Patent US5381599A successfully refreshed from Google Patents.
US5381599A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Liquid crystal polymer encapsulated electronic devices and methods of making the same
Assignee: Delphi Technologies Inc
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Filing: 1993-04-12
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Granted: 1995-01-17
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Expires: 2013-04-12
Abstract
Abstract Disclosed is a high temperature, high pressure process of encapsulating electronic devices. The high pressure process is particularly suitable for encapsulating flip-chip devices wherein the collapse of flip-chip solder bumps is prevented. A special mold may be used to prevent the ceramic substrate of the flip-chip device from breaking under the high injection pressure conditions. The encapsulant is a rigid liquid crystal polymer.
Inventors
- 👤 Gregory L. Hall
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-08 20:08
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/01; H10W74/012; H10W74/016; H10W74/10; H10W74/111; H10W74/121; H10W74/15; H10W74/40; H10W74/47; H10W72/00; H10W72/851; H10W72/853; H10W72/856; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49169; Y10T29/49171; Y10T29/49172
Claims Analysis
Total Claims: 5
Claim 1
Independent Claim
97 words
A process of encapsulating an electronic device comprising: providing a device having ceramic substrate and a hybrid circuit formed thereon including a flip-chip secured to the hybrid circuit with solder bumps having a melting temperature of about 170° C. to 210° C.; placing said device in the cavity of a mold; injecting a liquid crystal polymer encapsulation material into the cavity at a temperature ranging from about 320° C. to about 377° C., and at a sufficiently high enough pressure to solidify the encapsulating material so that the solder bumps do not flow during the injecting step.
Claim 2
Dependent Claim
97 words
A process of encapsulating an electronic device comprising: providing a device having ceramic substrate and a hybrid circuit formed thereon including a flip-chip secured to the hybrid circuit with solder bumps having a melting temperature of about 170° C. to 210° C.; placing said device in the cavity of a mold; injecting a liquid crystal polymer encapsulation material into the cavity at a temperature ranging from about 320° C. to about 377° C., and at a sufficiently high enough pressure to solidify the encapsulating material so that the solder bumps do not flow during the injecting step.
Claim 3
Dependent Claim
21 words
A process as set forth in claim 1 wherein said liquid crystal polymer comprises p,p'bisphenol, p-hydroxybenzoic acid and terephthalic acid monomers.
Claim 4
Dependent Claim
35 words
A process as set forth in claim 1 wherein said liquid crystal polymer has a specific gravity of about 1.7 to about 1.9 at a temperature ranging from about 320° C. to about 377° C.
Claim 5
Dependent Claim
47 words
A process as set forth in claim 1 wherein said liquid crystal polymer has a thermal expansion coefficient less than said flip-chip and further comprising coating said flip-chip with an elastic dielectric gel material so that the flip-chip may expand during operation without damage to the chip.
References Cited (Backward Citations)
US4139399A
Cited
US4480975A
Cited
JPS5810841A
Cited
US4632798A
Cited
US4701830A
Cited
US4788583A
Cited
US4756392A
Cited
US4965227A
Cited
US4925266A
Cited
US5219502A
Cited
US4983713A
Cited
US4994895A
Cited
US5219795A
Cited
US5087479A
Cited
US5085913A
Cited
JPH0423442A
Cited
US5251679A
Cited
US5186383A
Cited
US5223344A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1998-01-16 | 1998-07-18 | 1999-01-17 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2002-01-16 | 2002-07-18 | 2003-01-17 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2006-01-16 | 2006-07-18 | 2007-01-17 | $7700.00 | Window Closed / Lapsed |