US3998601A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Thin foil
Assignee: Circuit Foil USA Inc
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Filing: 1973-12-03
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Granted: 1976-12-21
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Expires: 1993-12-03
Abstract
Abstract A composite foil having an electrolytically formed copper or copper-containing layer and a second electrolytically formed copper layer of a thickness which is not self-supporting, the copper layer and the second metal layer being separated by a coating of a release agent. A process for producing such a composite foil wherein the thin copper layer is formed in a single plating bath containing a copper acid electrolyte. A method for producing copper clad elements suitable for the manufacture of printed circuits from such foils and laminates so produced.
Inventors
- 👤 Charles B. Yates
- 👤 Adam M. Wolski
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-26 18:01
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/02; H05K3/022; H05K3/025; B; B32; B32B; B32B15/00; B32B15/20; B32B2250/00; B32B2250/02; B32B2255/00; B32B2255/06; B32B2311/00; B32B2311/12; B32B2457/00; B32B2457/08; H05K2203/00; H05K2203/01; H05K2203/0147; H05K2203/0152; H05K2203/03; H05K2203/0315; H05K2203/07; H05K2203/0703; H05K2203/0726; Y; Y10; Y10S; Y10S205/00; Y10S205/917; Y10T; Y10T428/00; Y10T428/12; Y10T428/12431; Y10T428/12438; Y10T428/12472; Y10T428/12493; Y10T428/12535; Y10T428/12583; Y10T428/1259; Y10T428/12701; Y10T428/12771; Y10T428/12778; Y10T428/12806; Y10T428/12826; Y10T428/12847; Y10T428/12861; Y10T428/12903; Y10T428/1291; Y10T428/12993; Y10T428/26; Y10T428/269
Claims Analysis
Total Claims: 40
Claim 1
Independent Claim
51 words
A composite foil comprising an electrodeposited copper support layer, a second electrodeposited copper layer of a thickness which is not self-supporting and a thin layer of a release agent intermediate said copper support layer and said second copper layer, said composite foil being capable of being taken up into rolled form.
Claim 2
Dependent Claim
51 words
A composite foil comprising an electrodeposited copper support layer, a second electrodeposited copper layer of a thickness which is not self-supporting and a thin layer of a release agent intermediate said copper support layer and said second copper layer, said composite foil being capable of being taken up into rolled form.
Claim 3
Dependent Claim
17 words
The composite foil of claim 1 wherein said second layer has a thickness of about 2-12 microns.
Claim 4
Dependent Claim
17 words
The composite foil of claim 1 wherein said release agent is selected from sulphides, chromates and oxides.
Claim 5
Dependent Claim
13 words
The composite foil of claim 1 wherein said release agent is a metal.
Claim 6
Dependent Claim
20 words
The composite foil of claim 1 wherein said release agent comprises a metal selected from chromium, lead, nickel and silver.
Claim 7
Dependent Claim
12 words
The composite foil of claim 1 wherein said release agent is chromium.
Claim 8
Dependent Claim
38 words
A composite foil comprising an electrodeposited copper support layer, a second electrodeposited copper layer of a thickness which is not self-supporting and a thin layer of depassivated chromium intermediate said copper support layer and said second copper layer.
Claim 9
Dependent Claim
38 words
A composite foil comprising an electrodeposited copper support layer, a second electrodeposited copper layer of a thickness which is not self-supporting and a thin layer of depassivated chromium intermediate said copper support layer and said second copper layer.
Claim 10
Dependent Claim
35 words
The composite foil of claim 7 wherein said depassivated chromium is formed by subjecting a chromium layer to hydrogen scrubbing to remove at least part of the oxide coating on the surface of said chromium.
Claim 11
Dependent Claim
17 words
The composite foil of claim 8 wherein said second layer has a thickness of about 2-12 microns.
Claim 12
Dependent Claim
22 words
A laminate comprising the composite foil of claim 1, the second copper layer of which is bonded to a resinous insulating substrate.
Claim 13
Independent Claim
75 words
A method for forming a composite foil suitable for use in the manufacture of printed circuits comprising electrodepositing a layer of copper in a non-self-supporting thickness on an electrically conductive electrodeposited copper foil carrier which is capable of being taken up into rolled form, the surface of said carrier over which said layer of copper is deposited having a coating of an agent which will permit release of said metal from said carrier without tearing.
Claim 14
Independent Claim
75 words
A method for forming a composite foil suitable for use in the manufacture of printed circuits comprising electrodepositing a layer of copper in a non-self-supporting thickness on an electrically conductive electrodeposited copper foil carrier which is capable of being taken up into rolled form, the surface of said carrier over which said layer of copper is deposited having a coating of an agent which will permit release of said metal from said carrier without tearing.
Claim 15
Dependent Claim
49 words
A method as defined in claim 11 wherein said layer of copper is electrodeposited on said copper foil carrier containing said release agent by passing said carrier through a copper-containing acid sulphate electrolyte and rendering said carrier sufficiently cathodic to cause a non-self-supporting layer of copper to electrodeposit thereon.
