Shielded EPROM package

Claim 2

A shielded monolithic EPROM package, comprising: a circuit carrying substrate having conductive interconnecting patterns on a first surface; an EPROM chip having an optically erasable surface, electrically and mechanically attached to the circuit carrying substrate; an encapsulant material, at least partially transparent to UV light, molded on the circuit carrying substrate and covering the EPROM chip and associated chip interconnections so as to provide an optical path through the encapsulant material to the EPROM erasable surface; an adherent metal coating, at least partially transparent to UV light, applied over the encapsulant material for shielding the semiconductor device from radio frequency energy; and an adherent organic coating, at least partially transparent to UV light, applied over the metal coating.

Claim 3

The shielded monolithic EPROM package according to claim 1, wherein the adherent metal coating comprises a vacuum deposited metal coating.

Claim 4

The shielded monolithic EPROM package of claim 1, wherein the encapsulant material, the adherent metal coating, and the adherent organic coating are substantially transparent to UV light of about 254 nanometer wavelength.

Claim 5

The shielded monolithic EPROM package of claim 3, wherein the encapsulant material is selected from the group consisting of epoxy, polyester, polyetherimide, acrylic, cellulose acetate butyrate, phenolic, polyphenylene oxide, polyphenylene sulfide, polyphenyl sulfone, polyaryl sulfone, polyarylate, polycarbonate, and polyvinyl chloride.

Claim 6

The shielded monolithic EPROM package of claim 1, wherein the circuit carrying substrate comprises a material selected from the group consisting of epoxy, polyimide, polyester, polyetherimide, polyethylene, and polytetrafluoroethylene.

Claim 7

The shielded monolithic EPROM package of claim 1, further comprising solder bumps on a second opposing surface of the substrate, the solder bumps electrically connected to the conductive interconnecting pattern.

Claim 8

The shielded monolithic EPROM package of claim 1, wherein the adherent organic coating is selected from the group consisting of photoresist, azole polymers, benzimidazole, benzotriazole, and substituted imidazoles that form chemically bonded protective coatings to copper.

Claim 9

A shielded monolithic EPROM package including a radio frequency shield for at least one semiconductor device, comprising: a printed circuit substrate having a chip mounting portion and conductive interconnecting patterns on a first side, the interconnecting patterns including pads adjacent to the chip mounting portion; solder bumps on a second opposing side of the printed circuit substrate, the solder bumps electrically connected to the conductive interconnecting pattern; an EPROM chip having an optically erasable surface, the chip mounted on the chip mounting portion, and electrically connected to the pads by means of thin wires; an epoxy resin, at least partially transparent to UV light, transfer molded on the printed circuit substrate and covering the EPROM chip and the thin wires so as to provide an optical path through the epoxy resin to the erasable surface of the EPROM chip, the epoxy resin sealing the EPROM chip from the exterior of the EPROM package; an adherent metal coating, at least partially transparent to UV light, deposited on the epoxy resin and a portion of the printed circuit substrate so as to electrically couple the conductive interconnecting pattern to the adherent metal coating to provide a shield for substantially reducing the ingress or egress of radio frequency signals through the package; and an adherent organic coating, at least partially transparent to UV light, applied over the conductive metal coating, the adherent organic coating selected from the group consisting of photoresist, azole polymers, benzimidazole, benzotriazole, and substituted imidazoles.

Claim 10

A shielded monolithic EPROM package including a radio frequency shield for at least one semiconductor device, comprising: a printed circuit substrate having a chip mounting portion and conductive interconnecting patterns on a first side, the interconnecting patterns including pads adjacent to the chip mounting portion; solder bumps on a second opposing side of the printed circuit substrate, the solder bumps electrically connected to the conductive interconnecting pattern; an EPROM chip having an optically erasable surface, the chip mounted on the chip mounting portion, and electrically connected to the pads by means of thin wires; an epoxy resin, at least partially transparent to UV light, transfer molded on the printed circuit substrate and covering the EPROM chip and the thin wires so as to provide an optical path through the epoxy resin to the erasable surface of the EPROM chip, the epoxy resin sealing the EPROM chip from the exterior of the EPROM package; an adherent metal coating, at least partially transparent to UV light, deposited on the epoxy resin and a portion of the printed circuit substrate so as to electrically couple the conductive interconnecting pattern to the adherent metal coating to provide a shield for substantially reducing the ingress or egress of radio frequency signals through the package; and an adherent organic coating, at least partially transparent to UV light, applied over the conductive metal coating, the adherent organic coating selected from the group consisting of photoresist, azole polymers, benzimidazole, benzotriazole, and substituted imidazoles.

Claim 11

The shielded monolithic EPROM package according to claim 8, wherein the adherent metal coating comprises a vacuum deposited metal coating.

Claim 12

The shielded monolithic EPROM package of claim 8, wherein the epoxy resin is substantially transparent to UV light of about 254 nanometer wavelength.

Claim 13

The shielded monolithic EPROM package of claim 8, wherein the printed circuit substrate comprises a material selected from the group consisting of epoxy, polyimide, polyester, polyetherimide, polyethylene, and polytetrafluoroethylene.

Claim 14

The shielded monolithic EPROM package of claim 8, wherein the printed circuit substrate comprises a glass fiber reinforced rigid member.

Claim 15

The shielded monolithic EPROM package of claim 8, wherein the solder bumps are formed in an array.