Patent US5381306A successfully refreshed from Google Patents.
US5381306A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method and apparatus for delivering power using a multiplane power via matrix
Assignee: Hewlett Packard Development Co LP
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Filing: 1993-08-20
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Granted: 1995-01-10
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Expires: 2013-08-20
Abstract
Abstract Disclosed is an apparatus and method for delivering power utilizing a multiplane power via matrix wherein the vias are each interconnected on each of the planes through which they pass such that a current flowing along any particular via, or via group, is free to either continue along its current path, or to move across any of the planes as a function of least resistance. The invention provides a system of vias for transferring power from any particular first plane to any desired second plane.
Inventors
- 👤 Richard A. Schumacher
- 👤 James R. Day
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 23:49
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/0213; H05K1/0263; H05K1/0265; H05K1/11; H05K1/115; H05K1/116; H05K2201/00; H05K2201/09; H05K2201/09209; H05K2201/09654; H05K2201/09672; H05K2201/0979; H05K3/00; H05K3/40; H05K3/42; H05K3/429; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49155; Y10T29/49162
Claims Analysis
Total Claims: 16
Claim 1
Independent Claim
129 words
A multilayer device, each layer of which is capable of being electrically interconnected with other layers, said device comprising: at least one layer of electrically conductive material on certain of said device layers; a plurality of vias forming a via group having an outer boundary with all vias in said via group extending from an outside layer of said device through a plurality of other device layers, each via in said group electrically conductive and electrically connected to said electrically conductive material on selected ones of said plurality of other layers; wherein said electrically conductive material on selected ones of said layers is interrupted at said outer boundary of said via group; and wherein all of said vias in said via group are electrically interconnected at said outside layer.
Claim 2
Dependent Claim
129 words
A multilayer device, each layer of which is capable of being electrically interconnected with other layers, said device comprising: at least one layer of electrically conductive material on certain of said device layers; a plurality of vias forming a via group having an outer boundary with all vias in said via group extending from an outside layer of said device through a plurality of other device layers, each via in said group electrically conductive and electrically connected to said electrically conductive material on selected ones of said plurality of other layers; wherein said electrically conductive material on selected ones of said layers is interrupted at said outer boundary of said via group; and wherein all of said vias in said via group are electrically interconnected at said outside layer.
Claim 3
Dependent Claim
143 words
A multilayer device, each layer of which is capable of being electrically interconnected with other layers, said device comprising: at least one layer of electrically conductive material on certain of said device layers; a plurality of vias forming a via group having an outer boundary with all vias in said via group extending from an outside layer of said device through a plurality of other device layers, each via in said group electrically conductive and electrically connected to said electrically conductive material on selected ones of said plurality of other layers; and wherein said electrically conductive material on selected ones of said layers is interrupted at said outer boundary of said via group; and all of said vias in said via group extend to a common layer, and all of said vias in said via group are electrically interconnected at said common layer.
Claim 4
Dependent Claim
143 words
A multilayer device, each layer of which is capable of being electrically interconnected with other layers, said device comprising: at least one layer of electrically conductive material on certain of said device layers; a plurality of vias forming a via group having an outer boundary with all vias in said via group extending from an outside layer of said device through a plurality of other device layers, each via in said group electrically conductive and electrically connected to said electrically conductive material on selected ones of said plurality of other layers; and wherein said electrically conductive material on selected ones of said layers is interrupted at said outer boundary of said via group; and all of said vias in said via group extend to a common layer, and all of said vias in said via group are electrically interconnected at said common layer.
Claim 5
Dependent Claim
168 words
A multilayer device, each layer of which is capable of being electrically interconnected with other layers, said device comprising: at least one layer of electrically conductive material on certain of said device layers; a plurality of vias forming a via group having an outer boundary with all vias in said via group extending from an outside layer of said device through a plurality of other device layers, each via in said group electrically conductive and electrically connected to said electrically conductive material on selected ones of said plurality of other layers; a channel positioned within said via group and extending through said device layers, said channel being electrically conductive and having a diameter for accepting a power terminal of a circuit device mounted to said multilayer device; and wherein said electrically conductive material on selected ones of said layers is interrupted at said outer boundary of said via group, and said channel is electrically connected to all of said vias in said via group at said outer layer.
Claim 6
Dependent Claim
168 words
A multilayer device, each layer of which is capable of being electrically interconnected with other layers, said device comprising: at least one layer of electrically conductive material on certain of said device layers; a plurality of vias forming a via group having an outer boundary with all vias in said via group extending from an outside layer of said device through a plurality of other device layers, each via in said group electrically conductive and electrically connected to said electrically conductive material on selected ones of said plurality of other layers; a channel positioned within said via group and extending through said device layers, said channel being electrically conductive and having a diameter for accepting a power terminal of a circuit device mounted to said multilayer device; and wherein said electrically conductive material on selected ones of said layers is interrupted at said outer boundary of said via group, and said channel is electrically connected to all of said vias in said via group at said outer layer.
Claim 7
Dependent Claim
170 words
A multilayer device, each layer of which is capable of being electrically interconnected with other layers, said device comprising: at least one layer of electrically conductive material on certain of said device layers; a plurality of vias forming a via group having an outer boundary with all vias in said via group extending from an outside layer of said device through a plurality of other device layers, each via in said group electrically conductive and electrically connected to said electrically conductive material on selected ones of said plurality of other layers; a channel positioned within said via group and extending through said device layers, said channel being electrically conductive and having a diameter for accepting a power terminal of a circuit device mounted to said multilayer device; and wherein said electrically conductive material on selected ones of said layers is interrupted at said outer boundary of said via group, and said channel is electrically connected to all of said vias in said via group at selected layers within said device.
