US4774635A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor package with high density I/O lead connection
Assignee: Nokia Bell Labs
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Filing: 1986-05-27
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Granted: 1988-09-27
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Expires: 2006-05-27
Abstract
Abstract Disclosed is a semiconductor package which permits coupling of semiconductor bond pads to I/O leads where a high density of connections is needed. Conductive fingers backed by an insulating tape are bonded to the ends of the fingers on a lead frame. The tape fingers are electrically coupled to the bond pads on one major surface of the semiconductor chip by wire bonding. In one embodiment, the opposite major surface of the chip is bonded to a paddle on the lead frame through an aperture in the tape for maximum heat dissipation.
Inventors
- 👤 Lawrence A. Greenberg
- 👤 David J. Lando
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-24 05:38
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/479; H10W70/421; H10W70/435; H10W72/00; H10W72/50; H10W72/541; H10W72/5449; H10W72/90; H10W72/931; H10W72/932; H10W90/00; H10W90/701; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
96 words
A semiconductor device package comprising: a mounting pad; a plurality of first conductive lead frame fingers with one end of each in close lateral proximity to the pad and defining a first gap therebetween; and a plurality of second conductive fingers formed on an insulating tape layer and extending over the gap, one end of said second conductive fingers being bonded to corresponding first conductive fingers and the opposite end of the second conductive fingers terminating in close lateral proximity to the pad to define a second gap therebetween which is less than the first gap.
Claim 2
Dependent Claim
96 words
A semiconductor device package comprising: a mounting pad; a plurality of first conductive lead frame fingers with one end of each in close lateral proximity to the pad and defining a first gap therebetween; and a plurality of second conductive fingers formed on an insulating tape layer and extending over the gap, one end of said second conductive fingers being bonded to corresponding first conductive fingers and the opposite end of the second conductive fingers terminating in close lateral proximity to the pad to define a second gap therebetween which is less than the first gap.
Claim 3
Dependent Claim
37 words
The package according to claim 1 further comprising a semiconductor device with two major surfaces, said device having one major surface bonded to the mounting pad and the opposite major surface including a plurality of bonding pads.
Claim 4
Dependent Claim
23 words
The package according to claim 2 further comprising electrical wire connections between the bonding pads on the device and corresponding second conductive fingers.
Claim 5
Dependent Claim
17 words
The package according to claim 3 wherein the length of the wire is less than 150 mils.
Claim 6
Dependent Claim
25 words
The package according to claim 3 wherein the number of electrical connections between the pads and second conductive fingers is at least 15 per side.
Claim 7
Dependent Claim
19 words
The package according to claim 1 wherein the pitch of the second conductive fingers is less than 16 mils.
Claim 8
Dependent Claim
29 words
The package according to claim 1 wherein a conductive paddle is formed on a plane with the first conductive fingers and the insulating layer is mounted on the paddle.
Claim 9
Dependent Claim
32 words
The package according to claim 7 wherein the insulating layer includes a hole therein so that the mounting pad is defined by the portion of the underlying paddle exposed by said hole.
Claim 10
Dependent Claim
25 words
The package according to claim 1 wherein the mounting pad is formed on the same surface of the insulating layer as the second conductive fingers.
Claim 11
Dependent Claim
27 words
The package according to claim 1 wherein the mounting pad has four sides and there are at least 15 conductive fingers in close proximity to each side.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1991-09-27 | 1992-03-28 | 1992-09-27 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1995-09-27 | 1996-03-28 | 1996-09-27 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1999-09-27 | 2000-03-28 | 2000-09-27 | $7700.00 | Window Closed / Lapsed |