said composition, a photosensitive hardener which produces Lewis acid upon irradiation with ultraviolet rays, and an inorganic filler powder having hydroxyl groups which releases hydroxyl groups upon heating, wherein the composition is cured by irradiation with ultraviolet rays followed by heating, and the surface of the adhesive layer furthest from the substrate is roughened; and metallic circuit patterns formed on the adhesive layer.
Claim 20
Dependent Claim
18 words
The board according to claim 16, wherein the composition further contains a vulcanization accelerator for the synthetic rubber.
Claim 21
Dependent Claim
25 words
The board according to claim 16, wherein the composition has curing characteristics represented by a curing temperature of 150° C. or lower within 30 minutes.
Claim 22
Dependent Claim
35 words
The board according to claim 16, wherein the inorganic filler powder releases hydroxyl groups at a temperature not higher than 150° C. so as to accelerate a reaction between the synthetic rubber and phenol resin.
Claim 23
Dependent Claim
15 words
The board according to claim 16, wherein the photosensitive hardener is an aromatic onium salt.
Claim 24
Dependent Claim
51 words
The board according to claim 16, wherein amounts of the epoxy resin, synthetic rubber and phenol resin are respectively (15-40), (40-60) and (20-40) in parts by weight, and an amount of the inorganic filler powder is at least 3 parts by weight based on 100 parts of the three resin components.
Claim 25
Dependent Claim
28 words
The board according to claim 16, wherein an amount of the hardener is 0.2 to 5 parts by weight based on 100 parts of the three resin components.
Claim 26
Dependent Claim
28 words
The board according to claim 16, wherein the adhesive layer contains an organic solvent, in an amount of 0.001 to 0.5% by weight per weight of the composition.
Claim 27
Dependent Claim
18 words
The board according to claim 16, wherein the adhesive layer has a thickness of 10 to 100 μm.
Claim 28
Dependent Claim
126 words
A printed circuit board comprising: a substrate made of an electrically insulating material; an adhesive layer, formed on the surface of the substrate, made by curing a composition which comprises an epoxy resin, a synthetic rubber, and a phenol resin, said epoxy resin, said synthetic rubber and said phenol resin constituting three resin components of the composition, a photosensitive hardener for generating Lewis acid upon irradiation with ultraviolet rays, an inorganic filler powder having hydroxyl groups for releasing hydroxyl groups upon heating, a vulcanization accelerator for the rubber, and an organic solvent, wherein the composition is cured by irradiation with ultraviolet rays followed by heating, and a surface of the adhesive layer furthest from the substrate is roughened; and printed circuits formed on the adhesive layer.
Claim 29
Dependent Claim
126 words
A printed circuit board comprising: a substrate made of an electrically insulating material; an adhesive layer, formed on the surface of the substrate, made by curing a composition which comprises an epoxy resin, a synthetic rubber, and a phenol resin, said epoxy resin, said synthetic rubber and said phenol resin constituting three resin components of the composition, a photosensitive hardener for generating Lewis acid upon irradiation with ultraviolet rays, an inorganic filler powder having hydroxyl groups for releasing hydroxyl groups upon heating, a vulcanization accelerator for the rubber, and an organic solvent, wherein the composition is cured by irradiation with ultraviolet rays followed by heating, and a surface of the adhesive layer furthest from the substrate is roughened; and printed circuits formed on the adhesive layer.
Claim 30
Dependent Claim
18 words
The board according to claim 25, wherein the adhesive layer has a thickness of 10 to 100 μm.
Claim 31
Dependent Claim
25 words
The board according to claim 25, wherein the composition has curing characteristics represented by a curing temperature of 150° C. or lower within 30 minutes.
Claim 32
Dependent Claim
35 words
The board according to claim 25, wherein the inorganic filler powder releases hydroxyl groups at a temperature no higher than 150° C. so as to accelerate a reaction between the synthetic rubber and phenol resin.
Claim 33
Dependent Claim
15 words
The board according to claim 25, wherein the photosensitive hardener is an aromatic onium salt.
Claim 34
Dependent Claim
51 words
The board according to claim 25, wherein amounts of the epoxy resin, synthetic rubber and phenol resin are respectively (15-40), (40-60) and (20-40) in parts by weight, and an amount of the inorganic filler powder is at least 3 parts by weight based on 100 parts of the three resin components.
Claim 35
Dependent Claim
28 words
The board according to claim 25, wherein an amount of the hardener is 0.2 to 5 parts by weight based on 100 parts of the three resin components.
Claim 36
Dependent Claim
23 words
The board according to claim 25, wherein an amount of the solvent is 0.001 to 0.5% by weight per weight of the composition.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1997-10-17 | 1998-04-18 | 1998-10-18 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-10-17 | 2002-04-18 | 2002-10-18 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-10-17 | 2006-04-18 | 2006-10-18 | $7700.00 | Window Closed / Lapsed |