Claim 8
Dependent Claim
170 words
A multilayer device, each layer of which is capable of being electrically interconnected with other layers, said device comprising: at least one layer of electrically conductive material on certain of said device layers; a plurality of vias forming a via group having an outer boundary with all vias in said via group extending from an outside layer of said device through a plurality of other device layers, each via in said group electrically conductive and electrically connected to said electrically conductive material on selected ones of said plurality of other layers; a channel positioned within said via group and extending through said device layers, said channel being electrically conductive and having a diameter for accepting a power terminal of a circuit device mounted to said multilayer device; and wherein said electrically conductive material on selected ones of said layers is interrupted at said outer boundary of said via group, and said channel is electrically connected to all of said vias in said via group at selected layers within said device.
Claim 9
Dependent Claim
200 words
A multilayer device, each layer of which is capable of being electrically interconnected with other layers, said device comprising: at least one layer of electrically conductive material on certain of said device layers; a plurality of vias forming a via group having an outer boundary with all vias in said via group extending from an outside layer of said device through a plurality of other device layers, each via in said group electrically conductive and electrically connected to said electrically conductive material on selected ones of said plurality of other layers; a channel positioned within said via group and extending through said device layers, said channel being electrically conductive and having a diameter for accepting a power terminal of a circuit device mounted to said multilayer device; and wherein said electrically conductive material on selected ones of said layers is interrupted at said outer boundary of said via group; said channel extends from said outside device layer to a common layer of said device, and all of said vias in said via group extend to said common layer and wherein all of said vias in said via group as well as said channel are electrically interconnected at said common layer.
Claim 10
Dependent Claim
200 words
A multilayer device, each layer of which is capable of being electrically interconnected with other layers, said device comprising: at least one layer of electrically conductive material on certain of said device layers; a plurality of vias forming a via group having an outer boundary with all vias in said via group extending from an outside layer of said device through a plurality of other device layers, each via in said group electrically conductive and electrically connected to said electrically conductive material on selected ones of said plurality of other layers; a channel positioned within said via group and extending through said device layers, said channel being electrically conductive and having a diameter for accepting a power terminal of a circuit device mounted to said multilayer device; and wherein said electrically conductive material on selected ones of said layers is interrupted at said outer boundary of said via group; said channel extends from said outside device layer to a common layer of said device, and all of said vias in said via group extend to said common layer and wherein all of said vias in said via group as well as said channel are electrically interconnected at said common layer.
Claim 11
Dependent Claim
19 words
The device as set forth in claim 5 wherein said common layer is another outside layer of said device.
Claim 12
Independent Claim
107 words
The method of making a multilayer printed wiring device comprising the steps of: constructing multiple device layers each having conductive material over portions of each said layer; limiting the extent of said conductive material to a defined geometry on all but a selected number of said layers; generating within said defined geometry a plurality of holes columnated with respect to said multiple device layers, such that a column of said holes pass through multiple layers; and coating the insides of said holes of each said column such that the holes in each column are electrically common and electrically connected to said conductive material at each said layer.
Claim 13
Independent Claim
107 words
The method of making a multilayer printed wiring device comprising the steps of: constructing multiple device layers each having conductive material over portions of each said layer; limiting the extent of said conductive material to a defined geometry on all but a selected number of said layers; generating within said defined geometry a plurality of holes columnated with respect to said multiple device layers, such that a column of said holes pass through multiple layers; and coating the insides of said holes of each said column such that the holes in each column are electrically common and electrically connected to said conductive material at each said layer.
Claim 14
Dependent Claim
55 words
The method as set forth in claim 7 further comprising the step of: creating at the center of said geometry a electrically conductive tube having a center portion for accepting a power lead from a device to be connected to said printed wiring device and said electrically conductive columnated holes at a plurality of layers.
Claim 15
Independent Claim
145 words
A device for transferring power from a first layer of a multilayer circuit board to a second layer, said device comprising: a primary current conducting channel having a first diameter; a top plate attached to said primary channel adapted for mating electrically with said device; a plurality of secondary current conducting channels, each having a second diameter, said secondary current conducting channels grouped in association with said primary current conducting channel; a plurality of current conductive connections connecting each said secondary channel with all other secondary current conducting channels and with said primary current conducting channel and with said top plate; the number of said connections being equal to the number of layers of said circuit board; and at least one of said current conductive connections adapted for distributing power at said second layer beyond the circumference of said group of secondary current conducting channels.
Claim 16
Independent Claim
145 words
A device for transferring power from a first layer of a multilayer circuit board to a second layer, said device comprising: a primary current conducting channel having a first diameter; a top plate attached to said primary channel adapted for mating electrically with said device; a plurality of secondary current conducting channels, each having a second diameter, said secondary current conducting channels grouped in association with said primary current conducting channel; a plurality of current conductive connections connecting each said secondary channel with all other secondary current conducting channels and with said primary current conducting channel and with said top plate; the number of said connections being equal to the number of layers of said circuit board; and at least one of said current conductive connections adapted for distributing power at said second layer beyond the circumference of said group of secondary current conducting channels.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1998-01-09 | 1998-07-11 | 1999-01-10 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2002-01-09 | 2002-07-11 | 2003-01-10 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2006-01-09 | 2006-07-11 | 2007-01-10 | $7700.00 | Window Closed / Lapsed |