Package for electronic circuit

Abstract

Abstract PURPOSE:To improve yield, to reduce cost and to enhance reliability on quality by combining a high-temperature baked substrate with a common power-supply wiring circuit and a low-temperature baked substrate with a signal wiring circuit by solder. CONSTITUTION:A high-temperature baked substrate 1 has a power-supply wiring circuit 11, pin pads 12, pads 13 for connection and through holes 14. On the other hand, a low-temperature baked substrate 2 has pads 21 for connection and through holes 22, and integrated circuits 5 are mounted onto the upper surface of the substrate 2 through an insulating layer section 24. The pads 13, 21 for connecting each substrate 1, 2 are connected electrically and mechanically through solder 4. Accordingly, when signal line patterns in the substrate 2 and the integrated circuits 5 get trouble, both substrates 1, 2 are separated by melting solder 4, and these signal line patterns and integrated circuits can be exchanged with acceptables.

Inventors

• 👤 Shoji Nakakita
• 👤 中北　昭二

Bibliographic Details