Silicone material

Claim 2

An article of manufacture comprising an electronic device having on at least one surface thereof a cured dielectric material for insulating the electronic device comprising a silicone resin characterized in that: the dielectric material consists essentially of (a) about twenty-one to twenty-five percent by weight of a silicone resin selected from the group consisting of dimethylsiloxane, dimethyl-methylphenylsiloxane, dimethyl-diphenylsiloxane, and mixtures thereof, (b) about seventy to eighty percent by weight of a silica filler, (c) about 0.5 to 0.7 percent by weight of a tin catalyst, and (d) about 0.57 to 0.26 percent by weight of copper (II) benzoylacetonate.

Claim 3

The article of claim 1 further characterized in that: the resin is composed of organic molecules each terminated at opposite ends by a hydroxyl radical.

Claim 4

The article of claim 2 further characterized in that: the tin catalyst consists essentially of tin octanate.

Claim 5

The article of claim 3 further characterized in that: the dielectric is cured at a temperature of between about 170° and 190° C. for a time period equal to about ten and twelve hours.

Claim 6

The article of claim 1 further characterized in that: the dielectric material constitutes a dielectric layer for insulating the electronic device from a ceramic substrate, the ceramic substrate including conductors on one surface thereof.

Claim 7

The article of claim 1 further characterized in that: the dielectric material constitutes an encapsulation for the electronic device.

Claim 8

The article of claim 1 further characterized in that: the dielectric material constitutes an encapsulation for an electronic device and a dielectric material for insulating the electronic device from a ceramic substrate, the ceramic substrate including conductors on one surface thereof.

Claim 9

The article of claim 3 further characterized in that: the filler comprises about 1.5 percent to three percent of fumed silica, with the remainder consisting essentially of fused silica.

Claim 10

A process for making an electronic device comprising the steps of: forming conductors on a surface of a substrate; making a silicone resin precursor; depositing the precursor over the conductors; and curing the precursor by heating it at a temperature of between about 170° and 190° C. for about ten to twelve hours, characterized in that: the precursor consists essentially of (a) about eighteen to twenty-two percent by weight of a silicon resin selected from group consisting essentially of dimethylsiloxane, dimethyl-methylsiloxane, dimethyl-diphenylsiloxane, and mixtures thereof (b) about fifty-nine to seventy-one percent by weight of a silica filler, (c) about eleven to fifteen percent by weight of a solvent of the resin, (d) 0.4 to 0.6 percent by weight of a tin compound catalyst, and (e) about 0.05 to 0.26 percent by weight of copper (II) benzoylacetonate.

Claim 11

A process for making an electronic device comprising the steps of: forming conductors on a surface of a substrate; making a silicone resin precursor; depositing the precursor over the conductors; and curing the precursor by heating it at a temperature of between about 170° and 190° C. for about ten to twelve hours, characterized in that: the precursor consists essentially of (a) about eighteen to twenty-two percent by weight of a silicon resin selected from group consisting essentially of dimethylsiloxane, dimethyl-methylsiloxane, dimethyl-diphenylsiloxane, and mixtures thereof (b) about fifty-nine to seventy-one percent by weight of a silica filler, (c) about eleven to fifteen percent by weight of a solvent of the resin, (d) 0.4 to 0.6 percent by weight of a tin compound catalyst, and (e) about 0.05 to 0.26 percent by weight of copper (II) benzoylacetonate.

Claim 12

The method of claim 9 further characterized in that: the depositing step comprises the step of screen printing the precursor.

Claim 13

The method of claim 9 further characterized in that: the depositing step comprises the step of encapsulating an electronic device component.

Claim 14

The method of claim 9 further characterized in that: the tin compound consists essentially of tin octanate.

Claim 15

The method of claim 9 further characterized in that: the solvent consists essentially of α-terpineol.