Patent US5418189A successfully refreshed from Google Patents.
US5418189A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Integrated circuit device and method to prevent cracking during surface mount
Assignee: Texas Instruments Inc
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Filing: 1994-08-25
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Granted: 1995-05-23
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Expires: 2014-08-25
Abstract
Abstract A lead over chip packaged device that is less prone to package cracking during surface mounting is disclosed. The lead over chip lead frame overlies the active face of a semiconductor circuit, The backside of the semiconductor circuit is covered with an ainopropyltriethoxysilane coating. The aminopropyltriethoxysilane coating promotes adhesion between the backside of the semiconductor circuit and the mold compound used to encapsulate the device. This reduces package cracking resulting from delamination between the inactive face of the chip and the mold compound during reflow solder.
Inventors
- 👤 Katherine G. Heinen
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-06 02:02
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/411; H10W70/415; H10W72/00; H10W72/90; H10W74/00; H10W74/10; H10W74/111; H10W74/127; H10W74/40; H10W74/47; H10W74/476; H10W72/071; H10W72/073; H10W72/07351; H10W72/07352; H10W72/075; H10W72/30; H10W72/321; H10W72/50; H10W72/551; H10W72/552; H10W72/5522; H10W72/59; H10W72/851; H10W72/853; H10W72/865; H10W72/931; H10W72/932; H10W72/941; H10W72/944; H10W72/9445; H10W72/951; H10W72/952; H10W90/00; H10W90/701; H10W90/731; H10W90/732; H10W90/736; H10W90/751; H10W90/756; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121
Claims Analysis
Total Claims: 4
Claim 1
Independent Claim
96 words
A method of making a semiconductor packaged device that is resistant to package cracking during surface mounting to a printed circuit board, comprising the steps of: connecting the active side of a semiconductor chip to a lead frame; applying an aminopropyltriethoxysilane film to the inactive side of the semiconductor chip; and encapsulating the semiconductor chip and the lead frame in plastic in such a fashion to form a packaged device that may be surface mounted to a printed circuit board, the aminopropyltriethoxysilane film increasing adhesion between the inactive side of the semiconductor chip and the plastic,.
Claim 2
Independent Claim
96 words
A method of making a semiconductor packaged device that is resistant to package cracking during surface mounting to a printed circuit board, comprising the steps of: connecting the active side of a semiconductor chip to a lead frame; applying an aminopropyltriethoxysilane film to the inactive side of the semiconductor chip; and encapsulating the semiconductor chip and the lead frame in plastic in such a fashion to form a packaged device that may be surface mounted to a printed circuit board, the aminopropyltriethoxysilane film increasing adhesion between the inactive side of the semiconductor chip and the plastic,.
Claim 3
Dependent Claim
15 words
The method of claim 1 wherein the aminopropyltriethoxysilane coating is less than 1 micron thick.
Claim 4
Dependent Claim
16 words
The method of claim 2 wherein the lead frame is a lead over chip lead frame.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1998-05-22 | 1998-11-21 | 1999-05-23 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2002-05-22 | 2002-11-21 | 2003-05-23 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2006-05-22 | 2006-11-21 | 2007-05-23 | $7700.00 | Window Closed / Lapsed |