Abstract In a sea-of-gate structure gate array in which a plurality of logic gates are arrayed on a semiconductor chip, resistance devices or capacitive devices are formed without reducing the gate scale to form analog components to render the gate array into a hybrid gate array including the analog components. A number of MOS transistors to be formed without vacancies on the chip surface are formed in a thin silicon section on an insulating layer 15. The logic gates arrayed on the chip is of the SOI structure. Below the insulating layer 15, a lower capacitor electrode 12, a dielectric film 13, an upper capacitor electrode 14 and a resistance element are formed so as to be buried in an insulating film 11 on a supporting substrate 10 or in an insulating substrate. The capacitor and the resistance are led to the chip surface by means of a contact hole 23 provided in the insulating layer 15. A grinding stop 16 is formed in the insulating layer 15. The thin silicon section of the SOI structure is produced by grinding the substrate.
A semiconductor integrated circuit device comprising: a supporting substrate, a second device-forming region containing plural passive devices made up of a semiconductor layer or a conductive layer formed on said supporting substrate, a first device-forming region which is formed by grinding a substrate and in which a plurality of logical gates are arrayed, each of said passive devices being connected to an individual one of said logical gates, and an insulating layer formed between said first device-forming region and said second device-forming region and provided with a grinding stop for stopping substrate grinding, said first device-forming region and said second device-forming region being electrically connected to each other at certain regions, wherein said plurality of logical gates formed in said first device-forming region have no region which is not directly opposite said insulating layer from a portion of said passive devices formed in said second device-forming region.
Claim 2
Dependent Claim
147 words
A semiconductor integrated circuit device comprising: a supporting substrate, a second device-forming region containing plural passive devices made up of a semiconductor layer or a conductive layer formed on said supporting substrate, a first device-forming region which is formed by grinding a substrate and in which a plurality of logical gates are arrayed, each of said passive devices being connected to an individual one of said logical gates, and an insulating layer formed between said first device-forming region and said second device-forming region and provided with a grinding stop for stopping substrate grinding, said first device-forming region and said second device-forming region being electrically connected to each other at certain regions, wherein said plurality of logical gates formed in said first device-forming region have no region which is not directly opposite said insulating layer from a portion of said passive devices formed in said second device-forming region.
Claim 3
Dependent Claim
33 words
A semiconductor integrated circuit device as claimed in claim 1 wherein each said logic gate is a MIS transistor and the connected device formed in said second device-forming region is a capacitive element.
Claim 4
Dependent Claim
33 words
A semiconductor integrated circuit device as claimed in claim 1 wherein each said logic gate is a MIS transistor and the connected device formed in said second device-forming region is a resistance element.
Claim 5
Dependent Claim
40 words
A semiconductor integrated circuit device as claimed in claim 1 wherein each said logic gate is a MIS transistor and the connected device formed in said second device-forming region is a combination of a capacitance element and a resistance element.
Claim 6
Dependent Claim
28 words
A semiconductor integrated circuit device as claimed in claims 2, 3 or 4 wherein said MIS transistors are formed on the entire surface of said first device-forming region.