Continuous phase and amplitude holographic elements

Claim 1

A method for creation of a phase hologram element with n-ary levels of phase delay assigned to pixel areas thereof, where the number of levels is greater than sixteen, using e-beam lithography for creating complex surface relief patterns in a layer of low contrast e-beam resist material on a transparent substrate, comprising the steps of exposing said pixel areas by a range of low doses of e-beam at n-ary levels in polymer resist material with individual dose correction for proximity effect, and partially developing said resist material by controlled time of development less than necessary for full development, resulting in partial removal of e-beam exposed resist material in pixel areas in proportion to said n-ary levels of e-beam doses, wherein exposures to said e-beam of adjacent pixels are each individually assigned a primary dose corrected for proximity effect, said proximity effect being defined as exposure dose contributed by backscattered electrons from said transparent substrate, said proximity effect being of the Gaussian form ##EQU5## where D p , which depends strongly on substrate composition and geometry and upon the electron beam voltage, is the proximity dose intensity at distance r from a primary point dose Q o delivered at r=0, η is the proximity factor, and α is the range of the Gaussian, and said primary dose assigned to each of said adjacent pixels is corrected by having the total dose arriving at said distance r due to a spatially varying patterned primary dose D prim , expressed as a convolution of an effective point spread function, PSF, with that patterned primary dose, as: ##EQU6## where ##EQU7##

Claim 2

A method for creation of a phase hologram element with n-ary levels of phase delay assigned to pixel areas thereof, where the number of levels is greater than sixteen, using e-beam lithography for creating complex surface relief patterns in a layer of low contrast e-beam resist material on a transparent substrate, comprising the steps of exposing said pixel areas by a range of low doses of e-beam at n-ary levels in polymer resist material with individual dose correction for proximity effect, and partially developing said resist material by controlled time of development less than necessary for full development, resulting in partial removal of e-beam exposed resist material in pixel areas in proportion to said n-ary levels of e-beam doses, wherein exposures to said e-beam of adjacent pixels are each individually assigned a primary dose corrected for proximity effect, said proximity effect being defined as exposure dose contributed by backscattered electrons from said transparent substrate, said proximity effect being of the Gaussian form ##EQU5## where D p , which depends strongly on substrate composition and geometry and upon the electron beam voltage, is the proximity dose intensity at distance r from a primary point dose Q o delivered at r=0, η is the proximity factor, and α is the range of the Gaussian, and said primary dose assigned to each of said adjacent pixels is corrected by having the total dose arriving at said distance r due to a spatially varying patterned primary dose D prim , expressed as a convolution of an effective point spread function, PSF, with that patterned primary dose, as: ##EQU6## where ##EQU7##

Claim 3

A method for creation of an amplitude hologram in registration with a phase hologram element having n-ary levels of phase delay assigned to pixel areas thereof, where the number of levels is greater than sixteen, said method for creation of an amplitude hologram comprising the steps of first depositing a thin film of metal on said transparent substrate, depositing a film of resist material over said thin film of metal on said transparent substrate, exposing with a fixed maximum dose a separately selected percentage of each pixel area of said amplitude hologram, thereby producing a binary exposed film of resist material, fully developing said binary exposed film of resist material, thereby producing an encoded resist mask, fully etching said thin film of metal through said encoded resist mask, stripping said encoded resist mask, thereby leaving an encoded pattern of fully etched thin film of metal, and depositing a layer of low contrast e-beam resist material over said encoded pattern fully etched thin film of metal, and then proceeding with creation of said phase hologram over said amplitude hologram using e-beam lithography for creating complex surface relief patterns in a layer of low contrast e-beam resist material on said transparent substrate, exposing said pixel areas of said phase delay hologram by a range of low doses of e-beam at n-ary levels in said e-beam resist material, and partially developing said e-beam resist material by controlled time of development less than necessary for full development, resulting in partial removal of e-beam exposed resist material in pixel areas in proportion to said n-ary levels of e-beam doses.

Claim 4

A method for creation of an amplitude hologram in registration with a phase hologram element having n-ary levels of phase delay assigned to pixel areas thereof, where the number of levels is greater than sixteen, said method for creation of an amplitude hologram comprising the steps of first depositing a thin film of metal on said transparent substrate, depositing a film of resist material over said thin film of metal on said transparent substrate, exposing with a fixed maximum dose a separately selected percentage of each pixel area of said amplitude hologram, thereby producing a binary exposed film of resist material, fully developing said binary exposed film of resist material, thereby producing an encoded resist mask, fully etching said thin film of metal through said encoded resist mask, stripping said encoded resist mask, thereby leaving an encoded pattern of fully etched thin film of metal, and depositing a layer of low contrast e-beam resist material over said encoded pattern fully etched thin film of metal, and then proceeding with creation of said phase hologram over said amplitude hologram using e-beam lithography for creating complex surface relief patterns in a layer of low contrast e-beam resist material on said transparent substrate, exposing said pixel areas of said phase delay hologram by a range of low doses of e-beam at n-ary levels in said e-beam resist material, and partially developing said e-beam resist material by controlled time of development less than necessary for full development, resulting in partial removal of e-beam exposed resist material in pixel areas in proportion to said n-ary levels of e-beam doses.