US4935310A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Copper foil for a printed circuit and a method for the production thereof
Assignee: Furukawa Circuit Foil Co Ltd
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Filing: 1989-09-07
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Granted: 1990-06-19
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Expires: 2009-09-07
Abstract
Abstract A copper-clad laminated board which comprises a resin substrate and a copper foil laminated on said substrate, said copper foil having a resin substrate bonding surface coated completely with a layer consisting essentially of a phosphorus-containing nickel layer formed by electrodeposition, said substrate being in face-to-face contact with said bonding surface of said copper foil.
Inventors
- 👤 Hiroshi Nakatsugawa
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 11:33
CPC Classifications
C; C25; C25D; C25D3/00; C25D3/02; C25D3/56; C25D3/562; C25D5/00; C25D5/10; C25D5/627; H; H05; H05K; H05K3/00; H05K3/38; H05K3/382; H05K3/384; H05K2201/00; H05K2201/03; H05K2201/0332; H05K2201/0335; H05K2201/0355; H05K2203/00; H05K2203/07; H05K2203/0703; H05K2203/0723; Y; Y10; Y10S; Y10S428/00; Y10S428/922; Y10S428/9335; Y10S428/934; Y10S428/935; Y10T; Y10T428/00; Y10T428/12; Y10T428/12431; Y10T428/12438; Y10T428/12493; Y10T428/12535; Y10T428/12556; Y10T428/12569; Y10T428/12771; Y10T428/12861; Y10T428/12903; Y10T428/1291
Claims Analysis
Total Claims: 5
Claim 1
Independent Claim
92 words
A copper-clad laminated board for preparing a printed circuit consisting of a highly electroconductive pattern which comprises a resin substrate and a copper foil laminated on said substrate, said copper foil having a resin substrate bonding surface coated completely with a layer 0.02 to 0.2 micron thick consisting essentially of a phosphorus-containing nickel layer formed by electro-desposition, said substrate being in face-to-face contact with said bonding surface of said copper foil, said nickel layer containing 0.05 to 10% by weight of phosphorus and being easily etchable with an ammonium persulfate etching solution.
Claim 2
Dependent Claim
92 words
A copper-clad laminated board for preparing a printed circuit consisting of a highly electroconductive pattern which comprises a resin substrate and a copper foil laminated on said substrate, said copper foil having a resin substrate bonding surface coated completely with a layer 0.02 to 0.2 micron thick consisting essentially of a phosphorus-containing nickel layer formed by electro-desposition, said substrate being in face-to-face contact with said bonding surface of said copper foil, said nickel layer containing 0.05 to 10% by weight of phosphorus and being easily etchable with an ammonium persulfate etching solution.
Claim 3
Dependent Claim
18 words
The copper clad laminated board of claim 1, wherein said nickel layer contains from 1 to 8.7% phosphorus.
Claim 4
Dependent Claim
18 words
The copper clad laminated board of claim 1, wherein said nickel layer contains from 2 to 8% phosphorus.
Claim 5
Dependent Claim
18 words
The copper clad laminated board of claim 1, wherein said nickel layer contains from 2 to 7% phosphorus.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1993-06-18 | 1993-12-18 | 1994-06-19 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1997-06-18 | 1997-12-18 | 1998-06-19 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2001-06-18 | 2001-12-18 | 2002-06-19 | $7700.00 | Window Closed / Lapsed |