Integrated circuit package design having an intermediate die-attach substrate bonded to a leadframe

Claim 1

An integrated-circuit package configuration for packaging an integrated-circuit die, comprising: a leadframe having a plurality of inwardly-extending bonding fingers and a central region, said inwardly-extending bonding fingers disposed peripherally surrounding said central region, an electrically-insulated, heat-conductive die-attach substrate having a first surface disposed in said central region of said leadframe, said integrated-circuit die mounted on said first surface of said die-attach substrate in said central region of said leadframe, said inwardly extending bonding fingers attached to the periphery of said die-attach substrate, such at said integrated circuit die disposed on said first surface in said central region of said die-attach substrate is peripherally surrounded by said inwardly extending bonding fingers, a plurality of electrically conductive, one-piece elongated bonding traces formed on said first surface of said electrically-insulated, heat-conductive die-attach substrate, said conductive, one-piece elongated traces having first and second ends, said first ends of said traces located in said central region, said traces extending from said central region of said die-attach substrate towards said inwardly-extending bonding fingers such that said second ends of said traces are proximate to a respective end of said inwardly-extending bonding fingers, said conductive one-piece elongated traces each providing a respective intermediate attachment area for attachment of respective bonding wires which extend between bonding pads on said integrated-circuit die and said conductive traces, means for electrically connecting each of said bonding traces to a corresponding bonding finger of said leadframe, wherein said means for electrically connecting each of said bonding traces to a corresponding bonding finger of said leadframe includes second bonding wires respectively connected between a bonding trace and a corresponding bonding finger. wherein said conductive traces extend from said central region of said die-attach substrate such that said integrated-circuit die overlies said conductive traces while still providing an exposed portion of said conductive traces as a respective intermediate attachment area for said respective bonding wires.

Claim 8

A method of packaging an integrated-circuit die, comprising the steps of: bonding the ends of the inwardly-extending bonding fingers of a leadframe to the periphery of an electrically-insulated, heat-conductive die-attach substrate; attaching said integrated-circuit die to a central region of said electrically-insulated, heat-conductive die-attach substrate; forming a plurality of electrically conductive, one-piece elongated traces having first and second ends on said die attach substrate with said first ends of said traces disposed in said central region of said die-attach substrate, said traces extending from said central region of said die-attach substrate towards said ends of said inwardly-extending bonding fingers such at said second ends of said traces are disposed proximate to respective inwardly-extending bonding fingers, and such that said integrated-circuit die overlies said conductive traces while still providing an exposed portion of said conductive traces between said integrated-circuit die and said ends of said inwardly-extending bonding fingers as a respective intermediate attachment area for respective bonding wires; attaching respective bonding wires from a first plurality of bonding wires between bonding pads on said integrated-circuit die and one of said plurality of electrically conductive traces by a second plurality of bonding wires, formed on said electrically-insulated, heat-conductive substrate; connecting said bonding fingers of said leadframe and said corresponding electrically conductive traces.

Claim 9

A method of packaging an integrated-circuit die, comprising the steps of: bonding the ends of the inwardly-extending bonding fingers of a leadframe to the periphery of an electrically-insulated, heat-conductive die-attach substrate; attaching said integrated-circuit die to a central region of said electrically-insulated, heat-conductive die-attach substrate; forming a plurality of electrically conductive, one-piece elongated traces having first and second ends on said die attach substrate with said first ends of said traces disposed in said central region of said die-attach substrate, said traces extending from said central region of said die-attach substrate towards said ends of said inwardly-extending bonding fingers such at said second ends of said traces are disposed proximate to respective inwardly-extending bonding fingers, and such that said integrated-circuit die overlies said conductive traces while still providing an exposed portion of said conductive traces between said integrated-circuit die and said ends of said inwardly-extending bonding fingers as a respective intermediate attachment area for respective bonding wires; attaching respective bonding wires from a first plurality of bonding wires between bonding pads on said integrated-circuit die and one of said plurality of electrically conductive traces by a second plurality of bonding wires, formed on said electrically-insulated, heat-conductive substrate; connecting said bonding fingers of said leadframe and said corresponding electrically conductive traces.