Mounting apparatus for electronic device packages

Claim 2

Apparatus mounting an assembly comprising a heat sink and an electronic device package having a plurality of downwardly depending leads on a printed circuit board having a plurality of preformed locations receiving the leads of the electronic device package comprising: (a) frame means defining a cavity receiving the electronic device package having said plurality of downwardly depending leads with said leads extending through said frame means; (b) clip means engaging said heat sink; (c) means securing said clip means to said frame means and urging said heat sink into intimate thermal contact with the electronic device package; and (d) means solderably mounting said frame means on said printed circuit board with the leads of the electronic device package received by said preformed locations on the printed circuit board.

Claim 3

Apparatus as defined in claim 1 wherein said means solderably mounting comprises at least one solderable mounting stud projecting from said frame soldered to a preformed location on the printed circuit board.

Claim 4

Apparatus as defined in claim 1 wherein said means securing said clip means comprises at least one securing member extending through an aperture in said clip means and engaging said frame means to urge the clip means into contact with the heat sink.

Claim 5

Apparatus as defined in claim 3 wherein said means securing said clip means includes a screw threadedly engaging said frame means.

Claim 6

Apparatus mounting a finned heat sink on a gate array package comprising: (a) frame means including a pair of spaced latching members and defining an open cavity receiving said gate array package about the perimeter thereof with the leads of the gate array package extending downwardly through said cavity; (b) solderable mounting means securing said frame means to a preformed location on a printed circuit board; (c) clip means extending between said latching members above said frame means and contacting the heat sink positioned on the gate array package; and (d) means securing said clip means to said latching members urging the heat sink into intimate thermal contact with the gate array package.

Claim 7

Apparatus mounting a finned heat sink on a gate array package comprising: (a) frame means including a pair of spaced latching members and defining an open cavity receiving said gate array package about the perimeter thereof with the leads of the gate array package extending downwardly through said cavity; (b) solderable mounting means securing said frame means to a preformed location on a printed circuit board; (c) clip means extending between said latching members above said frame means and contacting the heat sink positioned on the gate array package; and (d) means securing said clip means to said latching members urging the heat sink into intimate thermal contact with the gate array package.

Claim 8

Apparatus as defined in claim 5 wherein said clip means comprises an elongated body extending across said cavity of said frame means and includes a pair of apertures, and wherein said means securing said clip means comprises a screw located in each of said apertures threadedly engaging said latching members to secure said clip means in intimate thermal contact with the heat sink.

Claim 9

Apparatus as defined in claim 5 wherein said solderable mounting means securing said frame means to said printed circuit board comprises solderable attachment means mounted in each of said latching members.

Claim 10

Apparatus as defined in claim 7 wherein said solderable mounting means comprises a pair of solderable nuts mounted on said latching members and extending downwardly therefrom and soldered to preformed locations on said circuit board and wherein said means securing said clip means are screws threadedly received by the solderable nuts and the clip means is thereby secured to the frame means.

Claim 11

The combination comprising: (a) a printed circuit board; (b) frame means having a cavity and a pair of spaced latching members; (c) a gate array package located in said cavity with a plurality of leads extending downwardly through said cavity and mounted on preformed locations on said printed circuit board; (d) a finned heat sink including a post having one end in contact with an upper surface of the gate array package and a plurality of spaced radially extending fins mounted on said post; (e) clip means extending across said cavity and in contact with said finned heat sink including a pair of spaced apertures aligned with said latching members; (f) securing members extending downwardly through the apertures in said clip means and engaging said latching members to secure said heat sink to said frame means and urge said finned heat sink into intimate thermal contact with said gate array package; and (g) mounting means projecting from said frame means and soldered to preformed locations on said printed circuit board.

Claim 12

The combination comprising: (a) a printed circuit board; (b) frame means having a cavity and a pair of spaced latching members; (c) a gate array package located in said cavity with a plurality of leads extending downwardly through said cavity and mounted on preformed locations on said printed circuit board; (d) a finned heat sink including a post having one end in contact with an upper surface of the gate array package and a plurality of spaced radially extending fins mounted on said post; (e) clip means extending across said cavity and in contact with said finned heat sink including a pair of spaced apertures aligned with said latching members; (f) securing members extending downwardly through the apertures in said clip means and engaging said latching members to secure said heat sink to said frame means and urge said finned heat sink into intimate thermal contact with said gate array package; and (g) mounting means projecting from said frame means and soldered to preformed locations on said printed circuit board.

Claim 13

The combination set forth in claim 9 wherein said mounting means comprises solderable nuts mounted in said frame means.

Claim 14

The combination set forth in claim 9 wherein said mounting means comprises solderable mounting means mounted in said latching members.

Claim 15

The combination set forth in claim 9 wherein said spaced latching members project laterally from said frame means.

Claim 16

The combination comprising: (a) a printed circuit board; (b) frame means having a cavity and a pair of spaced latching members; (c) an electronic device package located in said cavity with a plurality of leads extending downwardly through said cavity and mounted on preformed locations on said printed circuit board; (d) a finned heat sink in contact with a surface of the electronic device package; (e) clip means extending across said cavity and in contact with said finned heat sink including a pair of spaced apertures aligned with said latching members; (f) securing members extending downwardly through the apertures in said clip means and engaging said latching members to secure said heat sink to said frame means and urge said finned heat sink into intimate thermal contact with said electronic device package; and (g) mounting means projecting from said frame means and soldered to preformed locations on said printed circuit board.

