Semiconductor device having a plurality of leads

Claim 2

A semiconductor device comprising a semiconductor chip (4, 28, 31) and a plurality of leads (3), the outer ends of the leads projecting from a package (6), characterized in that the inner ends of said leads are located apart from the side of the chip, and that the semiconductor device further comprises a plurality of intermediate leads (12). formed on an insulting supporting sheet (11), the inner ends of said intermediate leads being connected to the electrodes of said chip, the outer ends of said intermediate leads being connected to said inner ends of said leads corresponding to said electrods, and said intermediate leads being made narrower than said leads.

Claim 3

A semiconductor device according to claim 1, wherein said intermediate leads are formed by etching a metal layer formed on an insulating supporting sheet.

Claim 4

A semiconductor device according to claim 1, wherein said supporting sheet is polyimide sheet.

Claim 5

A semiconductor device according to claim 1, wherein said supporting sheet is made of transparent material.

Claim 6

A semiconductor device according to claim 4, wherein said transparent material is glass.

Claim 7

A semiconductor device according to claim 1, wherein said connection is performed by bumps.

Claim 8

A semiconductor device according to claim 6, wherein said bumps are made of solder or gold.

Claim 9

A semiconductor device according to claim 1, wherein said supporting sheet has an opening in the center thereof.

Claim 10

A semiconductor device comprising a semiconductor chip (4) and a plurality of leads (3), the outer ends of said leads projecting from a package (6), characterized in that the inner ends of the leads are located apart from the side of the chip, that the surface of said leads is flush with the surface of the electrodes of the semiconductor chip, and that the semiconductor device further comprises a plurality of intermediate leads (12') formed on an insulating supporting sheet which has an opening (14) in the center thereof, the inner ends protruding from the opening and the outer ends protruding from the side of the semiconductor chip, said intermediate lead being connected to said electrodes of the semiconductor chip and the leads placing said insulating supporting sheet between the intermediate leads and the leads/the substrate of the semiconductor chip.

Claim 11

A semiconductor device comprising a semiconductor chip (4) and a plurality of leads (3), the outer ends of said leads projecting from a package (6), characterized in that the inner ends of the leads are located apart from the side of the chip, that the surface of said leads is flush with the surface of the electrodes of the semiconductor chip, and that the semiconductor device further comprises a plurality of intermediate leads (12') formed on an insulating supporting sheet which has an opening (14) in the center thereof, the inner ends protruding from the opening and the outer ends protruding from the side of the semiconductor chip, said intermediate lead being connected to said electrodes of the semiconductor chip and the leads placing said insulating supporting sheet between the intermediate leads and the leads/the substrate of the semiconductor chip.

Claim 12

A semiconductor device according to claim 9, wherein said semiconductor chip is mounted with its electrodes upward.