Claim 16
Dependent Claim
13 words
A method as defined in claim 11 wherein said release agent is chromium.
Claim 17
Dependent Claim
20 words
The composite foil of claim 1 wherein said carrier layer has a thickness of from about 30 to 150 microns.
Claim 18
Dependent Claim
60 words
A composite foil produced in accordance with the process of claim 11 comprising an electrodeposited copper support layer, a second electrodeposited copper layer of a thickness which is not self-supporting and a thin layer of a release agent intermediate said copper support layer and said second copper layer, said composite foil being capable of being taken up into rolled form.
Claim 19
Dependent Claim
19 words
The composite foil of claim 15 wherein said second layer has a thickness from about 2 to 12 microns.
Claim 20
Dependent Claim
17 words
The composite foil of claim 15 wherein said release agent is selected from sulfides, chromates and oxides.
Claim 21
Dependent Claim
13 words
The composite foil of claim 15 wherein said release agent is a metal.
Claim 22
Dependent Claim
20 words
The composite foil of claim 15 wherein said release agent comprises a metal selected from chromium, lead, nickel and silver.
Claim 23
Dependent Claim
12 words
The composite foil of claim 15 wherein said release agent is chromium.
Claim 24
Dependent Claim
18 words
The composite foil of claim 15 wherein said carrier layer has a thickness of from about 30-150 microns.
Claim 25
Dependent Claim
23 words
The composite foil of claim 15 wherein the matte surface of said electrodeposited copper support layer is facing said second layer of copper.
Claim 26
Independent Claim
81 words
A method for forming a composite foil suitable for use in the manufacture of printed circuits comprising electrodepositing a layer of copper in a non-self-supporting thickness on an electrically conductive electrodeposited copper foil carrier, said carrier being capable of being taken up into rolled form, the surface of said carrier over which said layer of copper is deposited having a coating of at least partially depassivated chromium which will permit release of said layer of copper from said carrier without tearing.
Claim 27
Independent Claim
81 words
A method for forming a composite foil suitable for use in the manufacture of printed circuits comprising electrodepositing a layer of copper in a non-self-supporting thickness on an electrically conductive electrodeposited copper foil carrier, said carrier being capable of being taken up into rolled form, the surface of said carrier over which said layer of copper is deposited having a coating of at least partially depassivated chromium which will permit release of said layer of copper from said carrier without tearing.
Claim 28
Dependent Claim
43 words
A method as defined in claim 23 wherein said depassivation is accomplished by passing the copper foil carrier coated with said release agent through an aqueous acid solution and rendering said foil carrier sufficiently cathodic to cause hydrogen to evolve at its surface.
Claim 29
Dependent Claim
16 words
A method as defined in claim 24 wherein said acid solution is a phosphoric acid solution.
Claim 30
Dependent Claim
45 words
A composite foil produced in accordance with the method of claim 24 comprising an electrodeposited copper support layer, a second electrodeposited copper layer of a thickness which is non-self-supporting and a thin layer of depassivated chromium intermediate said copper support layer and said second layer.
Claim 31
Dependent Claim
15 words
A method as defined in claim 23 wherein said depassivation is accomplished by hydrogen scrubbing.
Claim 32
Dependent Claim
48 words
A method of forming a copper clad laminate suitable for use in the manufacture of printed circuits comprising superimposing the composite foil of claim 22 on a resinous insulating substrate with said layer of copper in contact with said substrate and laminating said composite foil to said substrate.
Claim 33
Dependent Claim
11 words
The copper clad laminate produced by the method of claim 28.
Claim 34
Dependent Claim
15 words
The method of claim 28 additionally comprising peeling said foil carrier off of said laminate.
Claim 35
Dependent Claim
11 words
The copper clad laminate produced by the method of claim 30.
Claim 36
Dependent Claim
42 words
A composite foil produced in accordance with the method of claim 27 wherein said depassivated chromium is formed by subjecting a chromium layer to hydrogen scrubbing to remove at least a portion of the oxide coating on the surface of said chromium.
Claim 37
Dependent Claim
20 words
The composite foil of claim 32 wherein the layer of non-self-supporting copper has a thickness of from about 2-12 microns.
Claim 38
Dependent Claim
11 words
A laminate formed in accordance with the process of claim 25.
Claim 39
Dependent Claim
23 words
The composite foil of claim 1 wherein the matte surface of said electrodeposited copper support layer is facing said second layer of copper.
Claim 40
Dependent Claim
24 words
A method as defined in claim 11 wherein said layer of copper is electrodeposited on the matte side of said electrodeposited copper foil carrier.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1979-12-21 | 1980-06-21 | 1980-12-21 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1983-12-21 | 1984-06-21 | 1984-12-21 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1987-12-21 | 1988-06-21 | 1988-12-21 | $7700.00 | Window Closed / Lapsed |