← Back to Patent Explorer
US5403672A Expired / Lapsed US ⏱️ 0.0 years remaining

Metal foil for printed wiring board and production thereof

Assignee: Resonac Corp
•
Filing: 1993-05-12
•
Granted: 1995-04-04
•
Expires: 2013-05-12
📄 Original PDF 🌐 Google Patents 🔄 Sync Now

Abstract

Abstract A metal foil for printed wiring boards comprising a first copper layer to be adhered to a resin, a second copper layer having a sufficient strength as a metal layer and a nickel-phosphorus alloy layer containing 1.1% by weight or more of phosphorus formed between the first and second copper layers is suitable for producing printed wiring boards having excellent heat resistance, particularly during production procedures.

Inventors

  • 👤 Naoyuki Urasaki
  • 👤 Kouichi Tsuyama
  • 👤 Kiyoshi Hasegawa
  • 👤 Shuichi Hatakeyama
  • 👤 Akinari Kida
  • 👤 Akishi Nakaso
  • 👤 Hiroshi Nomura

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-08 16:14
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/02; H05K3/022; H05K3/025; H05K3/06; H05K3/061; H05K3/062; H05K2203/00; H05K2203/01; H05K2203/0147; H05K2203/0152; H05K2203/03; H05K2203/0307; H05K2203/0376; H05K2203/0384; H05K2203/07; H05K2203/0703; H05K2203/0723; H05K2203/0726; H05K3/38; H05K3/382; H05K3/383; Y; Y10; Y10S; Y10S428/00; Y10S428/922; Y10S428/9335; Y10S428/934; Y10S428/935; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49155; Y10T428/00; Y10T428/12; Y10T428/12431; Y10T428/12438; Y10T428/12472; Y10T428/12493; Y10T428/12771; Y10T428/12861; Y10T428/12903; Y10T428/1291; Y10T428/12993

Claims Analysis

Total Claims: 11
Claim 1
Independent Claim 84 words
A metal foil for printed wiring boards, which comprises a first copper layer having a surface roughness suitable for adhering to a resin and providing an electric circuit, a second copper layer having a sufficient strength as a metal layer as a whole and a coarser surface roughness than that of the first copper layer, and an intermediate layer formed between the first copper layer and the second copper layer and made of a nickel-phosphorus alloy containing 1.1% by weight or more of phosphorus.
Claim 2
Dependent Claim 84 words
A metal foil for printed wiring boards, which comprises a first copper layer having a surface roughness suitable for adhering to a resin and providing an electric circuit, a second copper layer having a sufficient strength as a metal layer as a whole and a coarser surface roughness than that of the first copper layer, and an intermediate layer formed between the first copper layer and the second copper layer and made of a nickel-phosphorus alloy containing 1.1% by weight or more of phosphorus.
Claim 3
Dependent Claim 19 words
A metal foil according to claim 1, wherein the intermediate layer has a thickness of 0.04 to 1.5 μm.
Claim 4
Dependent Claim 20 words
A metal foil according to claim 2, wherein the first copper layer has a thickness of 1 to 15 μm.
Claim 5
Dependent Claim 20 words
A metal foil according to claim 3, wherein the second copper layer has a thickness of 10 to 150 μm.
Claim 6
Dependent Claim 19 words
A metal foil according to claim 4, wherein the nickel-phosphorus alloy contains 1.1 to 6.5% by weight of phosphorus.
Claim 7
Dependent Claim 35 words
A metal foil according to claim 1, which further comprises a rust proof film formed on at least one side of the first copper layer and/or the second copper layer which is exposed to air.
Claim 8
Dependent Claim 25 words
A metal foil according to claim 6, wherein the rust proof film comprises a film of an imidazole organic compound, a chromate or a zincate.
Claim 9
Dependent Claim 19 words
A metal foil according to claim 1, wherein the nickel-phosphorus alloy contains 1.1 to 6.5% by weight of phosphorus.
Claim 10
Dependent Claim 28 words
A metal foil according to claim 1, wherein the intermediate layer is formed by electrolytic plating the nickel-phosphorus alloy on the roughened surface of the second copper layer.
Claim 11
Dependent Claim 36 words
A metal foil according to claim 1, wherein the surface roughness of the first copper layer is about 2 to 4 μm and the surface roughness of the second layer is about 5 to 20 μm.

References Cited (Backward Citations)

US3857683A Cited
US3998601A Cited
US4088544A Cited
GB2073778A Cited
US4935310A Cited
US4503112A Cited
US4888574A Cited
US5262247A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1998-04-03 1998-10-03 1999-04-04 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2002-04-03 2002-10-03 2003-04-04 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2006-04-03 2006-10-03 2007-04-04 $7700.00 Window Closed / Lapsed

Assigned Categories & Tags

No categories assigned to this patent yet.

Assign Category Tag