Patent US5367434A successfully refreshed from Google Patents.
US5367434A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Electrical module assembly
Assignee: Motorola Solutions Inc
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Filing: 1993-05-06
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Granted: 1994-11-22
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Expires: 2013-05-06
Abstract
Abstract An electrical module assembly (100) includes a mounting frame (130) having a passage (135) extending though the mounting frame (130). A heat sink (160) is positioned within the passage (135) of the mounting frame (130). A module substrate (120) is located on or near the heat sink (160) such that there is thermal conductivity between the module substrate (120) and the heat sink (160). A heat-generating semiconductor device (122), such as a power amplifier (122), which requires heat dissipation, is positioned on the module substrate (120) such that there is thermal conductivity between the heat-generating semiconductor device and the heat sink (160). Electrical connection to the module substrate (120) is provided through the mounting frame (130).
Inventors
- 👤 Curtis M. Griffin
- 👤 James V. Lauder
- 👤 Leng H. Ooi
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-06 10:29
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/10
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
187 words
A power amplifier module assembly, comprising: a mounting frame having a contoured cavity extending there through, said mounting frame is essentially planar, having first and second opposing sides, said mounting frame having electrical conductors integrally formed therein for electrically connecting portions of the first surface to portions of the second surface, said mounting frame having ground connectors peripherally located thereon; a thermal conductive member formed to fit within the cavity and being positioned within said cavity of said mounting frame; a module substrate having electrical components and electrical circuitry constituting a power amplifier, said module substrate mounted onto said thermal conductive member, said module substrate mounted to said first surface of said mounting frame, said module substrate electrically connected to said electrical conductors on said mounting frame; a heat-generating semiconductor device mounted onto said module substrate such that said heat-generating semiconductor device is thermally connected to said thermal conductive member; and a shield mounted over said module substrate onto said mounting frame, said shield electrically connected to said ground connectors on said mounting frame; wherein the mounting frame provides leadless external electrical interconnections to the module substrate.
Claim 2
Dependent Claim
187 words
A power amplifier module assembly, comprising: a mounting frame having a contoured cavity extending there through, said mounting frame is essentially planar, having first and second opposing sides, said mounting frame having electrical conductors integrally formed therein for electrically connecting portions of the first surface to portions of the second surface, said mounting frame having ground connectors peripherally located thereon; a thermal conductive member formed to fit within the cavity and being positioned within said cavity of said mounting frame; a module substrate having electrical components and electrical circuitry constituting a power amplifier, said module substrate mounted onto said thermal conductive member, said module substrate mounted to said first surface of said mounting frame, said module substrate electrically connected to said electrical conductors on said mounting frame; a heat-generating semiconductor device mounted onto said module substrate such that said heat-generating semiconductor device is thermally connected to said thermal conductive member; and a shield mounted over said module substrate onto said mounting frame, said shield electrically connected to said ground connectors on said mounting frame; wherein the mounting frame provides leadless external electrical interconnections to the module substrate.
Claim 3
Dependent Claim
48 words
A power amplifier module assembly as defined in claim 1, wherein said mounting frame has an inner border defining said contoured cavity with protrusions on said inner border for housing said electrical conductors, and wherein said thermal conductive member has recesses to the protrusions on the inner border.
Claim 4
Dependent Claim
54 words
An power amplifier module assembly as defined in claim 1, further comprising: a support substrate, said support substrate electrically connected to said module substrate via said electrical conductors of said mounting frame; and solder balls attached to said second opposing surface of said mounting frame for mounting said mounting frame to said support substrate.
Claim 5
Dependent Claim
175 words
A radio having an electrical module assembly, comprising: a printed circuit board having an opening therein; a mounting frame leadlessly mounted on the printed circuit board about said opening, the mounting frame having a passage extending there through, said mounting frame is essentially planar, having first and second opposing sides, said mounting frame having electrical conductors integrally formed therein, said mounting frame having ground connectors peripherally located thereon; a thermal conductive member positioned within said passage of said mounting frame; a radio chassis having a portion thermally engaging the thermal conductive member through the opening in the printed circuit board; a module substrate mounted onto said thermal conductive member, said module substrate mounted to said mounting frame, said module substrate electrically connected to said electrical conductors on said mounting frame; a power amplifier mounted onto said module substrate such that said power amplifier is thermally connected to said thermal conductive member; and a shield mounted over said module substrate onto said mounting frame, said shield electrically connected to said ground connectors on said mounting frame.
Claim 6
Dependent Claim
175 words
A radio having an electrical module assembly, comprising: a printed circuit board having an opening therein; a mounting frame leadlessly mounted on the printed circuit board about said opening, the mounting frame having a passage extending there through, said mounting frame is essentially planar, having first and second opposing sides, said mounting frame having electrical conductors integrally formed therein, said mounting frame having ground connectors peripherally located thereon; a thermal conductive member positioned within said passage of said mounting frame; a radio chassis having a portion thermally engaging the thermal conductive member through the opening in the printed circuit board; a module substrate mounted onto said thermal conductive member, said module substrate mounted to said mounting frame, said module substrate electrically connected to said electrical conductors on said mounting frame; a power amplifier mounted onto said module substrate such that said power amplifier is thermally connected to said thermal conductive member; and a shield mounted over said module substrate onto said mounting frame, said shield electrically connected to said ground connectors on said mounting frame.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1997-11-21 | 1998-05-23 | 1998-11-22 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-11-21 | 2002-05-23 | 2002-11-22 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-11-21 | 2006-05-23 | 2006-11-22 | $7700.00 | Window Closed / Lapsed |