US5399233A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of and apparatus for manufacturing a semiconductor substrate
Assignee: Fujitsu Ltd
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Filing: 1992-12-04
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Granted: 1995-03-21
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Expires: 2012-12-04
Abstract
Abstract In a process of manufacturing a semiconductor substrate having a SOI (silicon on insulator) structure, grooves are formed in a silicon layer reduced in thickness to several microns so that the silicon layer is separated into island-like regions corresponding to a chip size or device regions, and a stopper having a thickness corresponding to a desired final thickness of the silicon layer is formed in the grooves. The silicon layer is scanned with a piece of polishing cloth which has an area larger than that of each island-like region but sufficiently smaller than that of silicon layer and which is attached to a pressing surface of the polishing jig, thereby polishing the silicon layer until the stopper is exposed. The thickness of the silicon layer is measured at a position such that the thickness of a portion thereof is measured immediately before the same portion is polished. The pressure applied to the polishing cloth or the rotational speed of the polishing jig is controlled on the basis of thickness data thereby obtained. The thickness of a silicon layer having a diameter of 6 inches was thereby reduced uniformly to 0.1 to 1 μm.
Inventors
- 👤 Maki Murazumi
- 👤 Yoshihiro Arimoto
- 👤 Atsushi Fukuroda
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-26 03:23
CPC Classifications
H; H10; H10P; H10P52/00; H10P52/40; H10P52/402; H10P90/00; H10P90/19; H10P90/1904; H10P90/1906; H10P90/1914; H10W; H10W10/00; H10W10/10; H10W10/181; Y; Y10; Y10S; Y10S438/00; Y10S438/959; Y10S438/977
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
278 words
A method of manufacturing a substrate including a plurality of semiconductor islands formed on a supporting substrate member with an insulation layer intervening therebetween, the semiconductor islands each having a selected size and a selected thickness, said method comprising the steps of: forming a semiconductor layer on the supporting substrate member with the insulation layer intervening therebetween, the semiconductor layer having a thickness larger than the selected thickness; forming grooves in a surface of the semiconductor layer so as to divide the semiconductor layer into a plurality of regions each corresponding to each of the semiconductor islands and having a size equal to the selected size of a corresponding semiconductor island; selectively forming a stopper layer in the grooves, the stopper layer being formed from an insulating material harder to be polished than the semiconductor layer and having a thickness allowing the stopper layer to have a surface level higher than that of the insulation layer by a difference provided therebetween substantially equal to the selected thickness of each of the semiconductor islands; selecting a polishing cloth so as to have a size which is larger in comparison with each of the regions in the semiconductor layer and is smaller than the semiconductor layer; polishing the entire surface of the semiconductor layer by moving the polishing cloth along the surface of the semiconductor layer, while the polishing cloth is pressed down to the surface of the semiconductor layer by a force applied thereto and rotates at a rotational speed, until the semiconductor layer at each of the regions has a thickness which provides the semiconductor layer with a surface level substantially equal to that of the stopper layer.
Claim 2
Independent Claim
278 words
A method of manufacturing a substrate including a plurality of semiconductor islands formed on a supporting substrate member with an insulation layer intervening therebetween, the semiconductor islands each having a selected size and a selected thickness, said method comprising the steps of: forming a semiconductor layer on the supporting substrate member with the insulation layer intervening therebetween, the semiconductor layer having a thickness larger than the selected thickness; forming grooves in a surface of the semiconductor layer so as to divide the semiconductor layer into a plurality of regions each corresponding to each of the semiconductor islands and having a size equal to the selected size of a corresponding semiconductor island; selectively forming a stopper layer in the grooves, the stopper layer being formed from an insulating material harder to be polished than the semiconductor layer and having a thickness allowing the stopper layer to have a surface level higher than that of the insulation layer by a difference provided therebetween substantially equal to the selected thickness of each of the semiconductor islands; selecting a polishing cloth so as to have a size which is larger in comparison with each of the regions in the semiconductor layer and is smaller than the semiconductor layer; polishing the entire surface of the semiconductor layer by moving the polishing cloth along the surface of the semiconductor layer, while the polishing cloth is pressed down to the surface of the semiconductor layer by a force applied thereto and rotates at a rotational speed, until the semiconductor layer at each of the regions has a thickness which provides the semiconductor layer with a surface level substantially equal to that of the stopper layer.
Claim 3
Dependent Claim
81 words
A method according to claim 1, wherein the step of polishing comprises the substeps of: measuring the thickness of the semiconductor layer at each of the regions immediately before when the polishing cloth moves to corresponding one of the regions; and controlling the force applied to the polishing cloth such that the force is reduced if the thickness measured is smaller than a comparison value, and is increased if the thickness measured is equal to or larger than the comparison value.
Claim 4
Dependent Claim
82 words
A method according to claim 1, wherein the step of polishing comprises the substeps of: measuring the thickness of the semiconductor layer at each of the regions immediately before when the polishing cloth moves to corresponding one of the regions; and controlling the rotational speed of the polishing cloth such that the rotational speed is reduced if the thickness measured is smaller than a comparison value, and is increased if the thickness measured is equal to or larger than the comparison value.
Claim 5
Dependent Claim
55 words
A method according to claim 1, wherein the step of polishing comprises the substeps of: fixing the supporting substrate member on a surface table so as to expose the surface of the semiconductor layer having the stopper layer; and rotating the surface table at a speed lower than the rotational speed of the polishing cloth.
Claim 6
Dependent Claim
31 words
A method according to claim 4, wherein said step of polishing comprises a substep of moving the polishing cloth on a straight line passing through the center of the surface table.
Claim 7
Dependent Claim
89 words
A method according to claim 1, wherein the step of forming the stopper layer comprises the substeps of: depositing the insulating material on the surface of the semiconductor layer having the grooves formed therein, so as to form a layer having a thickness smaller than the thickness of the semiconductor layer; forming a resist layer to selectively fill the grooves of the semiconductor layer on which surface the insulating material deposited; selectively removing the insulating material exposed from the resist layer, then removing the resist layer in the grooves.
Claim 8
Dependent Claim
36 words
A method according to claim 1, wherein the step of polishing the semiconductor layer is conducted such that the polishing cloth moves along the surface of the semiconductor layer, while the semiconductor layer is at rest.
Claim 9
Dependent Claim
47 words
A method according to claim 1, wherein the supporting substrate member and the semiconductor layer are formed from silicon, while the insulation layer is formed from silicon oxide produced by thermally oxidizing a surface of at least one of the supporting substrate member and the semiconductor layer.
Claim 10
Dependent Claim
55 words
A method of manufacturing a substrate as recited in claim 1, wherein said polishing cloth is selected so as to have a size which is larger than each of the regions in the semiconductor layer, and wherein said polishing cloth has a size which is less than 30% of the size of the semiconductor layer.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1998-03-20 | 1998-09-19 | 1999-03-21 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2002-03-20 | 2002-09-19 | 2003-03-21 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2006-03-20 | 2006-09-19 | 2007-03-21 | $7700.00 | Window Closed / Lapsed |