Abstract A nickel layer insulatively laminated over a circuit pattern of a circuit board is etched to produce weld locations at certain points on said circuit board. In one embodiment, the nickel layer is insulatively laminated over the outer surface of a multilayer board and etched to produce weld sites where an electrical connection between the circuits of the multilayer board and an electrical compound, device, etc. is required. In another embodiment, the weld sites are produced for making welded pin terminations on said board. For that embodiment, a metal pin is inserted in a plated through hole. One end of the pin is bent over and welded to the nickel weld sites so that it is secured within the hole. The other end protrudes from the circuit board for use as a pin termination so that the circuit board can be interconnected with other electrical circuits.
An attachment to a circuit board, said circuit board comprising an electrical circuit interposed between two dielectric layers; plated-through holes extending through said layers; horizontally disposed nickel weld locations on both the exposed surfaces of said dielectric layers, said weld locations being secured directly to the dielectric layers adjacent the platedthrough holes; and said plated-through holes electrically connecting said weld locations and said electrical circuit, said plated-through holes each including a plated layer disposed on top of the outer surfaces of said nickel weld locations.
Claim 2
Dependent Claim
85 words
An attachment to a circuit board, said circuit board comprising an electrical circuit interposed between two dielectric layers; plated-through holes extending through said layers; horizontally disposed nickel weld locations on both the exposed surfaces of said dielectric layers, said weld locations being secured directly to the dielectric layers adjacent the platedthrough holes; and said plated-through holes electrically connecting said weld locations and said electrical circuit, said plated-through holes each including a plated layer disposed on top of the outer surfaces of said nickel weld locations.