US5397746A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Quad flat package heat slug composition
Assignee: Intel Corp
•
Filing: 1993-11-03
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Granted: 1995-03-14
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Expires: 2013-11-03
Abstract
Abstract An integrated circuit package which contains a heat slug that extends from an integrated circuit to a top surface of a surrounding housing. The heat slug has a coefficient of thermal expansion that matches the coefficients of thermal expansion of the housing and the integrated circuit to reduce thermal stresses in the package.
Inventors
- 👤 II Richard C. Blish
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-06 20:03
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/70; H10W40/77; H10W40/778; H10W74/00; H10W74/40; H10W74/47; H10W74/473; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121
Claims Analysis
Total Claims: 4
Claim 1
Independent Claim
103 words
A method of assembling a semiconductor package, comprising the steps of: a) coupling a lead frame to an integrated circuit; b) coupling a heat slug to said lead frame, said heat slug having a top surface and being constructed from a composition of 70% copper and 30% molybdenum; c) encapsulating said integrated circuit, a portion of said lead frame and said heat slug to essentially said top surface of said heat slug with a plastic dielectric housing material; and, d) heating said plastic dielectric housing material, said heat slug, said lead frame and said integrated circuit to cure said plastic dielectric housing material.
Claim 2
Independent Claim
103 words
A method of assembling a semiconductor package, comprising the steps of: a) coupling a lead frame to an integrated circuit; b) coupling a heat slug to said lead frame, said heat slug having a top surface and being constructed from a composition of 70% copper and 30% molybdenum; c) encapsulating said integrated circuit, a portion of said lead frame and said heat slug to essentially said top surface of said heat slug with a plastic dielectric housing material; and, d) heating said plastic dielectric housing material, said heat slug, said lead frame and said integrated circuit to cure said plastic dielectric housing material.
Claim 3
Independent Claim
97 words
A method of assembling a semiconductor package, comprising the steps of: a) coupling a lead frame to an integrated circuit; b) coupling a nickel heat slug to said lead frame, said heat slug having a top surface; c) encapsulating said integrated circuit, a portion of said lead frame and said heat slug to essentially said top surface of said heat slug with a dielectric plastic housing material; and, d) heating said plastic dielectric housing material, said heat slug, said lead frame and said integrated circuit to cure said plastic dielectric housing material. said plastic dielectric housing material.
Claim 4
Independent Claim
97 words
A method of assembling a semiconductor package, comprising the steps of: a) coupling a lead frame to an integrated circuit; b) coupling a nickel heat slug to said lead frame, said heat slug having a top surface; c) encapsulating said integrated circuit, a portion of said lead frame and said heat slug to essentially said top surface of said heat slug with a dielectric plastic housing material; and, d) heating said plastic dielectric housing material, said heat slug, said lead frame and said integrated circuit to cure said plastic dielectric housing material. said plastic dielectric housing material.
References Cited (Backward Citations)
US4965659A
Cited
US4994411A
Cited
US5081067A
Cited
US5216283A
Cited
US5227662A
Cited
US5202288A
Cited
US5304843A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1998-03-13 | 1998-09-12 | 1999-03-14 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2002-03-13 | 2002-09-12 | 2003-03-14 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2006-03-13 | 2006-09-12 | 2007-03-14 | $7700.00 | Window Closed / Lapsed |