Patent US5403869A successfully refreshed from Google Patents.
US5403869A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Adhesive of epoxy resins, epoxy-modified polybutadiene and photoinitiator
Assignee: Resonac Corp
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Filing: 1993-08-17
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Granted: 1995-04-04
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Expires: 2013-08-17
Abstract
Abstract An adhesive comprising (a) solid epoxy resin having a molecular weight of 5000 or more, (b) a polyfunctional epoxy resin having at least three epoxy groups, (c) an intramolecular epoxy-modified polybutadiene having at least three epoxy groups, (d) a cationic photoinitiator, and (e) a tin compound in special weight ratios, is effective for producing multiple-wire wiring boards having good heat resistance, solvent resistance and wherein the adhesive layer has no voids and prevents shift of insulated encapsulated wires.
Inventors
- 👤 Shigeharu Arike
- 👤 Yorio Iwasaki
- 👤 Eiichi Shinada
- 👤 Toshiro Okamura
- 👤 Kanji Murakami
- 👤 Yuichi Nakazato
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 22:58
CPC Classifications
C; C08; C08G; C08G59/00; C08G59/02; C08G59/027; C08G59/18; C08G59/20; C08G59/32; C08G59/38; C08G59/68; C09; C09J; C09J163/00; H; H05; H05K; H05K3/00; H05K3/38; H05K3/386; H05K2201/00; H05K2201/01; H05K2201/0104; H05K2201/0133; H05K2201/0183; H05K2201/0195; H05K2201/02; H05K2201/0203; H05K2201/0206; H05K2201/0209; H05K2201/10; H05K2201/10227; H05K2201/10287; H05K3/10; H05K3/103; H05K3/46; H05K3/4611; H05K3/4626; H05K3/4644; H05K3/4673; Y; Y10; Y10S; Y10S428/00; Y10S428/901; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49155; Y10T29/49162
Claims Analysis
Total Claims: 4
Claim 1
Independent Claim
105 words
An adhesive for multiple-wire wiring boards, which comprises (a) an epoxy resin having a molecular weight of 5000 or more and being solid at room temperature, (b) a polyfunctional epoxy resin having at least three epoxy groups, (c) an intramolecular epoxy modified polybutadiene having at least three epoxy groups, (d) a cationic photopolymerization initiator, and (e) a tin compound, wherein the weight ratio of (a+b+c) to (a) is 100:40 to 100:70, the weight ratio of (a+b+c) to (b) is larger than 100:10, the weight ratio of (a+b+c) to (c) is 100:10 to 100:40 and the weight ratio of (a+b+c) to (d) is 100:0.5 to 100:5.
Claim 2
Dependent Claim
105 words
An adhesive for multiple-wire wiring boards, which comprises (a) an epoxy resin having a molecular weight of 5000 or more and being solid at room temperature, (b) a polyfunctional epoxy resin having at least three epoxy groups, (c) an intramolecular epoxy modified polybutadiene having at least three epoxy groups, (d) a cationic photopolymerization initiator, and (e) a tin compound, wherein the weight ratio of (a+b+c) to (a) is 100:40 to 100:70, the weight ratio of (a+b+c) to (b) is larger than 100:10, the weight ratio of (a+b+c) to (c) is 100:10 to 100:40 and the weight ratio of (a+b+c) to (d) is 100:0.5 to 100:5.
Claim 3
Dependent Claim
19 words
An adhesive according to claim 1, wherein a tin compound is adsorbed on the surface of an inorganic filler.
Claim 4
Dependent Claim
19 words
An adhesive according to claim 1, which further comprises (g) an epoxy resin which is liquid at room temperature.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1998-04-03 | 1998-10-03 | 1999-04-04 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2002-04-03 | 2002-10-03 | 2003-04-04 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2006-04-03 | 2006-10-03 | 2007-04-04 | $7700.00 | Window Closed / Lapsed |