Claim 17

The combination comprising: (a) a printed circuit board; (b) frame means having a cavity and a pair of spaced latching members; (c) an electronic device package located in said cavity with a plurality of leads extending downwardly through said cavity and mounted on preformed locations on said printed circuit board; (d) a finned heat sink in contact with a surface of the electronic device package; (e) clip means extending across said cavity and in contact with said finned heat sink including a pair of spaced apertures aligned with said latching members; (f) securing members extending downwardly through the apertures in said clip means and engaging said latching members to secure said heat sink to said frame means and urge said finned heat sink into intimate thermal contact with said electronic device package; and (g) mounting means projecting from said frame means and soldered to preformed locations on said printed circuit board.

Claim 18

The combination set forth in claim 13 wherein said mounting means comprises solderable nuts mounted in said frame means.

Claim 19

The combination set forth in claim 13 wherein said mounting means comprises solderable mounting means mounted in said latching members.

Claim 20

The combination set forth in claim 13 wherein said spaced latching members project laterally from said frame means.

Claim 21

Apparatus for mounting an assembly comprising a heat sink and an electronic device package having a plurality of downwardly depending leads on a printed circuit board having a plurality of preformed locations for receiving the leads of the electronic device package, said apparatus comprising: (a) frame means defining a cavity adapted to receive and position therewithin an electronic device package having a plurality of downwardly depending leads with said leads passing through said cavity and extending from said frame means; (b) clip means adapted to engage a heat sink; (c) means adapted to secure said clip means to said frame means and to urge said heat sink into intimate thermal contact with said electronic device package; and (d) means for solderably mounting said frame means on a printed circuit board with the leads of the electronic device package extending through said cavity received by preformed locations on said printed circuit board.

Claim 22

Apparatus for mounting an assembly comprising a heat sink and an electronic device package having a plurality of downwardly depending leads on a printed circuit board having a plurality of preformed locations for receiving the leads of the electronic device package, said apparatus comprising: (a) frame means defining a cavity adapted to receive and position therewithin an electronic device package having a plurality of downwardly depending leads with said leads passing through said cavity and extending from said frame means; (b) clip means adapted to engage a heat sink; (c) means adapted to secure said clip means to said frame means and to urge said heat sink into intimate thermal contact with said electronic device package; and (d) means for solderably mounting said frame means on a printed circuit board with the leads of the electronic device package extending through said cavity received by preformed locations on said printed circuit board.

Claim 23

Apparatus as defined in claim 17 wherein said means for solderably mounting comprise at least one solderable mounting stud projecting from said frame for soldering to a preformed location on the printed circuit board.

Claim 24

Apparatus as defined in claim 17 wherein said means adapted to secure said clip mans comprises at least one securing member extending through an aperture in said clip means and engaging said frame means to urge the clip means into contact with the heat sink.

Claim 25

Apparatus as defined in claim 19 wherein said means adapted to secure said clip means includes a screw threadedly engaging said frame means.

Claim 26

Apparatus for mounting a finned heat sink on a gate array package, said apparatus comprising: (a) frame means including a pair of spaced latching members and defining an open cavity adapted to receive a gate array package about the perimeter thereof and position said gate array package therewithin with its leads extending downwardly from said cavity; (b) solderable mounting means for securing said frame means to a preformed location on a printed circuit board; (c) clip means extending between said latching members above said frame means and adapted to contact a heat sink positioned on the gate array package; and (d) means for securing said clip means to said latching members to urge said heat sink into intimate thermal contact with said gate array package.

Claim 27

Apparatus for mounting a finned heat sink on a gate array package, said apparatus comprising: (a) frame means including a pair of spaced latching members and defining an open cavity adapted to receive a gate array package about the perimeter thereof and position said gate array package therewithin with its leads extending downwardly from said cavity; (b) solderable mounting means for securing said frame means to a preformed location on a printed circuit board; (c) clip means extending between said latching members above said frame means and adapted to contact a heat sink positioned on the gate array package; and (d) means for securing said clip means to said latching members to urge said heat sink into intimate thermal contact with said gate array package.

Claim 28

Apparatus as defined in claim 21 wherein said clip means comprises an elongated body extending across said cavity of said frame means and includes a pair of apertures, and wherein said means for securing said clip means comprises a screw located in each of said apertures threadedly engaging said latching members to secure said clip means in intimate thermal contact with the heat sink.

Claim 29

Apparatus as defined in claim 21 wherein said solderable mounting means comprises solderable attachment means mounted in each of said latching members.

Claim 30

Apparatus as defined in claim 23 wherein said solderable mounting means comprises a pair of solderable nuts mounted on said latching members and extending downwardly therefrom for soldering to preformed locations on circuit media and wherein said means for securing said clip means are screws threadedly received by the solderable nuts for securing the clip means to the frame means.