US5416277A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Cicuit and process of manufacturing the circuit
Assignee: Robert Bosch GmbH
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Filing: 1991-09-06
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Granted: 1995-05-16
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Expires: 2011-09-06
Abstract
Abstract In a process for manufacturing a circuit including a first circuit plane of a ceramic substrate which is covered with, for example, thick-film structures and is imprinted with corresponding conductor paths having contact faces, the ceramic substrate is to be connected with a second circuit plane composed of a green tape substrate.
Inventors
- 👤 Herbert Zimmermann
- 👤 Klaus Steinle
- 👤 Kurt Spitzenberger
- 👤 Guenther Stecher
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 21:18
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/611; H05; H05K; H05K3/00; H05K3/46; H05K3/4611; H05K3/4614; H05K3/4626; H05K3/4629; H10W90/00; H10W90/401; H05K1/00; H05K1/02; H05K1/03; H05K1/0306; H05K1/09; H05K1/092; H05K2201/00; H05K2201/09; H05K2201/09209; H05K2201/09372; H05K2201/09481; H05K2201/09818; H05K2201/09909; H05K3/30; H05K3/32; H05K3/321; H05K3/40; H05K3/4038; H05K3/4053
Claims Analysis
Total Claims: 23
Claim 1
Independent Claim
136 words
A process for manufacturing a circuit including a first circuit plane composed of a ceramic substrate provided with thick-film structures and imprinted with corresponding conductor paths having contact faces, said first circuit plane connected with a second circuit plane composed of a green tape substrate provided with respective counter-contact faces, comprising steps of: imprinting at least one of the ceramic substrate and an underside of the green tape substrate with glass webs; placing said ceramic substrate adjacent said green tape substrate so that the glass webs are disposed between and touch both of the substrates; and firing said ceramic substrate and said green tape substrate at a temperature which corresponds to a temperature at which the contact faces and counter-contact faces will join together and which is higher than a melting temperature of the glass webs.
Claim 2
Dependent Claim
136 words
A process for manufacturing a circuit including a first circuit plane composed of a ceramic substrate provided with thick-film structures and imprinted with corresponding conductor paths having contact faces, said first circuit plane connected with a second circuit plane composed of a green tape substrate provided with respective counter-contact faces, comprising steps of: imprinting at least one of the ceramic substrate and an underside of the green tape substrate with glass webs; placing said ceramic substrate adjacent said green tape substrate so that the glass webs are disposed between and touch both of the substrates; and firing said ceramic substrate and said green tape substrate at a temperature which corresponds to a temperature at which the contact faces and counter-contact faces will join together and which is higher than a melting temperature of the glass webs.
Claim 3
Dependent Claim
40 words
A process according to claim 1, further comprising steps of shaping vias into the green tape substrate and filling the vias with a conductive contact material to form said counter-contact faces corresponding to the contact faces on the ceramic substrate.
Claim 4
Dependent Claim
31 words
A process according to claim 2, wherein the contact faces on the ceramic substrate have a larger diameter than a diameter of the respective counter-contact faces on the green tape substrate.
Claim 5
Dependent Claim
20 words
A process according to claim 2, further comprising a step of imprinting each contact face with a respective bonding layer.
Claim 6
Dependent Claim
25 words
A process according to claim 4, wherein the bonding layer is a silver paste that is one of low in glass and free of glass.
Claim 7
Dependent Claim
14 words
A process according to claim 5, wherein the firing temperature is about 850° C.
Claim 8
Dependent Claim
13 words
A process according to claim 5 wherein the contact face material is silver.
Claim 9
Dependent Claim
14 words
A process according to claim 4, wherein the bonding layer is a copper paste.
Claim 10
Dependent Claim
14 words
A process according to claim 8, wherein the firing temperature is about 770° C.
Claim 11
Dependent Claim
13 words
A process according to claim 8 wherein the contact face material is silver.
Claim 12
Dependent Claim
50 words
A process according to claim 4, wherein the step of placing the ceramic substrate adjacent the green tape substrate includes arranging the substrates such that the contact faces and respective bonding layers are disposed on the respective counter-contact faces prior to firing the ceramic substrate and the green tape substrate.
Claim 13
Dependent Claim
13 words
A process according to claim 2 wherein the contact face material is silver.
Claim 14
Dependent Claim
86 words
A circuit comprising: a first circuit plane including a ceramic substrate provided with thick-film hybrids and imprinted with corresponding conductor paths having contact faces; and a second circuit plane composed of a second substrate formed of a green tape substrate which has been fired, the second substrate being disposed above the ceramic substrate and being bonded to the ceramic substrate by glass webs which were imprinted on at least one of the ceramic substrate and the green tape substrate and melted during firing of the substrates.
Claim 15
Dependent Claim
86 words
A circuit comprising: a first circuit plane including a ceramic substrate provided with thick-film hybrids and imprinted with corresponding conductor paths having contact faces; and a second circuit plane composed of a second substrate formed of a green tape substrate which has been fired, the second substrate being disposed above the ceramic substrate and being bonded to the ceramic substrate by glass webs which were imprinted on at least one of the ceramic substrate and the green tape substrate and melted during firing of the substrates.
Claim 16
Dependent Claim
37 words
A circuit according to claim 13, further comprising a respective bonding layer for each of the contact faces and respective counter-contact faces in the second substrate bonded to the respective contact faces via the respective bonding layers.
Claim 17
Dependent Claim
24 words
A circuit according to claim 14, wherein the bonding layers are silver paste that is one of low in glass and free of glass.
Claim 18
Dependent Claim
19 words
A circuit according to claim 14, wherein the counter-contact faces are silver filled into vias in the second substrate.
Claim 19
Dependent Claim
22 words
A circuit according to claim 14, wherein a diameter of the counter-contact faces is smaller than a diameter of the contact faces.
Claim 20
Dependent Claim
24 words
A circuit according to claim 14, wherein each counter-contact face is bonded to the respective contact face via the respective bonding layer by sintering.
Claim 21
Dependent Claim
14 words
A circuit according to claim 14, wherein the bonding layers are a copper paste.
Claim 22
Dependent Claim
29 words
A circuit according to claim 19, wherein each counter-contact face is bonded to the respective contact face via the respective bonding layer through formation of a eutectic copper-silver bond.
Claim 23
Dependent Claim
21 words
A circuit according to claim 13, wherein the glass webs are composed of a glass which melts at about 500° C.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1998-05-15 | 1998-11-14 | 1999-05-16 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2002-05-15 | 2002-11-14 | 2003-05-16 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2006-05-15 | 2006-11-14 | 2007-05-16 | $7700.00 | Window Closed / Lapsed |